KR102328215B1 - 접착제 조성물, 및 그 이용 - Google Patents

접착제 조성물, 및 그 이용 Download PDF

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Publication number
KR102328215B1
KR102328215B1 KR1020170122703A KR20170122703A KR102328215B1 KR 102328215 B1 KR102328215 B1 KR 102328215B1 KR 1020170122703 A KR1020170122703 A KR 1020170122703A KR 20170122703 A KR20170122703 A KR 20170122703A KR 102328215 B1 KR102328215 B1 KR 102328215B1
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KR
South Korea
Prior art keywords
adhesive layer
layer
adhesive
adhesive composition
substrate
Prior art date
Application number
KR1020170122703A
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English (en)
Korean (ko)
Other versions
KR20180043731A (ko
Inventor
히로후미 이마이
다카히로 요시오카
마사히로 마스지마
고키 다무라
Original Assignee
도오꾜오까고오교 가부시끼가이샤
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Publication of KR20180043731A publication Critical patent/KR20180043731A/ko
Application granted granted Critical
Publication of KR102328215B1 publication Critical patent/KR102328215B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/162—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
KR1020170122703A 2016-10-20 2017-09-22 접착제 조성물, 및 그 이용 KR102328215B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-206341 2016-10-20
JP2016206341A JP6842878B2 (ja) 2016-10-20 2016-10-20 接着剤組成物、及びその利用

Publications (2)

Publication Number Publication Date
KR20180043731A KR20180043731A (ko) 2018-04-30
KR102328215B1 true KR102328215B1 (ko) 2021-11-17

Family

ID=62081218

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170122703A KR102328215B1 (ko) 2016-10-20 2017-09-22 접착제 조성물, 및 그 이용

Country Status (3)

Country Link
JP (1) JP6842878B2 (ja)
KR (1) KR102328215B1 (ja)
TW (1) TWI780066B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7137395B2 (ja) * 2018-08-07 2022-09-14 東京応化工業株式会社 積層体の製造方法、積層体、及び電子装置の製造方法
JP7532020B2 (ja) * 2018-09-28 2024-08-13 浜松ホトニクス株式会社 テラヘルツ波用光学素子及びその製造方法
JP6738448B1 (ja) * 2019-02-08 2020-08-12 グンゼ株式会社 透明導電性フィルム及びタッチパネル
JP7315376B2 (ja) * 2019-05-24 2023-07-26 東京応化工業株式会社 基板洗浄方法、基板洗浄装置及び基板洗浄用キット
JP7374719B2 (ja) * 2019-10-31 2023-11-07 東京応化工業株式会社 接着剤組成物、積層体及びその製造方法、並びに電子部品の製造方法
JP7488595B2 (ja) 2022-05-02 2024-05-22 Ａｉメカテック株式会社 基板洗浄方法及び基板洗浄装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012152938A (ja) * 2011-01-24 2012-08-16 Tokyo Ohka Kogyo Co Ltd 積層体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277693A (ja) * 2008-05-12 2009-11-26 Mitsubishi Electric Corp 基板材料およびそれを用いたプリント配線板
JP2011154264A (ja) * 2010-01-28 2011-08-11 Shibaura Institute Of Technology イオンビーム描画用ネガ型レジスト組成物及びパターン形成方法
TW201335203A (zh) * 2011-12-16 2013-09-01 Lintec Corp 硬化性樹脂組成物、硬化性樹脂成形體、硬化樹脂成形體及其製造方法與積層體
JP6244088B2 (ja) 2012-11-29 2017-12-06 東京応化工業株式会社 接着剤組成物、接着フィルムおよび積層体
JP6126884B2 (ja) * 2013-03-26 2017-05-10 リンテック株式会社 硬化性樹脂組成物、樹脂フィルム、ガスバリアフィルム及び電子デバイス
JP6114596B2 (ja) * 2013-03-26 2017-04-12 富士フイルム株式会社 半導体装置製造用仮接合用積層体、および、半導体装置の製造方法
JP6050170B2 (ja) * 2013-03-27 2016-12-21 富士フイルム株式会社 半導体装置製造用仮接合用積層体、および、半導体装置の製造方法
JP2014239154A (ja) * 2013-06-07 2014-12-18 日東電工株式会社 半導体装置の製造方法
US20170326850A1 (en) * 2014-12-03 2017-11-16 Tokyo Ohka Kogy Co., Ltd. Laminate production method, substrate processing method, and laminate
WO2016199611A1 (ja) * 2015-06-08 2016-12-15 富士フイルム株式会社 ３次元印刷用活性光線硬化型インクジェットインクセット、３次元印刷方法、及び、３次元印刷システム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012152938A (ja) * 2011-01-24 2012-08-16 Tokyo Ohka Kogyo Co Ltd 積層体

Also Published As

Publication number Publication date
KR20180043731A (ko) 2018-04-30
TWI780066B (zh) 2022-10-11
JP2018065953A (ja) 2018-04-26
TW201827548A (zh) 2018-08-01
JP6842878B2 (ja) 2021-03-17

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