KR102386048B1 - 도전성 기판 및 도전성 기판 제조방법 - Google Patents

도전성 기판 및 도전성 기판 제조방법 Download PDF

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Publication number
KR102386048B1
KR102386048B1 KR1020177018299A KR20177018299A KR102386048B1 KR 102386048 B1 KR102386048 B1 KR 102386048B1 KR 1020177018299 A KR1020177018299 A KR 1020177018299A KR 20177018299 A KR20177018299 A KR 20177018299A KR 102386048 B1 KR102386048 B1 KR 102386048B1
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KR
South Korea
Prior art keywords
layer
copper
experimental example
blackening layer
blackening
Prior art date
Application number
KR1020177018299A
Other languages
English (en)
Korean (ko)
Other versions
KR20170105501A (ko
Inventor
유지 다카츠카
료 도가시
고이치 야마기시
에리코 사토
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20170105501A publication Critical patent/KR20170105501A/ko
Application granted granted Critical
Publication of KR102386048B1 publication Critical patent/KR102386048B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/416—Reflective
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
KR1020177018299A 2015-01-20 2016-01-18 도전성 기판 및 도전성 기판 제조방법 KR102386048B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015008913 2015-01-20
JPJP-P-2015-008913 2015-01-20
JP2015090017 2015-04-27
JPJP-P-2015-090017 2015-04-27
PCT/JP2016/051315 WO2016117512A1 (ja) 2015-01-20 2016-01-18 導電性基板、および導電性基板の製造方法

Publications (2)

Publication Number Publication Date
KR20170105501A KR20170105501A (ko) 2017-09-19
KR102386048B1 true KR102386048B1 (ko) 2022-04-14

Family

ID=56417056

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177018299A KR102386048B1 (ko) 2015-01-20 2016-01-18 도전성 기판 및 도전성 기판 제조방법

Country Status (5)

Country Link
JP (1) JP6624078B2 (zh)
KR (1) KR102386048B1 (zh)
CN (1) CN107111408B (zh)
TW (1) TWI701580B (zh)
WO (1) WO2016117512A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018030202A1 (ja) * 2016-08-08 2018-02-15 Dic株式会社 積層体、メタルメッシュ及びタッチパネル
CN108388382B (zh) * 2017-02-03 2020-03-27 群创光电股份有限公司 触控面板及其触控显示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014203418A1 (ja) * 2013-06-19 2014-12-24 凸版印刷株式会社 表示装置用基板および表示装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW513475B (en) * 1999-11-25 2002-12-11 Sumitomo Metal Mining Co Transparent conductive layered structure, display in which this transparent conductive layered structure is applied, and coating liquid for forming transparent conductive layer
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
JP2008311565A (ja) * 2007-06-18 2008-12-25 Dainippon Printing Co Ltd ディスプレイ用複合フィルタ
KR101082223B1 (ko) 2009-08-17 2011-11-09 삼성모바일디스플레이주식회사 이동통신 단말기의 윈도우 결합 구조체
US20110279398A1 (en) * 2010-05-12 2011-11-17 Harald Philipp Touch screen electrode enhancements
KR101221722B1 (ko) * 2011-03-04 2013-01-11 주식회사 엘지화학 전도성 구조체 및 이의 제조방법
KR20130069261A (ko) 2011-12-18 2013-06-26 인포뱅크 주식회사 정보처리 방법 및 시스템과 기록매체
JP2013169712A (ja) * 2012-02-21 2013-09-02 Toray Ind Inc 積層体
JP2013206315A (ja) * 2012-03-29 2013-10-07 Toppan Printing Co Ltd フィルム状タッチパネルセンサー及びその製造方法
EP2767985B1 (en) * 2012-08-31 2016-09-07 LG Chem, Ltd. Conductive structure and method for manufacturing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014203418A1 (ja) * 2013-06-19 2014-12-24 凸版印刷株式会社 表示装置用基板および表示装置

Also Published As

Publication number Publication date
TW201638751A (zh) 2016-11-01
CN107111408A (zh) 2017-08-29
JP6624078B2 (ja) 2019-12-25
KR20170105501A (ko) 2017-09-19
JPWO2016117512A1 (ja) 2017-11-02
WO2016117512A1 (ja) 2016-07-28
TWI701580B (zh) 2020-08-11
CN107111408B (zh) 2020-07-17

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