KR102346712B1 - 무연땜납합금 및 땜납접합부 - Google Patents

무연땜납합금 및 땜납접합부 Download PDF

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Publication number
KR102346712B1
KR102346712B1 KR1020217036760A KR20217036760A KR102346712B1 KR 102346712 B1 KR102346712 B1 KR 102346712B1 KR 1020217036760 A KR1020217036760 A KR 1020217036760A KR 20217036760 A KR20217036760 A KR 20217036760A KR 102346712 B1 KR102346712 B1 KR 102346712B1
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South Korea
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mass
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solder alloy
lead
free solder
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Korean (ko)
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KR20210149831A (ko
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데쓰로 니시무라
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가부시키가이샤 니혼슈페리어샤
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
KR1020217036760A 2019-04-11 2020-04-10 무연땜납합금 및 땜납접합부 Active KR102346712B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-075946 2019-04-11
JP2019075946 2019-04-11
PCT/JP2020/016201 WO2020209384A1 (ja) 2019-04-11 2020-04-10 鉛フリーはんだ合金及びはんだ接合部

Publications (2)

Publication Number Publication Date
KR20210149831A KR20210149831A (ko) 2021-12-09
KR102346712B1 true KR102346712B1 (ko) 2021-12-31

Family

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KR1020217036760A Active KR102346712B1 (ko) 2019-04-11 2020-04-10 무연땜납합금 및 땜납접합부

Country Status (17)

Country Link
US (1) US11839937B2 (https=)
EP (1) EP3828294B1 (https=)
JP (1) JP6804126B1 (https=)
KR (1) KR102346712B1 (https=)
CN (2) CN112513300A (https=)
BR (1) BR112021020323B1 (https=)
CA (1) CA3136585C (https=)
ES (1) ES2938369T3 (https=)
HU (1) HUE061181T2 (https=)
IL (1) IL287143B2 (https=)
MX (1) MX2021002203A (https=)
MY (1) MY191908A (https=)
PH (1) PH12021552086A1 (https=)
PL (1) PL3828294T3 (https=)
PT (1) PT3828294T (https=)
TW (1) TWI819210B (https=)
WO (1) WO2020209384A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7835370B2 (ja) * 2020-09-30 2026-03-25 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部
EP4335941A4 (en) 2021-05-06 2024-10-30 Nihon Superior Co., Ltd. LEAD-FREE SOLDER PASTE
JP7161140B1 (ja) * 2022-07-22 2022-10-26 千住金属工業株式会社 はんだ合金、はんだボール、はんだペーストおよびはんだ継手
CN117940248A (zh) 2022-08-24 2024-04-26 株式会社田村制作所 软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置
CN115383349B (zh) * 2022-10-09 2023-11-07 云南锡业集团（控股）有限责任公司研发中心 微合金化调控微观结构获得高韧性无铅锡铋焊料的方法
EP4656751A1 (en) 2023-01-24 2025-12-03 Tamura Corporation Solder alloy, joint part, joining material, solder paste, joint structure, and electronic control device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2681742B2 (ja) 1993-07-28 1997-11-26 株式会社日本スペリア社 無鉛はんだ合金
US6156132A (en) 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
CN1919522A (zh) * 2005-09-23 2007-02-28 东莞市千岛金属锡品有限公司 一种环保型高温抗氧化焊料
JP2007090407A (ja) 2005-09-30 2007-04-12 Toshiba Corp 電子部品の接合材料、プリント回路配線基板、及び電子機器
CN102029479A (zh) * 2010-12-29 2011-04-27 广州有色金属研究院 一种低银无铅焊料合金及其制备方法和装置
JP2014140865A (ja) * 2013-01-23 2014-08-07 Hitachi Metals Ltd 無鉛はんだ
JP5578301B1 (ja) * 2013-04-18 2014-08-27 千住金属工業株式会社 鉛フリーはんだ合金
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
JP6111952B2 (ja) * 2013-09-25 2017-04-12 日立金属株式会社 無鉛はんだ合金、接合材及び接合体
AU2015254179B2 (en) * 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
WO2016178000A1 (en) * 2015-05-02 2016-11-10 Alpha Metals, Inc. Lead-free solder alloy with low melting point
CN105195915B (zh) * 2015-10-30 2017-05-24 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
CN105215569A (zh) * 2015-10-30 2016-01-06 苏州优诺电子材料科技有限公司 一种无铅焊料合金
CN106216872B (zh) 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
CN109661726A (zh) 2017-01-20 2019-04-19 联想（新加坡）私人有限公司 钎焊接合方法和钎焊接头
WO2018181690A1 (ja) * 2017-03-31 2018-10-04 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ継手
JP6477965B1 (ja) 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN112638574A (zh) * 2018-08-31 2021-04-09 铟泰公司 SnBi和SnIn焊锡合金
CN109158795B (zh) * 2018-10-12 2021-08-06 苏州优诺电子材料科技有限公司 一种低温焊料合金粉及其制备方法

Also Published As

Publication number Publication date
TWI819210B (zh) 2023-10-21
PT3828294T (pt) 2023-01-26
KR20210149831A (ko) 2021-12-09
WO2020209384A1 (ja) 2020-10-15
JP6804126B1 (ja) 2020-12-23
PH12021552086A1 (en) 2022-05-23
HUE061181T2 (hu) 2023-05-28
TW202045291A (zh) 2020-12-16
EP3828294A1 (en) 2021-06-02
IL287143B2 (en) 2024-12-01
CA3136585C (en) 2022-09-13
PL3828294T3 (pl) 2023-03-13
US11839937B2 (en) 2023-12-12
US20220016733A1 (en) 2022-01-20
BR112021020323A2 (https=) 2021-12-14
EP3828294B1 (en) 2022-11-16
ES2938369T3 (es) 2023-04-10
IL287143B1 (en) 2024-08-01
MX2021002203A (es) 2021-05-14
CN112513300A (zh) 2021-03-16
MY191908A (en) 2022-07-18
BR112021020323B1 (pt) 2022-08-30
JPWO2020209384A1 (ja) 2021-04-30
IL287143A (en) 2021-12-01
CA3136585A1 (en) 2020-10-15
CN113897511A (zh) 2022-01-07
EP3828294A4 (en) 2021-07-07

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