KR20120079900A - Inspection method and apparatus of substrate - Google Patents

Abstract

PURPOSE: A substrate test method and apparatus are provided to shorten inspection time by controlling a lot inspection in order to match with tact time of a sampling inspection or a process. CONSTITUTION: An indentation impression crack inspection table(200) inspects an indentation impression inspection and a crack inspection at the same time. The indentation impression inspection inspects the state of a conduction ball attached to a substrate. The crack inspection inspects cracks of a portion of the substrate in which a tap is attached. A tap align inspection table(300) is included in one housing(100). The tap align inspection table completely inspects tap align. An indentation impression inspection camera and a crack inspection camera are installed at the align inspection table.

Description

Substrate inspection method and apparatus {INSPECTION METHOD AND APPARATUS OF SUBSTRATE}

The present invention relates to a method and apparatus for inspecting a substrate, and more particularly, to improve inspection of indentations, tab alignment, and cracks of a substrate at a time, in particular, an improved substrate inspection method for inspecting all substrates of various sizes; Relates to a device.

In general, a substrate is an element of an image display device, and includes a flat panel display (FPD) including a semiconductor substrate.

The FPD substrate includes a liquid crystal display (LCD) substrate, a plasma display panel (PDP) substrate, organic light emitting diodes (OLED), and the like.

For example, to illustrate the manufacturing process by exemplifying an LCD, a substrate is largely manufactured through a TFT process, a cell process, and a module process.

Among these, the module process is a process of assembling a product to an LCD substrate and assembling it into a product. The process of attaching a driver IC for driving the LCD substrate to the LCD substrate is performed.

In order to perform this process, a technique of mounting a lead of a driver IC directly on an LCD substrate has been used.

However, as LCD products become higher resolution in recent years, it is not easy to mount a driver IC having a large number of leads on the LCD substrate, so it is common to use one mounting technology, Tape Automated Bonding (TAB).

Strictly speaking, TAB is a kind of Tape Carrier Package (TCP), which is bonded to an LCD substrate using a tape formed with a pattern instead of a lead frame. Packaging technology), but also refers to a tape, or an entire area of the tape, which is pressed and attached to a corresponding position on the LCD substrate to form a signal line on the LCD substrate.

Before the tab is attached to the LCD substrate, an anisotropic conductive film (ACF) is usually used preferentially for the LCD substrate.

The anisotropic conductive film has a structure like a double-sided tape in which an adhesive cured by heat and fine conductive balls are mixed therein, and is a representative material used for mounting. In particular, conductive balls are intended for electrical conduction of circuits having finely spaced electrodes. It is a kind of connector that connects using heat and pressure.

When the anisotropic conductive film is adhered to the corresponding position on the LCD substrate, the tab is then attached to the surface of the anisotropic conductive film, wherein the electrode pattern of the tab and the electrode pattern of the LCD substrate must be attached correctly and ensure conductivity to the LCD substrate and the tab. The conductive balls used for the purpose must also be correctly positioned.

When the anisotropic conductive film and the tab are attached to the LCD substrate, a sufficient pressure is applied at a high temperature so that the pads of the circuit patterns of the LCD substrate and the tab contact each other.

At this time, the conductive ball in the anisotropic conductive film of the abutting portion is broken, and the electricity is passed between the two pads, and the remaining adhesive is filled and cured on the uneven surface other than the two pad portions to complete the tab attaching process.

After the tab attaching process is completed, the LCD substrate has a crimping tab, including a denting test for inspecting whether the electrode pattern of the tab and the electrode pattern of the LCD substrate are correctly attached and the shape and location of the conductive balls. Crack inspection is performed to check whether cracks have occurred in the LCD substrate.

In the prior art, the indentation test and the crack test are carried out through an indentation tester and a crack tester which respectively perform the corresponding test.

Both the indentation test and the crack test have a similar configuration in that they check for indentation and cracks in the tap area. The indentation tester has an auto focusing function and an area camera fixed in place and And a stage for mounting the LCD substrate to be inspected thereon, and a driving unit for rotating the stage as well as moving the stage at regular intervals.

Thus, when the LCD substrate is seated on the top of the stage, the driving unit allows the indentation inspection on the tab to be performed by the fixed area camera while moving the stage by the tab spacing of the LCD substrate.

In addition, the crack inspector, in contrast to the indentation inspector described above, has a structure that inspects whether the LCD substrate is cracked with respect to the tab area while moving the camera while the stage is fixed.

However, in the prior art, although the indentation inspection and the crack inspection are performed in a similar manner, the indentation inspector and the crack inspector cannot be integrated into a single device because there is a big difference in the way of moving the stage and the camera. In addition to the decrease in efficiency, the productivity decreases due to an increase in the tact time, and unnecessary peripheral devices such as moving the boards with two testers have to be attached. There was a problem causing.

In order to improve this, Patent No. 0797571 shows an example in which the indentation and crack inspection can be performed in one device.

However, the disclosed technology discloses only one configuration for inspecting indentations and cracks in one device, but a description of a device configuration and a method for inspecting tab alignment at a time is not disclosed. It was.

In the case of the indentation test and the crack test, the sampling test is performed, while the tap alignment test requires a full test, so the tact time or the process process is different so that the test can be performed at once in one device. Because it was not easy.

The present invention was created in view of the limitations of the prior art as described above to solve this problem, but it is possible to inspect the indentation, crack, tab alignment inspection, which is the most important inspection at the same time in a single device, In addition to inspecting substrates of the same size, control can be made to match the tact time or process process of all inspections and sampling inspections to reduce inspection time, increase inspection efficiency, reduce costs through integration of equipment, and improve productivity. Its main purpose is to provide a substrate inspection method and apparatus which can be improved.

The present invention is a means for achieving the above object, the indentation crack provided for sampling inspection of the indentation inspection for inspecting the state of the conductive ball attached to the substrate and the crack inspection for inspecting the crack of the portion of the substrate to which the tab is attached An inspection table; A substrate inspection method for performing a sampling inspection and a total inspection in parallel by using a substrate inspection apparatus provided in one housing with a tab alignment inspection table for full inspection of a tab alignment; A first step of setting an order of objects to be subjected to sampling inspection among inspection target substrates waiting to be stacked in order; A second step in which the target substrates to be subjected to the full inspection in the first step are loaded after being conveyed to the tab alignment inspection, and the total inspection is simultaneously performed on three sides of the substrate; When the inspection order of the sampling inspection target substrate is performed during the second step, the sampling inspection target substrate is returned after being loaded into the indentation crack inspection rod and loaded. A third step of sampling inspection of the indentation inspection and the crack inspection in the form of inline inspection; A fourth step in which the sampling inspection target substrate, which has undergone the indentation inspection and the crack inspection through the third step, is conveyed to the tap alignment inspection zone and then loaded, and subjected to a total inspection in the same manner as the second step; And a fifth step of unloading the substrates having completed the second and fourth steps.

In this case, in the first step, the substrate to be sampled and inspected is also set to one sheet per sheet from the top layer in the stacking order.

In addition, the present invention provides an indentation crack inspection table provided for simultaneously sampling inspection of the indentation inspection for inspecting the state of the conductive ball attached to the substrate and the crack inspection for inspecting the crack of the substrate portion to which the tab is attached; A substrate inspection apparatus comprising a tab alignment inspection table for inspecting the tab alignment in one housing, wherein the indentation inspection and the crack inspection are sampled and inspected by the substrate, and the tab alignment inspection is performed by the whole inspection; The indentation crack test stand has a substrate holder that is rotated by a drive source to rotate the loaded substrate; The indentation inspection camera and the crack inspection camera installed on the indentation crack inspection table are installed in an inline form to inspect one side of the substrate, and the crack inspection camera is installed in advance along the inspection direction; The tab alignment inspection table includes a tab alignment inspection camera, in which two tab alignment inspection cameras are formed in a pair so that the substrate holder for fixing the loaded substrate and three sides of the substrate can be simultaneously examined. The inspection camera also provides a substrate inspection apparatus, characterized in that three sets are installed to correspond to three sides of the substrate.

In addition, the present invention provides an indentation crack inspection table provided for simultaneously sampling inspection of the indentation inspection for inspecting the state of the conductive ball attached to the substrate and the crack inspection for inspecting the crack of the substrate portion to which the tab is attached; A substrate inspection apparatus comprising a tab alignment inspection table for inspecting the tab alignment in one housing, wherein the indentation inspection and the crack inspection are sampled and inspected by the substrate, and the tab alignment inspection is performed by the whole inspection; The indentation crack test stand has a substrate holder that is rotated by a drive source to rotate the loaded substrate; The indentation inspection camera and the crack inspection camera installed on the indentation crack inspection table are installed in an inline form to inspect one side of the substrate, and the crack inspection camera is installed in advance along the inspection direction; The tab alignment inspection table includes a substrate holder and a tab alignment inspection camera which are rotated by a driving source so as to rotate the loaded substrate, and the tab alignment inspection camera has two sets to inspect one side of the substrate. It also provides a substrate inspection device, characterized in that installed in the form of in line (in line).

In addition, both ends of the substrate holder is characterized in that it is possible to change the length in the form of a telescope can be fixed to a substrate of various sizes.

According to the present invention, it is possible to perform all the indentation inspection, crack inspection, tab alignment inspection of the substrate with one equipment, and to inspect the substrate of various sizes, thereby increasing the inspection efficiency and reducing the inspection time. The effect of improving productivity can be obtained.

1 and 2 are exemplary views showing an example of a device configuration for explaining a substrate inspection method according to the present invention.
3 to 5 are exemplary views of an optical system for performing a substrate inspection method according to the present invention.
6 is an explanatory view showing a substrate inspection method according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in Figs. 1 and 2, the present invention includes a housing 100 capable of an integrated test so that the indentation test, the crack test and the tab alignment test can be performed all at once in one device.

At this time, the bottom surface of the housing 100 is provided with a plurality of moving wheels 110 so as to easily move the housing 100, set in a moved place after the movement and then fixed and at the same time for horizontal adjustment Fixing member 120 is provided with a screw fastened to enable height adjustment.

In addition, a base plate 130 on which a substrate inspection table is mounted is installed in the housing 100. The base plate 130 is provided through the bottom surface and the insulator 140 of the housing 100 for safety and stability. It is isolated.

In addition, the upper surface of the base plate 130, the indentation crack inspection table 200 for performing the indentation inspection and crack inspection at intervals from each other, and the tab alignment inspection table 300 for performing the tab alignment (Tab Align) inspection Is installed.

Here, the indentation crack test stand 200 is well described in the prior art Patent Publication No. 0797571, the indentation test and crack test proceeds in a similar manner and because the test pattern for sampling test is similar to one test table Although it can be integrated inside, it is difficult to integrate with one test because it is difficult to integrate with the indentation test or crack test because the tab alignment inspection is different and must be fully inspected in the past, but in the present invention, a separate inspection table should be provided. (100) Integrate them or install them in close proximity to improve the efficiency of the equipment, and to implement the common inspection of sampling inspection and full inspection, it is configured to perform the inspection without the tactic or process loss.

In addition, the reason why the indentation test and the crack test should be a sampling test and the tap alignment test should be a full test is as follows.

In other words, if the tabs are not aligned, the electrodes formed on the substrate and the electrical connection parts of the electronic parts are shifted from each other. Even though the conductive balls are pressed to complete the substrate in this state, the conduction state is not completely made. Will be less reliable.

On the other hand, indentations or cracks are derived after the tabs are correctly aligned, so if the tab alignment is good, the indentations or cracks do not immediately cause fatal problems. Since it is sufficient to secure reliability through inspection, the concept of this inspection method (a combination of sampling inspection and full inspection) was completed by the applicant for a more efficient inspection, and the concept itself was firstly filed by the applicant. .

However, more specific studies have been required for specific embodiments, and the present invention further embodies such embodiments.

At this time, the indentation inspection is to take a photograph of the substrate 400 using the differential interference microscope optical system shown in Figure 3, expressing the protruding portion and the entering portion of the conductive ball in a specific pattern of contrast, indentation inspection of the expressed image After acquiring with the camera 410, the digital image is transmitted through a frame grabber, such as a PC, and the transmitted image is transferred to a specific pattern of conductive ball, that is, an ACF tape through a machine vision algorithm. This is a test that detects the quality of the conductive ball by detecting the thermocompression state of the conductive ball (Tab Out Lead, IC ball bump conductive ball indentation, strength, distribution, etc.).

In addition, the crack inspection is performed by using the reflective optical system shown in FIG. 4 to determine whether fine cracks are generated at the portion where the tab 430 of the substrate 400 adheres to light irradiated from light sources installed at both sides of the crack inspection camera 420. Refers to a check to determine whether it is.

In this case, the crack inspection may be inspected by a line scan method.

In addition, as shown in FIG. 5, the tab alignment inspection is performed by capturing both ends of the tab 430 attached to the substrate 400 using the tab alignment inspection camera 440 to determine whether the tab 430 is properly aligned. Refers to the test to check the status of.

Here, as shown in FIG. 1, the indentation inspection camera 410 and the crack inspection camera 420 installed on the indentation crack inspection table 200 is configured to be movable in the inline, crack inspection camera 420 is preceded It is set to.

On the other hand, the tab alignment inspection camera 440 installed on the tab alignment inspection table 300 is preferably installed on all three sides so that the tab 430 attached to the three sides of the substrate 400 can be inspected at once. This is because the indentation crack test uses a sampling test method as described above, but the tap alignment test uses a full test method to prevent tax time or process loss during coincidence and match them.

In this case, the indentation crack test stand 200 is provided with a substrate fixing table 450 which is rotated by a driving source such as a driving motor, and fixed to the substrate fixing table 450 to work while rotating it. By taking the indentation inspection camera 410 and the crack inspection camera 440 is installed in an inline form has a structure that can be operated.

Of course, in the case of the tab alignment inspection table 300, the tab alignment inspection camera 440 is provided as in the case of the indentation crack inspection by providing a rotatable substrate fixing table 450 such as the indentation crack inspection table 200 and rotating the substrate 400. ) May be installed in an inline form, but it is preferable to configure the above form for the inspection efficiency.

The substrate 400 from the indentation crack test stand 200 to the tab alignment test stand 300 is not illustrated in detail, but a well-known multi-axis robot may be used or a worker may perform it manually, or necessary. According to the guide table can be configured to be configured to be transported, these configurations are performed in many industries, so a detailed description thereof will be omitted.

In addition, the substrate holder 450 is configured to be able to draw in and out in the telescope form fixed portion (not shown) of the left and right ends fixing the substrate 400 is configured to firmly fix the substrate 400 by size For example, the size of the substrate 400 is preferably configured to accommodate all 26 inches, 32 inches, 40 inches, 55 inches and the like.

In this case, the size of the substrate 400 is not necessarily limited to each inch presented above, it can be varied within the range, and it is natural that the design can be changed to accommodate larger inches.

The present invention having such a configuration is to perform the substrate inspection in the following manner.

As shown in the above-described drawings and FIG. 6, a first step of setting the substrates to be the sampling inspection target among the substrates 400 waiting for the inspection is performed first.

At this time, it is preferable from the viewpoint of the inspection efficiency that the target substrates to be subjected to the total inspection are selected to be disposed on the top, and that the substrates to be the sampling inspection are subjected to the sampling inspection during the entire inspection.

When the substrates to be sampled and inspected are set through the first step, the inspection is started.

In the inspection process, the substrates that are not the sampling inspection object, that is, the substrates that are subject to the total inspection (all substrates are subjected to the total inspection at the time of the tab alignment inspection) are returned to the tab alignment inspection table 300 in the housing 100. After loading the tap alignment inspection table 300, a second step of performing a tap alignment inspection is performed.

In this case, the tab alignment inspection may be performed by collectively inspecting the tabs 430 attached to three sides of the substrate 400 using the tab alignment inspection camera 440 described above.

Of course, the sides of the substrate holder 450 may be rotated as necessary.

Here, since the tab alignment inspection camera 440 installed on each side is to inspect the alignment, that is, the alignment of the tab 430, two tab alignment inspection cameras 440 must be inspected in a pair. Should be.

When the order of inspecting the substrate to be sampled is performed while the second step is being performed, the substrate is conveyed to the indentation crack test stand 200 and loaded on the indentation crack test stand 200, and the subordinated board of the second step is performed. It is conveyed to the tab alignment inspection table 300 so as to carry out the process and loaded on the tab alignment inspection table 300.

Thus, the sampling inspection target substrate transferred to the indentation crack test stand 200 is rotated while being fixed on the substrate holder 450 on the indentation crack test stand 200, and the conductive ball indentations or tabs 430 on the substrate 400 are rotated one by one. A third step of inspecting a substrate crack or the like of the attached portion is performed.

For example, assuming that 10 substrates are to be inspected, if 1 sheet is set to perform sampling inspection every 3 sheets, 2 sheets, which are the 1st and 2nd inspection target substrates, go directly to the 5th step after performing the 1st and 2nd steps. However, one sheet, which is the third inspection target substrate, is performed after the third step and then proceeds to the fifth step after the subsequent step.

In other words, it is possible to satisfy both the sampling inspection and the total inspection by performing the tab alignment inspection after the indentation inspection and the crack inspection for every third substrate.

According to the experimental example, in order to prevent process loss and to meet the tact time, it is confirmed that sampling inspection is performed every third substrate, but this may vary depending on the size of the substrate, and thus it is not necessarily limited thereto.

In this way, the fourth step of inspecting the tab alignment after the substrate passed through the third step to the tab alignment inspection table 300 is performed.

In addition, the substrate on which the fourth step is performed is unloaded, waiting or returned for processing the subsequent process.

As described above, in the present invention, the sampling loss and the total inspection are effectively paralleled and efficiently controlled, thereby reducing the process loss and increasing the productivity.

100: housing 110: moving wheel
120: fixed base 130: base plate
140: insulator 200: indentation crack test table
300: tab alignment inspection table 400: substrate
410: indentation inspection camera 420: crack inspection camera
430: tab 440: tab alignment inspection camera
450: substrate holder

Claims (5)

An indentation crack test table provided to simultaneously sample and inspect an indentation test for inspecting a state of the conductive ball attached to the substrate and a crack test for inspecting cracks in the portion of the substrate to which the tab is attached; A substrate inspection method for performing a sampling inspection and a total inspection in parallel by using a substrate inspection apparatus provided in one housing with a tab alignment inspection table for full inspection of a tab alignment;
A first step of setting an order of objects to be subjected to sampling inspection among inspection target substrates waiting to be stacked in order;
A second step in which the target substrates to be subjected to the full inspection in the first step are loaded after being conveyed to the tab alignment inspection, and the total inspection is simultaneously performed on three sides of the substrate;
When the inspection order of the sampling inspection target substrate is performed during the second step, the sampling inspection target substrate is returned after being loaded into the indentation crack inspection rod, and the substrate is rotated again after one side of the substrate is inspected in an inline manner. A third step of sampling inspection of the indentation inspection and the crack inspection in the form of inline inspection;
A fourth step in which the sampling inspection target substrate, which has undergone the indentation inspection and the crack inspection through the third step, is conveyed to the tap alignment inspection zone and then loaded, and subjected to a total inspection in the same manner as the second step;
And a fifth step of unloading the substrates having completed the second and fourth steps.
The method according to claim 1;
In the first step, the substrate to be sampled inspection is set to one sheet every few sheets from the top layer in the stacking order.
An indentation crack test table provided to simultaneously sample and inspect an indentation test for inspecting a state of the conductive ball attached to the substrate and a crack test for inspecting cracks in the portion of the substrate to which the tab is attached; A substrate inspection apparatus comprising a tab alignment inspection table for inspecting the tab alignment in one housing, wherein the indentation inspection and the crack inspection are sampled and inspected by the substrate, and the tab alignment inspection is performed by the whole inspection;
The indentation crack test stand has a substrate holder that is rotated by a drive source to rotate the loaded substrate;
The indentation inspection camera and the crack inspection camera installed on the indentation crack inspection table are installed in an inline form to inspect one side of the substrate, and the crack inspection camera is installed in advance along the inspection direction;
The tab alignment inspection table includes a tab alignment inspection camera, in which two tab alignment inspection cameras are formed in a pair so that the substrate holder for fixing the loaded substrate and three sides of the substrate can be simultaneously examined. Inspection camera is a substrate inspection apparatus, characterized in that three sets are installed to correspond to each of the three sides of the substrate.
An indentation crack test table provided to simultaneously sample and inspect an indentation test for inspecting a state of the conductive ball attached to the substrate and a crack test for inspecting cracks in the portion of the substrate to which the tab is attached; A substrate inspection apparatus comprising a tab alignment inspection table for inspecting the tab alignment in one housing, wherein the indentation inspection and the crack inspection are sampled and inspected by the substrate, and the tab alignment inspection is performed by the whole inspection;
The indentation crack test stand has a substrate holder that is rotated by a drive source to rotate the loaded substrate;
The indentation inspection camera and the crack inspection camera installed on the indentation crack inspection table are installed in an inline form to inspect one side of the substrate, and the crack inspection camera is installed in advance along the inspection direction;
The tab alignment inspection table includes a substrate holder and a tab alignment inspection camera which are rotated by a driving source so as to rotate the loaded substrate, and the tab alignment inspection camera has two sets to inspect one side of the substrate. Substrate inspection apparatus, characterized in that installed in the form of inline (in line).
The method according to claim 3 or 4;
Both ends of the substrate fixing unit is variable in length in the form of a telescope substrate inspection apparatus, characterized in that configured to be able to fix the substrate of various sizes.

Images