KR102402214B1 - 워크피스를 클램핑하는 시스템 및 방법 - Google Patents

워크피스를 클램핑하는 시스템 및 방법 Download PDF

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Publication number
KR102402214B1
KR102402214B1 KR1020167024703A KR20167024703A KR102402214B1 KR 102402214 B1 KR102402214 B1 KR 102402214B1 KR 1020167024703 A KR1020167024703 A KR 1020167024703A KR 20167024703 A KR20167024703 A KR 20167024703A KR 102402214 B1 KR102402214 B1 KR 102402214B1
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South Korea
Prior art keywords
workpiece
platen
hiv
buried
voltage
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Korean (ko)
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KR20160118347A (ko
Inventor
토시오 우에하라
피터 맥캔
도니 허먼
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트렉 인코포레이티드
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    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
    • H01G7/02—Electrets, i.e. having a permanently-polarised dielectric
    • H01L21/6831—
    • H01L21/6835—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H01L2924/3011—

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
KR1020167024703A 2014-02-07 2015-02-09 워크피스를 클램핑하는 시스템 및 방법 Active KR102402214B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461937050P 2014-02-07 2014-02-07
US61/937,050 2014-02-07
PCT/US2015/015078 WO2015120419A1 (en) 2014-02-07 2015-02-09 System and method for clamping a work piece

Publications (2)

Publication Number Publication Date
KR20160118347A KR20160118347A (ko) 2016-10-11
KR102402214B1 true KR102402214B1 (ko) 2022-05-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167024703A Active KR102402214B1 (ko) 2014-02-07 2015-02-09 워크피스를 클램핑하는 시스템 및 방법

Country Status (12)

Country Link
US (1) US11282732B2 (https=)
EP (1) EP3103127B1 (https=)
JP (1) JP2017512378A (https=)
KR (1) KR102402214B1 (https=)
CN (1) CN106165039B (https=)
DE (1) DE112015000700T5 (https=)
GB (1) GB2540883B (https=)
HK (1) HK1231629A1 (https=)
MY (1) MY174723A (https=)
PH (1) PH12016501425B1 (https=)
SG (1) SG11201605836SA (https=)
WO (1) WO2015120419A1 (https=)

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NL2022780A (en) * 2018-04-12 2019-10-22 Asml Netherlands Bv Apparatus and method
US11073544B2 (en) 2019-05-23 2021-07-27 Advanced Energy Industries, Inc. System and method to measure and adjust a charge of a workpiece
US12523690B2 (en) 2021-03-17 2026-01-13 Advanced Energy Industries, Inc. Capacitance sensing systems and methods
US11610800B2 (en) * 2021-03-22 2023-03-21 Applied Materials, Inc. Capacitive method of detecting wafer chucking and de-chucking
US11817340B2 (en) 2021-04-28 2023-11-14 Advanced Energy Industries, Inc. System and method for improved electrostatic chuck clamping performance
KR102897148B1 (ko) * 2024-06-04 2025-12-09 주식회사 이에스티 커패시턴스 측정 기능을 갖는 정전척 컨트롤러

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP5261852B2 (ja) * 2006-09-12 2013-08-14 独立行政法人産業技術総合研究所 分布量計測方法およびそのための分布量センサを用いた計測システム

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KR960012283A (ko) * 1994-09-30 1996-04-20 가네꼬 히사시 정전척 및 그 제조방법
JP3847363B2 (ja) 1996-02-02 2006-11-22 富士通株式会社 半導体ウェハ処理装置及び半導体ウェハ処理方法
US5708250A (en) * 1996-03-29 1998-01-13 Lam Resarch Corporation Voltage controller for electrostatic chuck of vacuum plasma processors
US5858099A (en) * 1996-04-09 1999-01-12 Sarnoff Corporation Electrostatic chucks and a particle deposition apparatus therefor
CN1224544A (zh) * 1996-04-09 1999-07-28 德尔西斯药品公司 静电吸盘
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JPH1167885A (ja) 1997-08-25 1999-03-09 Nissin Electric Co Ltd 基板保持装置
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Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP5261852B2 (ja) * 2006-09-12 2013-08-14 独立行政法人産業技術総合研究所 分布量計測方法およびそのための分布量センサを用いた計測システム

Also Published As

Publication number Publication date
EP3103127B1 (en) 2021-03-24
SG11201605836SA (en) 2016-08-30
US20170162415A1 (en) 2017-06-08
DE112015000700T5 (de) 2016-11-24
GB2540883A (en) 2017-02-01
GB2540883B (en) 2018-12-26
KR20160118347A (ko) 2016-10-11
EP3103127A4 (en) 2017-06-28
EP3103127A1 (en) 2016-12-14
GB201613425D0 (en) 2017-01-04
WO2015120419A1 (en) 2015-08-13
US11282732B2 (en) 2022-03-22
HK1231629A1 (zh) 2017-12-22
CN106165039A (zh) 2016-11-23
PH12016501425B1 (en) 2020-01-31
MY174723A (en) 2020-05-10
PH12016501425A1 (en) 2017-02-06
CN106165039B (zh) 2019-06-07
JP2017512378A (ja) 2017-05-18

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