KR102391135B1 - 액체 충전제를 갖는 포로겐을 갖는 연마 패드 - Google Patents

액체 충전제를 갖는 포로겐을 갖는 연마 패드 Download PDF

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KR102391135B1
KR102391135B1 KR1020177001076A KR20177001076A KR102391135B1 KR 102391135 B1 KR102391135 B1 KR 102391135B1 KR 1020177001076 A KR1020177001076 A KR 1020177001076A KR 20177001076 A KR20177001076 A KR 20177001076A KR 102391135 B1 KR102391135 B1 KR 102391135B1
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South Korea
Prior art keywords
porogens
polishing pad
polishing
abandoned
registration fee
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Korean (ko)
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KR20170020446A (ko
Inventor
폴 안드레 레페브레
윌리엄 씨. 앨리슨
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씨엠씨 머티리얼즈, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020177001076A 2014-06-18 2015-06-12 액체 충전제를 갖는 포로겐을 갖는 연마 패드 Active KR102391135B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/307,846 2014-06-18
US14/307,846 US9238294B2 (en) 2014-06-18 2014-06-18 Polishing pad having porogens with liquid filler
PCT/US2015/035662 WO2015195488A1 (en) 2014-06-18 2015-06-12 Polishing pad having porogens with liquid filler

Publications (2)

Publication Number Publication Date
KR20170020446A KR20170020446A (ko) 2017-02-22
KR102391135B1 true KR102391135B1 (ko) 2022-04-28

Family

ID=53487453

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177001076A Active KR102391135B1 (ko) 2014-06-18 2015-06-12 액체 충전제를 갖는 포로겐을 갖는 연마 패드

Country Status (8)

Country Link
US (1) US9238294B2 (https=)
EP (1) EP3157710B1 (https=)
JP (2) JP6810992B2 (https=)
KR (1) KR102391135B1 (https=)
CN (2) CN106470799A (https=)
SG (1) SG11201610140TA (https=)
TW (1) TWI599448B (https=)
WO (1) WO2015195488A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015185815A (ja) * 2014-03-26 2015-10-22 株式会社東芝 研磨パッド、研磨方法、及び半導体装置の製造方法
JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US11964920B2 (en) 2016-08-19 2024-04-23 University Of Massachusetts Nanoporous structures and assemblies incorporating the same
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
DE102018121626A1 (de) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Poliervorrichtung
CN114589620B (zh) * 2020-12-03 2023-05-23 中国科学院微电子研究所 半导体研磨垫及制备方法
CN116847948A (zh) * 2020-12-22 2023-10-03 Cmc材料有限责任公司 具有带有聚合物型外壳的成孔剂的化学-机械抛光副垫
KR102518222B1 (ko) * 2020-12-24 2023-04-05 주식회사 에스엠티 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치
US12472602B2 (en) 2021-09-02 2025-11-18 Cmc Materials Llc Textured CMP pad comprising polymer particles
KR102721631B1 (ko) * 2021-09-17 2024-10-23 에스케이엔펄스 주식회사 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치
KR102764254B1 (ko) * 2022-02-25 2025-02-05 서울대학교산학협력단 리튬 금속 전지용 비수계 전해액 및 이를 포함하는 리튬 금속 전지
US12447581B2 (en) * 2022-07-11 2025-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features
JP2025531359A (ja) * 2022-09-22 2025-09-19 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー ジスルフィド架橋を有する化学機械研磨パッド

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119974A (ja) * 2002-09-17 2004-04-15 Korea Polyol Co Ltd 埋め込まれた液状マイクロエレメントを含有する研磨パッドおよびその製造方法
WO2008013377A1 (en) 2006-07-24 2008-01-31 Skc Co., Ltd. Chemical mechanical polishing pads comprising liquid organic material core encapsulated in polymer shell and methods for producing the same
US20120094586A1 (en) 2010-10-15 2012-04-19 Ping Huang Polishing pad with multi-modal distribution of pore diameters
JP2013089767A (ja) 2011-10-18 2013-05-13 Fujibo Holdings Inc 研磨パッド及びその製造方法
JP2013539233A (ja) 2010-09-30 2013-10-17 ネクスプラナー コーポレイション 渦電流終点検出のための研磨パッド

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2375263A (en) * 1944-06-27 1945-05-08 Carborundum Co Method of making abrasive articles
US3962154A (en) * 1971-06-01 1976-06-08 Standard Oil Company Method for producing an improved molded thermoplastic article
US3922801A (en) * 1973-07-16 1975-12-02 Patrick Thomas Zente Liquid filled orthopedic apparatus
US5147937A (en) * 1990-03-22 1992-09-15 Rohm And Haas Company Process for making controlled, uniform-sized particles in the 1 to 50 micrometer range
US5534023A (en) * 1992-12-29 1996-07-09 Henley; Julian L. Fluid filled prosthesis excluding gas-filled beads
US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US6231942B1 (en) * 1998-01-21 2001-05-15 Trexel, Inc. Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby
JPH11322877A (ja) 1998-05-12 1999-11-26 Dainippon Ink & Chem Inc 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
JP2000344902A (ja) 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
US6718703B2 (en) * 2000-10-03 2004-04-13 Lukley Holdings Pty Ltd. Roofing tile assembly
EP1324858A1 (en) * 2000-10-06 2003-07-09 Cabot Microelectronics Corporation Polishing pad comprising a filled translucent region
US6531523B1 (en) * 2000-10-10 2003-03-11 Renal Tech International, Llc Method of making biocompatible polymeric adsorbing material for purification of physiological fluids of organism
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20050042976A1 (en) * 2003-08-22 2005-02-24 International Business Machines Corporation Low friction planarizing/polishing pads and use thereof
DE10348876B4 (de) * 2003-10-21 2014-04-03 Jnc Corporation Poröse Polyolefinmembran
JP4555559B2 (ja) * 2003-11-25 2010-10-06 富士紡ホールディングス株式会社 研磨布及び研磨布の製造方法
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7435364B2 (en) 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TWI378844B (en) 2005-08-18 2012-12-11 Rohm & Haas Elect Mat Polishing pad and method of manufacture
US20080057844A1 (en) * 2006-02-01 2008-03-06 Fred Miekka Discontinuous Abrasive Surfaces Having Controlled Wear Properties
US20070212985A1 (en) * 2006-03-07 2007-09-13 Boler Lewyn B Jr Wet sanding sponge; system and method for storing and using same
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP4986129B2 (ja) 2007-01-15 2012-07-25 東洋ゴム工業株式会社 研磨パッド
KR101186531B1 (ko) * 2009-03-24 2012-10-08 차윤종 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
AU2011252010A1 (en) * 2010-05-10 2012-12-20 Allergan, Inc. Porous materials, methods of making and uses
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US9067298B2 (en) * 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119974A (ja) * 2002-09-17 2004-04-15 Korea Polyol Co Ltd 埋め込まれた液状マイクロエレメントを含有する研磨パッドおよびその製造方法
US20060125133A1 (en) 2002-09-17 2006-06-15 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
WO2008013377A1 (en) 2006-07-24 2008-01-31 Skc Co., Ltd. Chemical mechanical polishing pads comprising liquid organic material core encapsulated in polymer shell and methods for producing the same
JP2013539233A (ja) 2010-09-30 2013-10-17 ネクスプラナー コーポレイション 渦電流終点検出のための研磨パッド
US20120094586A1 (en) 2010-10-15 2012-04-19 Ping Huang Polishing pad with multi-modal distribution of pore diameters
JP2013539927A (ja) 2010-10-15 2013-10-28 ネクスプラナー コーポレイション 気孔直径の多峰性分布をもつ研磨パッド
JP2013089767A (ja) 2011-10-18 2013-05-13 Fujibo Holdings Inc 研磨パッド及びその製造方法

Also Published As

Publication number Publication date
SG11201610140TA (en) 2017-01-27
JP2020055103A (ja) 2020-04-09
KR20170020446A (ko) 2017-02-22
US20150367478A1 (en) 2015-12-24
US9238294B2 (en) 2016-01-19
TWI599448B (zh) 2017-09-21
EP3157710A1 (en) 2017-04-26
TW201609315A (zh) 2016-03-16
JP2017520422A (ja) 2017-07-27
CN106470799A (zh) 2017-03-01
EP3157710B1 (en) 2021-11-10
JP6810992B2 (ja) 2021-01-13
CN113276016A (zh) 2021-08-20
WO2015195488A1 (en) 2015-12-23

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