JPWO2021166209A1 - - Google Patents

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Publication number
JPWO2021166209A1
JPWO2021166209A1 JP2020540651A JP2020540651A JPWO2021166209A1 JP WO2021166209 A1 JPWO2021166209 A1 JP WO2021166209A1 JP 2020540651 A JP2020540651 A JP 2020540651A JP 2020540651 A JP2020540651 A JP 2020540651A JP WO2021166209 A1 JPWO2021166209 A1 JP WO2021166209A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020540651A
Other versions
JP6818950B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP6818950B1 publication Critical patent/JP6818950B1/ja
Publication of JPWO2021166209A1 publication Critical patent/JPWO2021166209A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2020540651A 2020-02-21 2020-02-21 加工エネルギーの制御方法およびレーザ加工装置 Active JP6818950B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/006978 WO2021166209A1 (ja) 2020-02-21 2020-02-21 加工エネルギーの制御方法およびレーザ加工装置

Publications (2)

Publication Number Publication Date
JP6818950B1 JP6818950B1 (ja) 2021-01-27
JPWO2021166209A1 true JPWO2021166209A1 (ja) 2021-08-26

Family

ID=74200185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020540651A Active JP6818950B1 (ja) 2020-02-21 2020-02-21 加工エネルギーの制御方法およびレーザ加工装置

Country Status (4)

Country Link
JP (1) JP6818950B1 (ja)
KR (1) KR102470505B1 (ja)
TW (1) TWI776374B (ja)
WO (1) WO2021166209A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2799080B2 (ja) 1991-03-18 1998-09-17 株式会社日立製作所 レーザ加工方法とその装置並びに透過型液晶素子、配線パターン欠陥修正方法とその装置
JP2001068816A (ja) * 1999-08-24 2001-03-16 Mitsui Mining & Smelting Co Ltd 銅張積層板及びその銅張積層板を用いたレーザー加工方法
US8173931B2 (en) * 2008-06-13 2012-05-08 Electro Scientific Industries, Inc. Automatic recipe management for laser processing a work piece
EP2599577A4 (en) * 2010-07-26 2016-06-15 Hamamatsu Photonics Kk LASER PROCESSING
JP5618769B2 (ja) * 2010-11-04 2014-11-05 トリニティ工業株式会社 樹脂成形体の加飾装置及び加飾方法
FR3010785B1 (fr) * 2013-09-18 2015-08-21 Snecma Procede de controle de la densite d'energie d'un faisceau laser par analyse d'image et dispositif correspondant
TWI483657B (zh) * 2013-11-15 2015-05-01 Unimicron Technology Corp 線路板的鑽孔方法
JP2016175120A (ja) * 2015-03-23 2016-10-06 村田機械株式会社 レーザ加工システム、条件補正装置、及びレーザ加工方法
JP6573122B2 (ja) * 2016-02-25 2019-09-11 株式会社東京精密 ダイシング装置及びダイシング方法
JP6594545B2 (ja) * 2016-07-14 2019-10-23 三菱電機株式会社 基板計測装置およびレーザ加工システム
JP6659654B2 (ja) * 2017-11-24 2020-03-04 ファナック株式会社 レーザ加工前に外部光学系の異常を警告するレーザ加工装置

Also Published As

Publication number Publication date
TWI776374B (zh) 2022-09-01
KR20220116580A (ko) 2022-08-23
TW202133115A (zh) 2021-09-01
WO2021166209A1 (ja) 2021-08-26
KR102470505B1 (ko) 2022-11-25
JP6818950B1 (ja) 2021-01-27

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