KR102470505B1 - 가공 에너지의 제어 방법 및 레이저 가공 장치 - Google Patents

가공 에너지의 제어 방법 및 레이저 가공 장치 Download PDF

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Publication number
KR102470505B1
KR102470505B1 KR1020227027919A KR20227027919A KR102470505B1 KR 102470505 B1 KR102470505 B1 KR 102470505B1 KR 1020227027919 A KR1020227027919 A KR 1020227027919A KR 20227027919 A KR20227027919 A KR 20227027919A KR 102470505 B1 KR102470505 B1 KR 102470505B1
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KR
South Korea
Prior art keywords
processing
energy
color difference
laser
value
Prior art date
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KR1020227027919A
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English (en)
Korean (ko)
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KR20220116580A (ko
Inventor
야스히로 다키가와
히로유키 스즈키
히데노리 후카호리
Original Assignee
미쓰비시덴키 가부시키가이샤
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Publication of KR20220116580A publication Critical patent/KR20220116580A/ko
Application granted granted Critical
Publication of KR102470505B1 publication Critical patent/KR102470505B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
KR1020227027919A 2020-02-21 2020-02-21 가공 에너지의 제어 방법 및 레이저 가공 장치 KR102470505B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/006978 WO2021166209A1 (ja) 2020-02-21 2020-02-21 加工エネルギーの制御方法およびレーザ加工装置

Publications (2)

Publication Number Publication Date
KR20220116580A KR20220116580A (ko) 2022-08-23
KR102470505B1 true KR102470505B1 (ko) 2022-11-25

Family

ID=74200185

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227027919A KR102470505B1 (ko) 2020-02-21 2020-02-21 가공 에너지의 제어 방법 및 레이저 가공 장치

Country Status (4)

Country Link
JP (1) JP6818950B1 (ja)
KR (1) KR102470505B1 (ja)
TW (1) TWI776374B (ja)
WO (1) WO2021166209A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016175120A (ja) * 2015-03-23 2016-10-06 村田機械株式会社 レーザ加工システム、条件補正装置、及びレーザ加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2799080B2 (ja) 1991-03-18 1998-09-17 株式会社日立製作所 レーザ加工方法とその装置並びに透過型液晶素子、配線パターン欠陥修正方法とその装置
JP2001068816A (ja) * 1999-08-24 2001-03-16 Mitsui Mining & Smelting Co Ltd 銅張積層板及びその銅張積層板を用いたレーザー加工方法
US8173931B2 (en) * 2008-06-13 2012-05-08 Electro Scientific Industries, Inc. Automatic recipe management for laser processing a work piece
EP2599577A4 (en) * 2010-07-26 2016-06-15 Hamamatsu Photonics Kk LASER PROCESSING
JP5618769B2 (ja) * 2010-11-04 2014-11-05 トリニティ工業株式会社 樹脂成形体の加飾装置及び加飾方法
FR3010785B1 (fr) * 2013-09-18 2015-08-21 Snecma Procede de controle de la densite d'energie d'un faisceau laser par analyse d'image et dispositif correspondant
TWI483657B (zh) * 2013-11-15 2015-05-01 Unimicron Technology Corp 線路板的鑽孔方法
JP6573122B2 (ja) * 2016-02-25 2019-09-11 株式会社東京精密 ダイシング装置及びダイシング方法
KR102127109B1 (ko) * 2016-07-14 2020-06-26 미쓰비시덴키 가부시키가이샤 기판 계측 장치 및 레이저 가공 시스템
JP6659654B2 (ja) * 2017-11-24 2020-03-04 ファナック株式会社 レーザ加工前に外部光学系の異常を警告するレーザ加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016175120A (ja) * 2015-03-23 2016-10-06 村田機械株式会社 レーザ加工システム、条件補正装置、及びレーザ加工方法

Also Published As

Publication number Publication date
WO2021166209A1 (ja) 2021-08-26
TW202133115A (zh) 2021-09-01
TWI776374B (zh) 2022-09-01
JP6818950B1 (ja) 2021-01-27
JPWO2021166209A1 (ja) 2021-08-26
KR20220116580A (ko) 2022-08-23

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