KR102430326B1 - 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 - Google Patents
다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 Download PDFInfo
- Publication number
- KR102430326B1 KR102430326B1 KR1020200081390A KR20200081390A KR102430326B1 KR 102430326 B1 KR102430326 B1 KR 102430326B1 KR 1020200081390 A KR1020200081390 A KR 1020200081390A KR 20200081390 A KR20200081390 A KR 20200081390A KR 102430326 B1 KR102430326 B1 KR 102430326B1
- Authority
- KR
- South Korea
- Prior art keywords
- die
- dicing tape
- collet
- movable stage
- stage
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2019-168865 | 2019-09-17 | ||
JP2019168865A JP7377654B2 (ja) | 2019-09-17 | 2019-09-17 | ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210032893A KR20210032893A (ko) | 2021-03-25 |
KR102430326B1 true KR102430326B1 (ko) | 2022-08-08 |
Family
ID=74876585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200081390A KR102430326B1 (ko) | 2019-09-17 | 2020-07-02 | 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7377654B2 (zh) |
KR (1) | KR102430326B1 (zh) |
CN (1) | CN112530834B (zh) |
TW (1) | TWI719896B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005243834A (ja) * | 2004-02-25 | 2005-09-08 | Nitto Denko Corp | コレット及びそれを用いたチップのピックアップ方法 |
JP2008270417A (ja) * | 2007-04-18 | 2008-11-06 | Canon Machinery Inc | 半導体装置の製造装置及び製造方法 |
KR101385443B1 (ko) | 2013-09-13 | 2014-04-16 | 이향이 | 반도체 칩 픽업 이송용 콜렛 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100526193B1 (ko) * | 2003-10-15 | 2005-11-03 | 삼성전자주식회사 | 다이 본더 설비 및 이를 이용한 반도체 칩 부착방법 |
JP2005322815A (ja) | 2004-05-11 | 2005-11-17 | Matsushita Electric Ind Co Ltd | 半導体製造装置および半導体装置の製造方法 |
JP4664150B2 (ja) * | 2005-08-05 | 2011-04-06 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体製造装置 |
JP5054933B2 (ja) * | 2006-05-23 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP4397429B1 (ja) | 2009-03-05 | 2010-01-13 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
JP5284144B2 (ja) | 2009-03-11 | 2013-09-11 | 芝浦メカトロニクス株式会社 | 半導体チップのピックアップ装置及びピックアップ方法 |
KR101562021B1 (ko) * | 2009-08-11 | 2015-10-20 | 삼성전자주식회사 | 반도체 칩 부착 장치 및 반도체 칩 부착 방법 |
JP5813432B2 (ja) * | 2011-09-19 | 2015-11-17 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
JP6349496B2 (ja) | 2014-02-24 | 2018-07-04 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
DE102014107729B4 (de) * | 2014-06-02 | 2022-05-12 | Infineon Technologies Ag | Dreidimensionaler Stapel einer mit Anschlüssen versehenen Packung und eines elektronischen Elements sowie Verfahren zur Herstellung eines solchen Stapels |
JP6018670B2 (ja) | 2015-06-15 | 2016-11-02 | 株式会社東芝 | ダイボンディング装置、および、ダイボンディング方法 |
EP3234992B1 (de) * | 2016-01-29 | 2018-09-26 | JENOPTIK Optical Systems GmbH | Verfahren und vorrichtung zum herauslösen eines mikro-chips aus einem wafer und aufbringen des mikro-chips auf ein substrat |
JP6621771B2 (ja) | 2017-01-25 | 2019-12-18 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6653273B2 (ja) * | 2017-01-26 | 2020-02-26 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6941513B2 (ja) * | 2017-09-07 | 2021-09-29 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6967411B2 (ja) * | 2017-09-19 | 2021-11-17 | ファスフォードテクノロジ株式会社 | 半導体製造装置、半導体装置の製造方法およびコレット |
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2019
- 2019-09-17 JP JP2019168865A patent/JP7377654B2/ja active Active
-
2020
- 2020-05-12 TW TW109115701A patent/TWI719896B/zh active
- 2020-07-02 KR KR1020200081390A patent/KR102430326B1/ko active IP Right Grant
- 2020-08-04 CN CN202010770198.7A patent/CN112530834B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005243834A (ja) * | 2004-02-25 | 2005-09-08 | Nitto Denko Corp | コレット及びそれを用いたチップのピックアップ方法 |
JP2008270417A (ja) * | 2007-04-18 | 2008-11-06 | Canon Machinery Inc | 半導体装置の製造装置及び製造方法 |
KR101385443B1 (ko) | 2013-09-13 | 2014-04-16 | 이향이 | 반도체 칩 픽업 이송용 콜렛 |
Also Published As
Publication number | Publication date |
---|---|
CN112530834B (zh) | 2024-03-08 |
KR20210032893A (ko) | 2021-03-25 |
JP2021048201A (ja) | 2021-03-25 |
TWI719896B (zh) | 2021-02-21 |
CN112530834A (zh) | 2021-03-19 |
TW202113992A (zh) | 2021-04-01 |
JP7377654B2 (ja) | 2023-11-10 |
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