JP7262930B2 - 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法 - Google Patents

型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法 Download PDF

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Publication number
JP7262930B2
JP7262930B2 JP2018085318A JP2018085318A JP7262930B2 JP 7262930 B2 JP7262930 B2 JP 7262930B2 JP 2018085318 A JP2018085318 A JP 2018085318A JP 2018085318 A JP2018085318 A JP 2018085318A JP 7262930 B2 JP7262930 B2 JP 7262930B2
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Japan
Prior art keywords
substrate
molding
mold
composition
supply
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JP2018085318A
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English (en)
Japanese (ja)
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JP2019192821A (ja
JP2019192821A5 (https=
Inventor
敬司 山下
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2018085318A priority Critical patent/JP7262930B2/ja
Priority to KR1020190044217A priority patent/KR102401007B1/ko
Priority to US16/389,811 priority patent/US11693308B2/en
Publication of JP2019192821A publication Critical patent/JP2019192821A/ja
Publication of JP2019192821A5 publication Critical patent/JP2019192821A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2018085318A 2018-04-26 2018-04-26 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法 Active JP7262930B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018085318A JP7262930B2 (ja) 2018-04-26 2018-04-26 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法
KR1020190044217A KR102401007B1 (ko) 2018-04-26 2019-04-16 몰드를 사용해서 기판 상의 조성물을 성형하는 성형 장치, 성형 방법 및 물품의 제조 방법
US16/389,811 US11693308B2 (en) 2018-04-26 2019-04-19 Molding apparatus that molds composition on substrate by using mold, molding method, and manufacturing method of article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018085318A JP7262930B2 (ja) 2018-04-26 2018-04-26 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2019192821A JP2019192821A (ja) 2019-10-31
JP2019192821A5 JP2019192821A5 (https=) 2021-05-20
JP7262930B2 true JP7262930B2 (ja) 2023-04-24

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JP2018085318A Active JP7262930B2 (ja) 2018-04-26 2018-04-26 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法

Country Status (3)

Country Link
US (1) US11693308B2 (https=)
JP (1) JP7262930B2 (https=)
KR (1) KR102401007B1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12353127B2 (en) 2021-04-14 2025-07-08 Canon Kabushiki Kaisha Imprint apparatus, imprint method and article manufacturing method
JP7676281B2 (ja) * 2021-09-27 2025-05-14 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
JP2023141408A (ja) * 2022-03-24 2023-10-05 キヤノン株式会社 インプリント装置、インプリント方法、コンピュータプログラム、及び、物品の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039057A (ja) 2010-07-13 2012-02-23 Canon Inc インプリント装置及び物品の製造方法
JP2015138842A (ja) 2014-01-21 2015-07-30 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016092198A (ja) 2014-11-04 2016-05-23 キヤノン株式会社 インプリント装置および方法、ならびに物品製造方法
JP2016219679A (ja) 2015-05-25 2016-12-22 株式会社東芝 基板平坦化方法および滴下量算出方法
JP2017103399A (ja) 2015-12-03 2017-06-08 キヤノン株式会社 インプリント装置および物品製造方法
JP2017199876A (ja) 2016-04-28 2017-11-02 キヤノン株式会社 インプリント方法及び物品の製造方法
JP2017208424A (ja) 2016-05-17 2017-11-24 キヤノン株式会社 インプリント装置、及び物品の製造方法
JP2018029101A (ja) 2016-08-16 2018-02-22 キヤノン株式会社 インプリント装置、および物品製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7377764B2 (en) * 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
JP4892026B2 (ja) * 2009-03-19 2012-03-07 株式会社東芝 パターン形成方法
JP5828626B2 (ja) * 2010-10-04 2015-12-09 キヤノン株式会社 インプリント方法
JP5647029B2 (ja) 2011-02-18 2014-12-24 キヤノン株式会社 インプリント装置及び物品の製造方法
KR101249933B1 (ko) * 2011-08-02 2013-04-03 (재)한국나노기술원 임프린트용 마이크로 스탬프를 이용한 마이크로-나노 하이브리드 스탬프 및 그 제조방법
JP5787691B2 (ja) * 2011-09-21 2015-09-30 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6021606B2 (ja) * 2011-11-28 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法、およびインプリント方法
JP2013251462A (ja) * 2012-06-01 2013-12-12 Canon Inc インプリント装置、および、物品の製造方法
JP5776631B2 (ja) * 2012-06-04 2015-09-09 ウシオ電機株式会社 テンプレート洗浄方法、パターン形成方法、光洗浄装置およびナノインプリント装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039057A (ja) 2010-07-13 2012-02-23 Canon Inc インプリント装置及び物品の製造方法
JP2015138842A (ja) 2014-01-21 2015-07-30 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016092198A (ja) 2014-11-04 2016-05-23 キヤノン株式会社 インプリント装置および方法、ならびに物品製造方法
JP2016219679A (ja) 2015-05-25 2016-12-22 株式会社東芝 基板平坦化方法および滴下量算出方法
JP2017103399A (ja) 2015-12-03 2017-06-08 キヤノン株式会社 インプリント装置および物品製造方法
JP2017199876A (ja) 2016-04-28 2017-11-02 キヤノン株式会社 インプリント方法及び物品の製造方法
JP2017208424A (ja) 2016-05-17 2017-11-24 キヤノン株式会社 インプリント装置、及び物品の製造方法
JP2018029101A (ja) 2016-08-16 2018-02-22 キヤノン株式会社 インプリント装置、および物品製造方法

Also Published As

Publication number Publication date
KR20190124643A (ko) 2019-11-05
KR102401007B1 (ko) 2022-05-24
JP2019192821A (ja) 2019-10-31
US20190332007A1 (en) 2019-10-31
US11693308B2 (en) 2023-07-04

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