KR102422859B1 - 수지 시트 - Google Patents

수지 시트 Download PDF

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Publication number
KR102422859B1
KR102422859B1 KR1020170038543A KR20170038543A KR102422859B1 KR 102422859 B1 KR102422859 B1 KR 102422859B1 KR 1020170038543 A KR1020170038543 A KR 1020170038543A KR 20170038543 A KR20170038543 A KR 20170038543A KR 102422859 B1 KR102422859 B1 KR 102422859B1
Authority
KR
South Korea
Prior art keywords
resin
layer
resin composition
epoxy resin
manufactured
Prior art date
Application number
KR1020170038543A
Other languages
English (en)
Korean (ko)
Other versions
KR20170113284A (ko
Inventor
시게오 나카무라
쇼헤이 후지시마
치히로 후지와라
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59983103&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102422859(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20170113284A publication Critical patent/KR20170113284A/ko
Application granted granted Critical
Publication of KR102422859B1 publication Critical patent/KR102422859B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020170038543A 2016-03-29 2017-03-27 수지 시트 KR102422859B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016066543A JP6672954B2 (ja) 2016-03-29 2016-03-29 樹脂シート
JPJP-P-2016-066543 2016-03-29

Publications (2)

Publication Number Publication Date
KR20170113284A KR20170113284A (ko) 2017-10-12
KR102422859B1 true KR102422859B1 (ko) 2022-07-21

Family

ID=59983103

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170038543A KR102422859B1 (ko) 2016-03-29 2017-03-27 수지 시트

Country Status (4)

Country Link
JP (1) JP6672954B2 (ja)
KR (1) KR102422859B1 (ja)
CN (1) CN107236252A (ja)
TW (1) TWI721130B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6485672B2 (ja) * 2017-01-26 2019-03-20 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP6859916B2 (ja) * 2017-10-13 2021-04-14 味の素株式会社 樹脂組成物層
JP6919508B2 (ja) * 2017-11-07 2021-08-18 味の素株式会社 樹脂組成物
JP7087780B2 (ja) * 2018-07-26 2022-06-21 味の素株式会社 樹脂組成物
JP7342358B2 (ja) * 2018-12-26 2023-09-12 住友ベークライト株式会社 樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置
JP7255411B2 (ja) * 2019-07-30 2023-04-11 味の素株式会社 樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000230102A (ja) 1999-02-12 2000-08-22 Cosmo Research Inst 低誘電性樹脂組成物
JP2014034668A (ja) * 2012-08-10 2014-02-24 Namics Corp 樹脂組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム
JP2016027097A (ja) 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58163645A (ja) * 1982-03-17 1983-09-28 ユ−オ−ピ−・インコ−ポレイテツド 銅張り積層板の製造方法
JP2000001622A (ja) * 1998-04-16 2000-01-07 Tdk Corp 複合誘電体材料組成物と、これを用いたフィルム、基板、電子部品および成形品
TWI611922B (zh) * 2008-03-25 2018-01-21 Ajinomoto Co., Inc. 絕緣樹脂薄片及使用該絕緣樹脂薄片的多層印刷電路板之製造方法
EP2113534B8 (en) * 2008-04-01 2011-09-21 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and metal-foil-clad laminate
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
WO2012063918A1 (ja) * 2010-11-12 2012-05-18 国立大学法人東北大学 多層配線基板
WO2013047041A1 (ja) * 2011-09-30 2013-04-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び金属箔張り積層板
CN104070737B (zh) * 2012-03-19 2016-08-17 旭化成株式会社 层压板
JP6136330B2 (ja) 2013-02-13 2017-05-31 味の素株式会社 薄型フィルム用樹脂組成物、薄型フィルム、積層シート及び多層プリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000230102A (ja) 1999-02-12 2000-08-22 Cosmo Research Inst 低誘電性樹脂組成物
JP2014034668A (ja) * 2012-08-10 2014-02-24 Namics Corp 樹脂組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム
JP2016027097A (ja) 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
KR20170113284A (ko) 2017-10-12
CN107236252A (zh) 2017-10-10
TW201738311A (zh) 2017-11-01
JP2017177469A (ja) 2017-10-05
JP6672954B2 (ja) 2020-03-25
TWI721130B (zh) 2021-03-11

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