KR102382019B1 - 폴리이미드 필름, 이의 제조방법, 및 이를 포함한 연성금속박적층판 - Google Patents

폴리이미드 필름, 이의 제조방법, 및 이를 포함한 연성금속박적층판 Download PDF

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Publication number
KR102382019B1
KR102382019B1 KR1020190115014A KR20190115014A KR102382019B1 KR 102382019 B1 KR102382019 B1 KR 102382019B1 KR 1020190115014 A KR1020190115014 A KR 1020190115014A KR 20190115014 A KR20190115014 A KR 20190115014A KR 102382019 B1 KR102382019 B1 KR 102382019B1
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KR
South Korea
Prior art keywords
diamine
dianhydride
polyimide film
mol
amount
Prior art date
Application number
KR1020190115014A
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English (en)
Korean (ko)
Other versions
KR20210033364A (ko
Inventor
김동영
원동영
최정열
Original Assignee
피아이첨단소재 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 피아이첨단소재 주식회사 filed Critical 피아이첨단소재 주식회사
Priority to KR1020190115014A priority Critical patent/KR102382019B1/ko
Priority to PCT/KR2019/014208 priority patent/WO2021054515A1/ko
Priority to JP2022517261A priority patent/JP7375176B2/ja
Priority to CN201980005386.6A priority patent/CN112823181B/zh
Publication of KR20210033364A publication Critical patent/KR20210033364A/ko
Application granted granted Critical
Publication of KR102382019B1 publication Critical patent/KR102382019B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020190115014A 2019-09-18 2019-09-18 폴리이미드 필름, 이의 제조방법, 및 이를 포함한 연성금속박적층판 KR102382019B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020190115014A KR102382019B1 (ko) 2019-09-18 2019-09-18 폴리이미드 필름, 이의 제조방법, 및 이를 포함한 연성금속박적층판
PCT/KR2019/014208 WO2021054515A1 (ko) 2019-09-18 2019-10-25 폴리이미드 필름, 이의 제조방법, 및 이를 포함한 연성금속박적층판
JP2022517261A JP7375176B2 (ja) 2019-09-18 2019-10-25 ポリイミドフィルム、その製造方法、およびこれを含む軟性金属箔積層板
CN201980005386.6A CN112823181B (zh) 2019-09-18 2019-10-25 聚酰亚胺膜、其制备方法以及包括其的柔性覆金属箔层压板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190115014A KR102382019B1 (ko) 2019-09-18 2019-09-18 폴리이미드 필름, 이의 제조방법, 및 이를 포함한 연성금속박적층판

Publications (2)

Publication Number Publication Date
KR20210033364A KR20210033364A (ko) 2021-03-26
KR102382019B1 true KR102382019B1 (ko) 2022-04-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190115014A KR102382019B1 (ko) 2019-09-18 2019-09-18 폴리이미드 필름, 이의 제조방법, 및 이를 포함한 연성금속박적층판

Country Status (4)

Country Link
JP (1) JP7375176B2 (ja)
KR (1) KR102382019B1 (ja)
CN (1) CN112823181B (ja)
WO (1) WO2021054515A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102679927B1 (ko) * 2021-11-01 2024-07-02 피아이첨단소재 주식회사 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법
KR102673464B1 (ko) * 2021-11-16 2024-06-10 피아이첨단소재 주식회사 다층 구조의 폴리이미드 필름 및 이의 제조방법
KR102528769B1 (ko) * 2022-03-30 2023-05-08 피아이첨단소재 주식회사 폴리이미드 필름 및 그 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004068002A (ja) * 2002-06-13 2004-03-04 Du Pont Toray Co Ltd ポリイミド混交フィルムの製造方法およびこれを基材とした金属配線回路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166287A (ja) * 1986-12-27 1988-07-09 住友ベークライト株式会社 フレキシブルプリント回路用基板の製造方法
JP3860359B2 (ja) 1999-04-16 2006-12-20 株式会社カネカ ポリイミドフィルムおよびその製造方法
TWI417323B (zh) * 2005-04-25 2013-12-01 Kaneka Corp 新穎之聚醯亞胺膜及其用途
TWI306874B (en) * 2005-08-24 2009-03-01 Thinflex Corp Polyimide for producing cast-on-copper laminate and method for producing thereof
KR20070058812A (ko) * 2005-12-05 2007-06-11 주식회사 코오롱 폴리이미드 필름
JP2008049486A (ja) 2006-08-22 2008-03-06 Fujikura Ltd 銅張積層板の製造方法、カバーレイの製造方法及びフレキシブルプリント基板の製造方法
KR101404093B1 (ko) * 2009-01-13 2014-06-09 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
KR101142723B1 (ko) * 2009-07-31 2012-05-04 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
JP6373884B2 (ja) * 2016-01-27 2018-08-15 株式会社有沢製作所 ポリイミド樹脂前駆体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004068002A (ja) * 2002-06-13 2004-03-04 Du Pont Toray Co Ltd ポリイミド混交フィルムの製造方法およびこれを基材とした金属配線回路板

Also Published As

Publication number Publication date
CN112823181B (zh) 2023-06-20
JP2022548897A (ja) 2022-11-22
JP7375176B2 (ja) 2023-11-07
CN112823181A (zh) 2021-05-18
KR20210033364A (ko) 2021-03-26
WO2021054515A1 (ko) 2021-03-25

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