KR102378350B1 - 기판 액 처리 장치 및 기판 액 처리 방법 - Google Patents
기판 액 처리 장치 및 기판 액 처리 방법 Download PDFInfo
- Publication number
- KR102378350B1 KR102378350B1 KR1020150081944A KR20150081944A KR102378350B1 KR 102378350 B1 KR102378350 B1 KR 102378350B1 KR 1020150081944 A KR1020150081944 A KR 1020150081944A KR 20150081944 A KR20150081944 A KR 20150081944A KR 102378350 B1 KR102378350 B1 KR 102378350B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrates
- wafer
- substrate
- holding
- substrate holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H01L21/02052—
-
- H01L21/67051—
-
- H01L21/67057—
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2014-128617 | 2014-06-23 | ||
| JP2014128617A JP6189257B2 (ja) | 2014-06-23 | 2014-06-23 | 基板液処理装置及び基板液処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150146397A KR20150146397A (ko) | 2015-12-31 |
| KR102378350B1 true KR102378350B1 (ko) | 2022-03-23 |
Family
ID=55129084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150081944A Active KR102378350B1 (ko) | 2014-06-23 | 2015-06-10 | 기판 액 처리 장치 및 기판 액 처리 방법 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6189257B2 (https=) |
| KR (1) | KR102378350B1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6645900B2 (ja) | 2016-04-22 | 2020-02-14 | キオクシア株式会社 | 基板処理装置および基板処理方法 |
| CN107086188B (zh) * | 2016-09-09 | 2020-07-03 | 深圳市新纶科技股份有限公司 | 一种晶元清洗装置 |
| CN109994402B (zh) * | 2017-12-29 | 2021-04-06 | 山东华光光电子股份有限公司 | 一种半导体研磨板上芯片清洗容器及其使用方法 |
| JP6985957B2 (ja) | 2018-02-21 | 2021-12-22 | キオクシア株式会社 | 半導体処理装置 |
| JP7336956B2 (ja) * | 2019-10-10 | 2023-09-01 | 東京エレクトロン株式会社 | 基板処理システム、及び基板処理方法 |
| CN111085498A (zh) * | 2019-12-23 | 2020-05-01 | 南安泊阅工业设计有限公司 | 一种晶圆洗边系统 |
| CN112371611B (zh) * | 2020-10-13 | 2022-02-01 | 江苏亚电科技有限公司 | 一种无篮晶圆清洗装置 |
| JP7539818B2 (ja) | 2020-11-11 | 2024-08-26 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4828503B1 (https=) | 1970-12-28 | 1973-09-01 | ||
| JP2539042B2 (ja) * | 1989-06-13 | 1996-10-02 | 富士通株式会社 | ウエハキャリア |
| JPH03232229A (ja) * | 1990-02-07 | 1991-10-16 | Mitsubishi Electric Corp | 半導体基板の洗浄装置およびその洗浄方法 |
| JPH04151833A (ja) * | 1990-10-16 | 1992-05-25 | Nippon Steel Corp | シリコンウエハ洗浄方法 |
| JP2598360B2 (ja) * | 1992-11-26 | 1997-04-09 | 株式会社スガイ | 基板の洗浄装置 |
| JPH0817782A (ja) * | 1994-06-28 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JPH0845887A (ja) * | 1994-07-29 | 1996-02-16 | Nippon Steel Corp | ウェハ洗浄方法 |
| JPH09181042A (ja) * | 1995-12-21 | 1997-07-11 | Nec Corp | ウェット処理装置 |
| JP3510463B2 (ja) * | 1997-11-10 | 2004-03-29 | 東京エレクトロン株式会社 | 基板の整列装置及び整列方法 |
| KR101210263B1 (ko) * | 2006-12-07 | 2012-12-10 | 주식회사 케이씨텍 | 기판 가이드 및 이를 구비하는 기판 세정 장치 |
| JP5599754B2 (ja) | 2010-05-31 | 2014-10-01 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、およびこの基板処理方法を実行するためのコンピュータプログラムが記録された記録媒体 |
-
2014
- 2014-06-23 JP JP2014128617A patent/JP6189257B2/ja active Active
-
2015
- 2015-06-10 KR KR1020150081944A patent/KR102378350B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016009729A (ja) | 2016-01-18 |
| KR20150146397A (ko) | 2015-12-31 |
| JP6189257B2 (ja) | 2017-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102378350B1 (ko) | 기판 액 처리 장치 및 기판 액 처리 방법 | |
| KR102502045B1 (ko) | 기판 처리 장치 | |
| KR101353782B1 (ko) | 기판 처리 장치, 기판 반송 방법 및 프로그램을 포함하는 컴퓨터 판독 가능한 매체 | |
| KR102429748B1 (ko) | 기판 처리 장치 | |
| KR102531960B1 (ko) | 기판 액 처리 장치, 기판 액 처리 방법 및 기억 매체 | |
| US9346084B2 (en) | Liquid processing apparatus and liquid processing method | |
| KR102298084B1 (ko) | 액 공급 유닛, 기판 처리 장치 및 기판 처리 방법 | |
| KR20190055003A (ko) | 기판 처리 장치의 세정 장치 및 세정 방법 | |
| KR102530228B1 (ko) | 기판 액처리 장치 및 기판 액처리 방법, 및 기판 액처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체 | |
| CN112470252A (zh) | 清洗半导体硅片的装置及方法 | |
| KR101910803B1 (ko) | 기판처리장치 | |
| JP6144236B2 (ja) | 基板処理方法、記憶媒体及び基板処理装置 | |
| JP2021010033A (ja) | 基板処理装置 | |
| TW202343644A (zh) | 基板處理系統及基板處理方法 | |
| JP6328538B2 (ja) | 基板液処理装置の洗浄方法、記憶媒体及び基板液処理装置 | |
| KR20140112299A (ko) | 기판처리장치 | |
| US20080163900A1 (en) | Ipa delivery system for drying | |
| JP5952007B2 (ja) | 基板処理装置および基板処理方法 | |
| JP5986900B2 (ja) | 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 | |
| US20080236615A1 (en) | Method of processing wafers in a sequential fashion | |
| KR20130015637A (ko) | 기판처리장치 | |
| JP4936793B2 (ja) | 洗浄装置および洗浄方法、ならびにコンピュータ読取可能な記憶媒体 | |
| KR100892089B1 (ko) | 웨이퍼 세정 처리장치 | |
| JPH11192459A (ja) | 基板水洗方法および該方法を使用する基板処理装置 | |
| KR20150144449A (ko) | 기판 처리 장치 및 이의 세정 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 5 |