KR102530878B1 - 전자파 차폐 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판 - Google Patents

전자파 차폐 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판 Download PDF

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Publication number
KR102530878B1
KR102530878B1 KR1020217015067A KR20217015067A KR102530878B1 KR 102530878 B1 KR102530878 B1 KR 102530878B1 KR 1020217015067 A KR1020217015067 A KR 1020217015067A KR 20217015067 A KR20217015067 A KR 20217015067A KR 102530878 B1 KR102530878 B1 KR 102530878B1
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KR
South Korea
Prior art keywords
adhesive layer
electromagnetic wave
insulating adhesive
wave shielding
shielding film
Prior art date
Application number
KR1020217015067A
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English (en)
Korean (ko)
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KR20210080464A (ko
Inventor
고지 다카미
요시히코 아오야기
겐지 가미노
마사히로 와타나베
Original Assignee
타츠타 전선 주식회사
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Publication of KR20210080464A publication Critical patent/KR20210080464A/ko
Application granted granted Critical
Publication of KR102530878B1 publication Critical patent/KR102530878B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
KR1020217015067A 2018-10-29 2019-10-28 전자파 차폐 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판 KR102530878B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018202932 2018-10-29
JPJP-P-2018-202932 2018-10-29
PCT/JP2019/042153 WO2020090726A1 (ja) 2018-10-29 2019-10-28 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板

Publications (2)

Publication Number Publication Date
KR20210080464A KR20210080464A (ko) 2021-06-30
KR102530878B1 true KR102530878B1 (ko) 2023-05-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217015067A KR102530878B1 (ko) 2018-10-29 2019-10-28 전자파 차폐 필름, 차폐 프린트 배선판의 제조 방법, 및 차폐 프린트 배선판

Country Status (5)

Country Link
JP (1) JP7244534B2 (ja)
KR (1) KR102530878B1 (ja)
CN (1) CN112586103B (ja)
TW (1) TWI771595B (ja)
WO (1) WO2020090726A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741648B (zh) * 2020-06-12 2021-10-01 亞洲電材股份有限公司 覆蓋膜及其製備方法
CN117395977B (zh) * 2023-11-20 2024-03-22 广州方邦电子股份有限公司 一种电磁屏蔽膜及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016157920A (ja) * 2015-12-18 2016-09-01 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
JP2017010995A (ja) * 2015-06-17 2017-01-12 住友電工プリントサーキット株式会社 シールド材、電子部品及び接着シート

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2009200113A (ja) 2008-02-19 2009-09-03 Nitto Denko Corp シールド配線回路基板
JP5308465B2 (ja) 2011-01-28 2013-10-09 タツタ電線株式会社 シールドプリント配線板
JP2013193253A (ja) * 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
CN103763893B (zh) * 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法
JP6381117B2 (ja) * 2014-09-04 2018-08-29 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
CN104332217B (zh) * 2014-10-08 2018-04-10 广州方邦电子股份有限公司 自由接地膜及其制作方法、包含自由接地膜的屏蔽线路板及接地方法
CN107079611A (zh) * 2014-12-05 2017-08-18 拓自达电线株式会社 电磁波屏蔽膜
JP5861790B1 (ja) * 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
JP5871098B1 (ja) * 2015-07-16 2016-03-01 東洋インキＳｃホールディングス株式会社 導電性接着剤層、導電性接着シートおよびプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017010995A (ja) * 2015-06-17 2017-01-12 住友電工プリントサーキット株式会社 シールド材、電子部品及び接着シート
JP2016157920A (ja) * 2015-12-18 2016-09-01 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器

Also Published As

Publication number Publication date
CN112586103A (zh) 2021-03-30
CN112586103B (zh) 2024-07-05
KR20210080464A (ko) 2021-06-30
JPWO2020090726A1 (ja) 2021-11-11
WO2020090726A1 (ja) 2020-05-07
JP7244534B2 (ja) 2023-03-22
TW202017463A (zh) 2020-05-01
TWI771595B (zh) 2022-07-21

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