KR102498153B1 - 기판 보유지지 부재, 기판 보유지지 장치, 기판 처리 장치, 기판 보유지지 방법, 성막 방법, 및 전자 디바이스의 제조 방법 - Google Patents

기판 보유지지 부재, 기판 보유지지 장치, 기판 처리 장치, 기판 보유지지 방법, 성막 방법, 및 전자 디바이스의 제조 방법 Download PDF

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KR102498153B1
KR102498153B1 KR1020200136927A KR20200136927A KR102498153B1 KR 102498153 B1 KR102498153 B1 KR 102498153B1 KR 1020200136927 A KR1020200136927 A KR 1020200136927A KR 20200136927 A KR20200136927 A KR 20200136927A KR 102498153 B1 KR102498153 B1 KR 102498153B1
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KR
South Korea
Prior art keywords
substrate
holding
adhesive
substrate holding
adhesive pad
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KR1020200136927A
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English (en)
Korean (ko)
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KR20210052264A (ko
Inventor
유야 토에
요시유키 시모사코
시게유키 오가와
Original Assignee
캐논 톡키 가부시키가이샤
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Publication of KR20210052264A publication Critical patent/KR20210052264A/ko
Application granted granted Critical
Publication of KR102498153B1 publication Critical patent/KR102498153B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
KR1020200136927A 2019-10-29 2020-10-21 기판 보유지지 부재, 기판 보유지지 장치, 기판 처리 장치, 기판 보유지지 방법, 성막 방법, 및 전자 디바이스의 제조 방법 KR102498153B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019196796A JP7057336B2 (ja) 2019-10-29 2019-10-29 基板保持部材、基板保持装置、基板処理装置、基板保持方法、成膜方法、及び電子デバイスの製造方法
JPJP-P-2019-196796 2019-10-29

Publications (2)

Publication Number Publication Date
KR20210052264A KR20210052264A (ko) 2021-05-10
KR102498153B1 true KR102498153B1 (ko) 2023-02-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200136927A KR102498153B1 (ko) 2019-10-29 2020-10-21 기판 보유지지 부재, 기판 보유지지 장치, 기판 처리 장치, 기판 보유지지 방법, 성막 방법, 및 전자 디바이스의 제조 방법

Country Status (3)

Country Link
JP (1) JP7057336B2 (zh)
KR (1) KR102498153B1 (zh)
CN (1) CN112750744B (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108133A (ja) * 2004-09-30 2006-04-20 Tokyo Electron Ltd 基板搬送装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08294889A (ja) * 1995-04-28 1996-11-12 Murata Mfg Co Ltd 物品移載装置
WO2003075343A1 (en) * 2002-03-05 2003-09-12 Sharp Kabushiki Kaisha Method for holding substrate in vacuum, method for manufacturing liquid crystal display device, and device for holding substrate
JP5268013B2 (ja) * 2009-03-31 2013-08-21 株式会社アルバック 保持装置及び搬送装置
JP2012234882A (ja) * 2011-04-28 2012-11-29 Toray Eng Co Ltd 半導体チップのピックアップ装置
JP2013055093A (ja) * 2011-09-01 2013-03-21 Creative Technology:Kk 粘着チャック装置及びワークの粘着保持方法
JP6080647B2 (ja) * 2013-03-28 2017-02-15 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置
JP6143572B2 (ja) * 2013-06-18 2017-06-07 株式会社Ｓｃｒｅｅｎホールディングス 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法
WO2015083257A1 (ja) * 2013-12-04 2015-06-11 信越エンジニアリング株式会社 貼合デバイスの製造装置
JP6419635B2 (ja) * 2014-04-23 2018-11-07 株式会社アルバック 保持装置、真空処理装置
JP6316181B2 (ja) * 2014-12-18 2018-04-25 東京エレクトロン株式会社 基板保持ステージ
KR102527366B1 (ko) * 2016-10-19 2023-05-02 삼성디스플레이 주식회사 표시 모듈의 박리 방법 및 표시 모듈의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108133A (ja) * 2004-09-30 2006-04-20 Tokyo Electron Ltd 基板搬送装置

Also Published As

Publication number Publication date
JP2021072322A (ja) 2021-05-06
JP7057336B2 (ja) 2022-04-19
CN112750744B (zh) 2023-06-27
CN112750744A (zh) 2021-05-04
KR20210052264A (ko) 2021-05-10

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