KR102401007B1 - 몰드를 사용해서 기판 상의 조성물을 성형하는 성형 장치, 성형 방법 및 물품의 제조 방법 - Google Patents

몰드를 사용해서 기판 상의 조성물을 성형하는 성형 장치, 성형 방법 및 물품의 제조 방법 Download PDF

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KR102401007B1
KR102401007B1 KR1020190044217A KR20190044217A KR102401007B1 KR 102401007 B1 KR102401007 B1 KR 102401007B1 KR 1020190044217 A KR1020190044217 A KR 1020190044217A KR 20190044217 A KR20190044217 A KR 20190044217A KR 102401007 B1 KR102401007 B1 KR 102401007B1
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substrate
molding
composition
gas
moving
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Korean (ko)
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KR20190124643A (ko
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게이지 야마시타
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캐논 가부시끼가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020190044217A 2018-04-26 2019-04-16 몰드를 사용해서 기판 상의 조성물을 성형하는 성형 장치, 성형 방법 및 물품의 제조 방법 Active KR102401007B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018085318A JP7262930B2 (ja) 2018-04-26 2018-04-26 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法
JPJP-P-2018-085318 2018-04-26

Publications (2)

Publication Number Publication Date
KR20190124643A KR20190124643A (ko) 2019-11-05
KR102401007B1 true KR102401007B1 (ko) 2022-05-24

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KR1020190044217A Active KR102401007B1 (ko) 2018-04-26 2019-04-16 몰드를 사용해서 기판 상의 조성물을 성형하는 성형 장치, 성형 방법 및 물품의 제조 방법

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US (1) US11693308B2 (https=)
JP (1) JP7262930B2 (https=)
KR (1) KR102401007B1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12353127B2 (en) 2021-04-14 2025-07-08 Canon Kabushiki Kaisha Imprint apparatus, imprint method and article manufacturing method
JP7676281B2 (ja) * 2021-09-27 2025-05-14 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
JP2023141408A (ja) * 2022-03-24 2023-10-05 キヤノン株式会社 インプリント装置、インプリント方法、コンピュータプログラム、及び、物品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352121A (ja) * 2005-06-13 2006-12-28 Asml Netherlands Bv インプリント・リソグラフィ
JP2012079969A (ja) 2010-10-04 2012-04-19 Canon Inc インプリント方法
JP2018029101A (ja) * 2016-08-16 2018-02-22 キヤノン株式会社 インプリント装置、および物品製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4892026B2 (ja) * 2009-03-19 2012-03-07 株式会社東芝 パターン形成方法
JP2012039057A (ja) 2010-07-13 2012-02-23 Canon Inc インプリント装置及び物品の製造方法
JP5647029B2 (ja) 2011-02-18 2014-12-24 キヤノン株式会社 インプリント装置及び物品の製造方法
KR101249933B1 (ko) * 2011-08-02 2013-04-03 (재)한국나노기술원 임프린트용 마이크로 스탬프를 이용한 마이크로-나노 하이브리드 스탬프 및 그 제조방법
JP5787691B2 (ja) * 2011-09-21 2015-09-30 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6021606B2 (ja) * 2011-11-28 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法、およびインプリント方法
JP2013251462A (ja) * 2012-06-01 2013-12-12 Canon Inc インプリント装置、および、物品の製造方法
JP5776631B2 (ja) * 2012-06-04 2015-09-09 ウシオ電機株式会社 テンプレート洗浄方法、パターン形成方法、光洗浄装置およびナノインプリント装置
JP6294679B2 (ja) 2014-01-21 2018-03-14 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016092198A (ja) 2014-11-04 2016-05-23 キヤノン株式会社 インプリント装置および方法、ならびに物品製造方法
JP6437387B2 (ja) 2015-05-25 2018-12-12 東芝メモリ株式会社 基板平坦化方法
JP6647027B2 (ja) 2015-12-03 2020-02-14 キヤノン株式会社 インプリント装置および物品製造方法
JP6700949B2 (ja) 2016-04-28 2020-05-27 キヤノン株式会社 インプリント方法及び物品の製造方法
JP2017208424A (ja) 2016-05-17 2017-11-24 キヤノン株式会社 インプリント装置、及び物品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352121A (ja) * 2005-06-13 2006-12-28 Asml Netherlands Bv インプリント・リソグラフィ
JP2012079969A (ja) 2010-10-04 2012-04-19 Canon Inc インプリント方法
JP2018029101A (ja) * 2016-08-16 2018-02-22 キヤノン株式会社 インプリント装置、および物品製造方法

Also Published As

Publication number Publication date
KR20190124643A (ko) 2019-11-05
JP2019192821A (ja) 2019-10-31
US20190332007A1 (en) 2019-10-31
JP7262930B2 (ja) 2023-04-24
US11693308B2 (en) 2023-07-04

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