KR102380925B1 - Inspection device and inspection method using the same - Google Patents

Abstract

The embodiment includes a seating part having an opening through which a rear surface of a display device including a GIP circuit and a circuit board is exposed; a probe electrically connected to the electrode pad of the circuit board exposed through the opening; a driving unit electrically connecting the probe to an electrode pad of the circuit board; a power supply unit for applying power to the electrode pad of the circuit board through the probe; and a detection unit configured to detect a defective transistor among a plurality of transistors disposed in a GIP circuit connected to the electrode pad of the circuit board, and an inspection method using the same.

Description

Inspection device and inspection method using the same

The embodiment relates to a test apparatus for a GIP circuit and a test method using the same.

The display device includes a data driving circuit that supplies a data signal to data lines of a pixel array, and a gate that sequentially supplies a gate pulse (or scan pulse) synchronized with the data signal to gate lines (or scan lines) of the pixel array. and a driving circuit (or scan driving circuit), a timing controller for controlling a data driving circuit and a gate driving circuit, and the like.

Recently, a technique for embedding a gate driving circuit together with a pixel array in a display panel has been applied. The gate driving circuit built into the display panel may be defined as a GIP (Gate In Panel) circuit or a GIP driver.

Transistors constituting the GIP circuit may be implemented as TFTs of a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) structure. This GIP circuit can be formed at the same time when TFTs of the pixel array are formed. In a display device having a large size such as a television, GIP circuits may be disposed on the left and right sides of a display panel in order to reduce an RC delay of a gate pulse waveform.

Since the GIP circuit is formed on the substrate of the display panel, a defect in the GIP circuit greatly affects the yield of the display panel. However, conventionally, there is no device capable of inspecting the operation of the gate driver in the state of the finished product in which the circuit board is connected to the GIP circuit. Accordingly, there is a problem in that it is impossible to check whether the transistor of the GIP circuit is defective while the circuit board is connected to the GIP circuit.

The embodiment may provide an inspection device capable of inspecting whether a transistor of the GIP circuit is defective in a state in which the circuit board is connected to the GIP circuit.

The problem to be solved in the embodiment is not limited thereto, and it will be said that the purpose or effect that can be grasped from the solving means or embodiment of the problem described below is also included.

An inspection apparatus according to one aspect of the present invention includes: a seating part having an opening through which a rear surface of a display device including a GIP circuit and a circuit board is exposed; a probe electrically connected to the electrode pad of the circuit board exposed through the opening; a driving unit electrically connecting the probe to an electrode pad of the circuit board; a power supply unit for applying power to the electrode pad of the circuit board through the probe; and a detection unit configured to detect a defective transistor among a plurality of transistors disposed in the GIP circuit connected to the electrode pad of the circuit board.

The detector may be a thermal imager that senses the temperatures of the plurality of transistors.

The detection unit may include a test circuit that checks whether the plurality of transistors operate normally.

The test circuit may include a relay switch that sequentially operates the plurality of transistors.

The driving unit may include a frame disposed under the seating unit, a first driving unit movable along the frame, and a second driving unit moving above the frame to electrically connect the probe to the electrode pad of the circuit board. can

and a camera configured to acquire an alignment image of the probe and the electrode pad, and the first driving unit may be adjusted to align the probe and the electrode pad.

A first laser unit for exposing the electrode pad by irradiating a laser to the rear surface of the display device may be included.

A second laser unit for repairing the defective transistor may be included.

A dispenser for applying a resin to the exposed electrode pad may be included.

The electrode pad may include a rotating part that turns the display device over after irradiation with the first laser so that the electrode pad can be connected to the probe.

An inspection method according to one aspect of the present invention includes the steps of electrically connecting an electrode pad exposed on a rear surface of a display device including a GIP circuit and a probe; detecting a defective transistor among a plurality of transistors disposed in the GIP circuit; repairing a defective transistor among the plurality of transistors; and coating a resin on the electrode pad.

exposing the electrode pads by irradiating a laser to a rear surface of the display device including the GIP circuit before the electrically connecting; and rotating the display device to be connectable to the probe.

According to the embodiment, the reliability of the product may be improved by providing an inspection device capable of inspecting whether the transistor of the GIP circuit is defective even when the circuit board is connected to the GIP circuit.

Various and advantageous advantages and effects of the present invention are not limited to the above, and will be more easily understood in the course of describing specific embodiments of the present invention.

1 is a view showing an inspection apparatus according to an embodiment of the present invention,
2A is a view showing the front of a display device having a built-in GIP circuit;
2B is a view showing a rear surface of a display device having a built-in GIP circuit;
3 is a view showing a process of exposing electrode pads of a circuit board by irradiating a laser to the rear surface of the display device;
4 is a view showing a process in which an electrode pad of a circuit board is exposed through an opening of a seating part;
5 is a view showing a process in which an electrode pad of a circuit board and a probe are electrically connected;
6 is a view showing a process of testing a plurality of transistors in the GIP circuit,
7 is a view showing a process of irradiating a laser to a defective transistor,
8 is a view showing a state in which a defective transistor is removed;
9 is a view showing a process of covering the exposed portion of the rear surface of the display device;
10 is a view showing an inspection apparatus according to another embodiment of the present invention,
11 is a plan view of FIG. 10;
12 is a view showing a process of irradiating a laser to the rear surface of the display device;
13 is a view showing a state in which the rear surface of the display device is exposed so that the electrode pads of the circuit board are exposed;
14 is a view showing a rear surface of a display device having a built-in GIP circuit;
15 is a view showing a state in which the rotating part is coupled to the display device;
16 is a view showing a state in which the display device is turned over by the rotating part;
17 is a view showing the configuration of the rotating part,
18 is a view showing a state in which an electrode pad of a circuit board of a display device is electrically connected to a probe;
19 is a view showing a state in which an electrode pad of a circuit board of a display device is electrically connected to a probe and power is applied;
20 is a view showing a process of irradiating a laser to a defective transistor;
21 is a view showing a state in which a defective transistor is removed;
22 is a view showing a state in which the rotating part is coupled to the display device;
23 is a view showing a state in which the display device is turned over by the rotating part;
24 is a view showing a state in which the display device is moved to the lower part of the dispenser;
25 is a view showing a state in which the resin is applied to the rear surface of the display device;
26 is a flowchart of an inspection method according to an embodiment of the present invention.

Since the present invention may have various changes and may have various embodiments, specific embodiments will be illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

Terms including an ordinal number such as second, first, etc. may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being “connected” or “connected” to another component, it may be directly connected or connected to the other component, but it is understood that other components may exist in between. it should be On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that the other element does not exist in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, the embodiment will be described in detail with reference to the accompanying drawings, but the same or corresponding components are given the same reference numerals regardless of reference numerals, and overlapping descriptions thereof will be omitted.

1 is a view showing an inspection device according to an embodiment of the present invention, FIG. 2a is a view showing a front side of a display device having a built-in GIP circuit, and FIG. 2b is a view showing a rear side of a display device having a built-in GIP circuit. 3 is a view showing a process of exposing electrode pads of a circuit board by irradiating a laser to the rear surface of the display device.

1 to 4 , in the inspection apparatus according to the embodiment, an opening 141a through which the rear surface 10b of the display device 10 including the GIP circuit 12 and the circuit board 14 is exposed is formed. The mounting portion 141, the probe electrically connected to the electrode pad 14a of the circuit board 14 exposed through the opening 141a, and a driving unit electrically connecting the probe to the electrode pad 14a of the circuit board 14 (140), a power supply for applying power to the electrode pad 14a of the circuit board 14 through the probe and a plurality of transistors disposed in the GIP circuit 12 connected to the electrode pad 14a of the circuit board 14 A detection unit 133 for detecting a defective transistor may be included.

The seating part 141 is disposed on the support substrate 110 and may be manufactured to have a size in which the display device 10 can be disposed. A frame 142 is disposed under the seating part 141 to electrically connect the electrode pad 14a and the probe to the electrode pad 14a as will be described later.

The first driving module 120 moves the first frame 121 and the first frame 121 in which the first laser unit 123 and the dispenser 124 are disposed forward or backward in a first direction (X-axis direction). The first moving unit 122 is included, and the first laser unit 123 and the dispenser 124 may move in the second direction (Y-axis direction) on the first frame 121 .

The first laser unit 123 may move freely on the upper portion of the seating unit 141 to cut a portion of the display device 10 . In addition, the dispenser 124 may freely move on the upper portion of the seating unit 141 to apply the resin to a portion of the display device 10 . However, if necessary, the first laser unit 123 or the dispenser 124 may be omitted.

The second driving module 130 includes a second frame 131 in which the detector 133 and the second laser unit 134 are disposed, and a second moving unit that moves the second frame 131 forward or backward in a first direction. In addition, the detector 133 and the second laser unit 134 may move in the second direction on the second frame 131 .

The detection unit 133 can freely move on the upper portion of the seating unit 141 to confirm the position of a defective transistor among the transistors of the GIP circuit 12 . In addition, the second laser unit 134 may freely move on the upper portion of the mounting portion 141 to repair a defective transistor. However, if necessary, the detection unit 133 or the second laser unit 134 may be omitted.

The test apparatus according to the embodiment may test whether the GIP circuit 12 built in the OLED display 10 operates normally. However, the present invention is not necessarily limited thereto, and it may be applied to a device for checking whether various display devices 10 other than OLEDs operate normally. Exemplarily, the GIP circuit 12 may be applied to a liquid crystal display device, a micro LED display device, and the like.

2A and 2B , in the display device 10 , the GIP circuit 12 is disposed on the side of the active region 11 and the circuit board 14 is electrically connected to the circuit board 14 by a plurality of electrical wires 15a and 15b. can be connected Specifically, the flexible printed circuit board 16 may be electrically connected to the GIP circuit 12 , and the circuit board 14 may be connected to the flexible printed circuit board 16 . Accordingly, the electrode pads 14a of the circuit board 14 may be respectively connected to the transistors of the GIP circuit 12 . In this case, the flexible printed circuit board 16 may be bent so that the circuit board 14 may be disposed on the rear surface of the display device.

The electrode pad 14a of the circuit board 14 may be a portion electrically connected to the flexible printed circuit board 16 . This connection part may be covered with a protective layer (not shown). Accordingly, the electrode pad 14a can be exposed by removing the protective layer by irradiating the laser on the back surface of the circuit board 14 . In this way, in the state where the electrode pad is exposed, the display device may be provided to the inspection device.

However, the present invention is not necessarily limited thereto, and the electrode pad may be exposed in the inspection apparatus. Referring to FIG. 3 , the electrode pad 14a may be exposed by removing a portion of the circuit board 14 disposed on the rear surface 10b of the display device 10 using the first laser unit 123 . That is, the laser may be irradiated so that only the plurality of electrode pads 14a connected to the GIP circuit 12 are exposed to the outside. The first laser unit 123 may be a CO2 laser, but is not limited thereto, and a type capable of removing the layer protecting the electrode pad may be applied without limitation.

4 is a view showing a process in which the electrode pad of the circuit board is exposed through the opening of the seating part, FIG. 5 is a view showing the process in which the electrode pad of the circuit board and the probe are electrically connected, and FIG. 6 is a plurality of transistors in the GIP circuit A diagram showing the testing process.

Referring to FIG. 4 , the seating part 141 may include an opening 141a through which the electrode pad 14a of the display device 10 is exposed. The display device 10 may be disposed on the seating portion 141 in a state in which the electrode pad 14a is exposed on the rear surface 10b.

The driving unit 143 includes a first driving unit 144 movable along the frame 142 disposed below the seating unit 141 , and moving upward to move the probe 147 to the electrode pad 14a of the circuit board 14 . ) and may include a second driving unit 145 electrically connected to the. The probe 147 may include a plurality of probe pins 147a electrically connected to the electrode pad 14a.

According to an embodiment, the first driving unit 144 may move to a lower portion of the electrode pad 14a. The first driving unit 144 is not particularly limited as long as it has a configuration capable of moving the probe 147 to the lower portion of the electrode pad 14a. For example, the first driving unit 144 may move the probe 147 using a motor and a gear. Alternatively, the first driving unit 144 may be provided with a moving means such as a conveyor belt.

5 and 6 , the second driving unit 145 may raise the support plate 146 on which the probe 147 is disposed. The second driving unit 145 may be a motor or a cylinder member, but in addition, various elevating means may be applied.

The camera 148 disposed on the support plate 146 may check whether the probe 147 and the electrode pad 14a are aligned. The controller 181 may determine whether the probe 147a of the probe 147 and the electrode pad 14a are aligned based on the alignment image obtained by the camera 148 .

Although the position of the camera 148 is illustrated as being disposed on the side of the probe 147 , the present invention is not limited thereto and may be variously disposed at a position where an alignment image can be easily obtained.

When it is determined that the probe 147a of the probe 147 and the electrode pad 14a are not aligned, the control unit 181 finely moves the first driving unit 144 or the second driving unit 145 to move the probe ( 147) and the electrode pad 14a may be aligned.

When it is determined that the probe 147 and the electrode pad 14a are aligned, the second driver 145 may raise the probe 147 so that the probe 147 and the electrode pad 14a are electrically connected. When power is supplied from the power source 182 while the probe 147 and the electrode pad 14a are connected, power may be applied to the plurality of transistors 12a to 12e built in the GIP circuit 12 . In this case, a defective transistor among the plurality of transistors 12a to 12e may generate heat higher than a predetermined reference value.

Accordingly, the controller 181 may determine that the transistor that generates heat higher than a predetermined reference value is defective through the thermal image acquired by the detector 133 . For example, it may be detected that heat higher than a reference value is generated in the first transistor 12a and the fourth transistor 12d.

However, the present invention is not necessarily limited thereto, and a method for detecting a bad transistor may be variously modified. Exemplarily, instead of the thermal imaging camera, the test circuit 149 may be connected to determine whether there is a defect.

The test circuit 149 may have a built-in relay switch to sequentially apply power to the plurality of transistors 12a to 12e to detect whether they operate normally. These test circuits can be applied to various transistor test circuits in use without limitation.

7 is a view showing a process of irradiating a laser to a defective transistor, FIG. 8 is a view showing a state in which the defective transistor is removed, and FIG. 9 is a view showing a process of covering the exposed portion of the rear surface of the display device.

Referring to FIGS. 7 and 8 , first, the first laser unit 123 may be moved to the upper portion of the defective transistor region and the defective transistor may be removed by irradiating the laser. When the laser is irradiated by the first laser unit 123 , the bezel part and the polarizing plate pol part in the panel may be removed. The first laser unit 123 may be a CO2 laser, but is not limited thereto. Exemplarily, when the first transistor 12a and the fourth transistor 12d among the plurality of transistors 12a to 12e are defective, the bezel portion and the polarizing plate pol portion may be removed by irradiating a laser only to a corresponding region.

Thereafter, a repair operation may be performed by the second laser unit 134 . The second laser unit 134 may repair the circuit by irradiating laser light in a wavelength band of 256 nm. For example, if the first transistor 12a is short-circuited with a neighboring transistor (or wiring) and the like and a defect occurs, the short-circuited portion may be removed and repaired.

Such a repair method may be applied without limitation to a circuit repair method of an existing LCD or OLED device. In addition, if necessary, only the detection of the defective transistor may be performed, or only the removal of the defective transistor may be performed.

Referring to FIG. 9 , when the inspection is completed, the dispenser 124 may apply a resin to the rear surface of the circuit board 14 to which the electrode pads 14a are exposed and mold the resin. Accordingly, the exposed electrode pad 14a can be protected again. The type of the resin is not particularly limited, but a type similar to the material of the removal area may be selected.

According to the embodiment, the circuit board 14 of the display device 10 is partially removed to expose the electrode pad 14a, and power is applied to the electrode pad 14a to detect and repair a defective transistor, and then re-circuit the circuit. A resin may be applied to the substrate 14 to fill the exposed area.

10 is a view showing an inspection device according to another embodiment of the present invention, FIG. 11 is a plan view of FIG. 10, FIG. 12 is a view showing a process of irradiating a laser to the rear surface of the display device, and FIG. 13 is a display device is a view showing a state in which the rear surface of the circuit board is exposed and the electrode pad of the circuit board is exposed, and FIG. 14 is a view showing the rear surface of the display device having a built-in GIP circuit.

10 and 11 , in the test apparatus according to the embodiment, the rotating part 150 may be disposed between the first driving module 120 and the second driving module 130 . The first driving module 120 includes a first frame 121 in which the first laser unit 123 and the dispenser 124 are disposed, and a first moving unit ( 122 , the first laser unit 123 and the dispenser 124 may move in the second direction on the first frame 121 .

The second driving module 130 includes a second frame 131 in which the detection unit 133 and the second laser unit 134 are disposed and a second moving unit ( 132 , the detector 133 and the second laser unit 134 may move in the second direction on the second frame 131 .

According to an embodiment, a loading region in which the display substrate is loaded and the electrode pad is exposed, a rotation region in which the display substrate is turned over, and a repair region in which a defective transistor is repaired may be included. The loading area may be performed by the first driving module 120 , the rotation area may be performed by the rotating unit 150 , and the repair area may be performed by the second driving module 130 .

12 to 14 , the first laser unit 123 irradiates a laser to the circuit board 14 disposed on the rear surface 10b of the display device to expose the electrode pads 14a of the circuit board 14 . can do it The type of the first laser unit 123 is not particularly limited. That is, the laser may be irradiated so that only the plurality of electrode pads 14a connected to the GIP circuit 12 are exposed. Exemplarily, the first laser may be a CO2 laser.

The electrode pad 14a of the circuit board 14 may be a portion electrically connected to the flexible printed circuit board 16 . This connection part may be covered with a protective layer (not shown). Accordingly, the electrode pad 14a can be exposed by removing the protective layer by irradiating the laser on the back surface of the circuit board 14 .

15 is a view showing a state in which the rotating unit is coupled to the display device, FIG. 16 is a view showing a state in which the display device is turned over by the rotating unit, and FIG. 17 is a view showing the configuration of the rotating unit.

15 and 16 , the rotating unit 150 may be coupled to the display device 10 to rotate the display device 10 . Accordingly, the display device 10 may rotate so that the front surface 10a faces upward.

Referring to FIG. 17 , the rotating unit 150 includes a first coupling unit 151 coupled to the display device 10 and a rotating shaft 152 coupled between the first coupling unit 151 and the second coupling unit 153 . and an elevating unit 154 for elevating and lowering the second coupling unit 153 . However, the present invention is not limited thereto, and various rotational structures in which the front surface 10a or the rear surface 10b of the display device 10 can be turned over may be applied to the rotation unit 150 .

18 is a view showing a state in which electrode pads of a circuit board of a display device are electrically connected to a probe, and FIG. 19 is a view showing a state in which power is applied by electrode pads of a circuit board of a display device being electrically connected to a probe. , FIG. 20 is a view showing a process of irradiating a laser to a defective transistor, and FIG. 21 is a view showing a state in which the defective transistor is removed.

18 to 20 , the electrode pad of the circuit board 14 of the display device 10 may be electrically connected to the probe 147 . When power is applied through the probe 147 , power may be applied to a plurality of transistors built in the GIP circuit 12 . In this case, a defective transistor among the plurality of transistors may generate heat higher than a predetermined reference value.

Accordingly, the controller 181 may determine that the transistor that generates heat higher than a predetermined reference value is defective through the thermal image acquired by the detector 133 .

However, the present invention is not necessarily limited thereto, and a method for detecting a bad transistor may be variously modified. Exemplarily, a test circuit may be connected instead of the thermal imaging camera to determine whether there is a defect.

Referring to FIG. 21 , the defective transistor may be removed by first moving the first laser unit 123 to the upper portion of the defective transistor region and irradiating the laser. When the laser is irradiated by the first laser unit 123 , the bezel part and the polarizing plate pol part in the panel may be removed. The first laser unit 123 may be a CO2 laser, but is not limited thereto.

Thereafter, a repair operation may be performed by the second laser unit 134 . The second laser unit 134 may repair the circuit by irradiating laser light in a wavelength band of 256 nm. For example, if a defective transistor is short-circuited with a neighboring transistor (or wiring) and the like, and the defect has occurred, the short-circuited portion may be removed and repaired.

Such a repair method may be applied without limitation to a circuit repair method of an existing LCD or OLED device. In addition, if necessary, only the detection of the defective transistor may be performed, or only the removal of the defective transistor may be performed.

22 is a view showing a state in which the rotating part is coupled to the display device, FIG. 23 is a view showing a state in which the display device is turned over by the rotating part, and FIG. 24 is a view showing a state in which the display device is moved to the lower part of the dispenser, 25 is a view showing a state in which a resin is applied to the rear surface of the display device.

22 to 24 , the rotating unit 150 may be disposed under the dispenser 124 of the first driving module 120 after rotating the rear surface 10b of the display device 10 to face upward. there is. Referring to FIG. 25 , a resin may be applied to the rear surface 10b of the display device 10 to which the electrode pad 14a is exposed and then molded. The type of the resin is not particularly limited, but a type similar to the material of the removal area may be selected.

26 is a flowchart of an inspection method according to an embodiment of the present invention.

Referring to FIG. 26 , the inspection method according to the embodiment electrically connects the electrode pad 14a exposed on the rear surface 10b of the display device 10 including the GIP circuit 12 and the probe 147 . Step S110, detecting a defective transistor among the plurality of transistors disposed in the GIP circuit 12 (S120), repairing the defective transistor among the plurality of transistors (S130), and on the electrode pad 14a It may include a step (S140) of applying a resin to the.

Before the step of electrically connecting, the step of exposing the electrode pad 14a by irradiating a laser to the rear surface 10b of the display device 10 including the GIP circuit 12 and displaying the electrode pad 14a so as to be connectable with the probe 147 The step of inverting the device 10 may further include.

In the step of exposing the electrode pad 14a, the first laser unit 123 irradiates a laser to the circuit board 14 disposed on the rear surface 10b of the display device to thereby irradiate the electrode pad 14a of the circuit board 14. can be exposed. The type of the first laser unit 123 is not particularly limited. That is, the laser may be irradiated so that only the plurality of electrode pads 14a connected to the GIP circuit 12 are exposed. Exemplarily, the first laser may be a CO2 laser.

In the step (S110) of electrically connecting the electrode pad 14a and the probe 147 to the electrode 147, the probe 147 is moved to the lower part of the seating part 141 by the driving part 143 as shown in FIGS. 4 and 5 . It may be coupled to the pad 14a. However, the present invention is not limited thereto, and as shown in FIGS. 18 and 19 , the display device 10 may move to an upper portion of the probe 147 to be coupled thereto.

In the step of detecting the defective transistor ( S120 ), the electrode pad of the circuit board 14 of the display device 10 may be electrically connected to the probe 147 . When power is applied through the probe 147 , power may be applied to a plurality of transistors built in the GIP circuit 12 . In this case, a defective transistor among the plurality of transistors may generate heat higher than a predetermined reference value.

Accordingly, the controller 181 may determine that the transistor that generates heat higher than a predetermined reference value is defective through the thermal image acquired by the detector 133 .

In the step of repairing the defective transistor ( S130 ), the defective transistor may be removed by first moving the first laser unit 123 to the upper portion of the defective transistor region and irradiating the laser. When the laser is irradiated by the first laser unit 123 , the bezel part and the polarizing plate pol part in the panel may be removed. The first laser unit 123 may be a CO2 laser, but is not limited thereto.

Thereafter, a repair operation may be performed by the second laser unit 134 . The second laser unit 134 may repair the circuit by irradiating laser light in a wavelength band of 256 nm. For example, if the defective transistor is short-circuited with a neighboring transistor (or wiring) and the like, and a defect has occurred, the short-circuited portion may be removed and repaired.

Such a repair method may be applied without limitation to a circuit repair method of an existing LCD or OLED device. In addition, if necessary, only the detection of the defective transistor may be performed, or only the removal of the defective transistor may be performed.

In the step of applying the resin on the electrode pad 14a ( S140 ), the resin may be applied to the rear surface 10b of the display device 10 to which the electrode pad 14a is exposed and then molded. The type of the resin is not particularly limited, but a type similar to the material of the removal area may be selected.

In the above, the embodiment has been mainly described, but this is only an example and does not limit the present invention, and those of ordinary skill in the art to which the present invention pertains are not exemplified above in the range that does not depart from the essential characteristics of the present embodiment. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be implemented by modification. And differences related to such modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (11)

a seating part having an opening through which a rear surface of a display device including a GIP circuit and a circuit board is exposed;
a probe electrically connected to the electrode pad of the circuit board exposed through the opening;
a driving unit electrically connecting the probe to an electrode pad of the circuit board;
a power supply unit for applying power to the electrode pad of the circuit board through the probe;
a detection unit configured to detect a defective transistor among a plurality of transistors disposed in the GIP circuit connected to the electrode pad of the circuit board; and
Inspection apparatus including a dispenser for applying a resin to the exposed electrode pad.
According to claim 1,
The detector is a thermal imaging device that detects the temperatures of the plurality of transistors.
According to claim 1,
and the detection unit includes a test circuit that tests whether the plurality of transistors operate normally.
According to claim 1,
The driving unit includes a first driving unit movable along a frame disposed under the seating unit, and a second driving unit electrically connecting the probe to the electrode pad of the circuit board by elevating the probe.
5. The method of claim 4,
A camera for obtaining an alignment image of the probe and the electrode pad,
The first driving unit is adjusted to align the probe and the electrode pad.
According to claim 1,
and a first laser unit irradiating a laser to a rear surface of the display device to expose the electrode pad.
According to claim 1,
and a second laser unit for repairing the defective transistor.
delete 7. The method of claim 6,
and a rotating part that turns the display device over so that the electrode pad can be connected to the probe.
electrically connecting an electrode pad exposed on a rear surface of a display device including a GIP circuit and a probe;
detecting a defective transistor among a plurality of transistors disposed in the GIP circuit;
repairing a defective transistor among the plurality of transistors; and
Inspection method comprising the step of applying a resin on the electrode pad.
11. The method of claim 10,
Before the step of electrically connecting,
The inspection method further comprising exposing the electrode pad by irradiating a laser to the rear surface of the display device including the GIP circuit.

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