KR102306299B1 - 도전성 점착제 조성물 및 도전성 점착 테이프 - Google Patents

도전성 점착제 조성물 및 도전성 점착 테이프 Download PDF

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Publication number
KR102306299B1
KR102306299B1 KR1020187036086A KR20187036086A KR102306299B1 KR 102306299 B1 KR102306299 B1 KR 102306299B1 KR 1020187036086 A KR1020187036086 A KR 1020187036086A KR 20187036086 A KR20187036086 A KR 20187036086A KR 102306299 B1 KR102306299 B1 KR 102306299B1
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KR
South Korea
Prior art keywords
adhesive composition
electroconductive
acrylic copolymer
conductive
mass
Prior art date
Application number
KR1020187036086A
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English (en)
Korean (ko)
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KR20190007472A (ko
Inventor
토시히로 야마가타
카즈키 이시카와
Original Assignee
가부시키가이샤 데라오카 세이사쿠쇼
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Application filed by 가부시키가이샤 데라오카 세이사쿠쇼 filed Critical 가부시키가이샤 데라오카 세이사쿠쇼
Publication of KR20190007472A publication Critical patent/KR20190007472A/ko
Application granted granted Critical
Publication of KR102306299B1 publication Critical patent/KR102306299B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
KR1020187036086A 2016-06-17 2016-06-17 도전성 점착제 조성물 및 도전성 점착 테이프 KR102306299B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/068056 WO2017216947A1 (ja) 2016-06-17 2016-06-17 導電性粘着剤組成物及び導電性粘着テープ

Publications (2)

Publication Number Publication Date
KR20190007472A KR20190007472A (ko) 2019-01-22
KR102306299B1 true KR102306299B1 (ko) 2021-09-28

Family

ID=60664441

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187036086A KR102306299B1 (ko) 2016-06-17 2016-06-17 도전성 점착제 조성물 및 도전성 점착 테이프

Country Status (5)

Country Link
JP (1) JP6748203B2 (zh)
KR (1) KR102306299B1 (zh)
CN (1) CN109415608B (zh)
TW (1) TWI756215B (zh)
WO (1) WO2017216947A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018035286A (ja) * 2016-09-01 2018-03-08 パナソニックＩｐマネジメント株式会社 導電性樹脂組成物及びそれを用いた電子回路部材

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079127A (ja) * 2007-09-26 2009-04-16 Nitto Denko Corp 導電性粘着テープ
JP2009091485A (ja) 2007-10-10 2009-04-30 Nitto Denko Corp 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP2014136778A (ja) 2013-01-18 2014-07-28 Dic Corp 導電性粘着シート
JP2015178595A (ja) 2014-02-28 2015-10-08 日東電工株式会社 導電性粘着テープ、および導電性粘着テープ付表示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101373569B1 (ko) 2008-01-16 2014-03-13 한라비스테온공조 주식회사 자동차용 프론트 엔드 모듈
JP2011153190A (ja) * 2010-01-26 2011-08-11 Nitto Denko Corp 導電性粘着テープ
JP5924123B2 (ja) 2012-05-23 2016-05-25 Dic株式会社 導電性薄型粘着シート
KR20150010110A (ko) 2013-07-18 2015-01-28 한국산업기술대학교산학협력단 안정된 도서 이송 방식의 도서 먼지 제거 장치
KR20150010109A (ko) 2013-07-18 2015-01-28 (주) 케이엠팩 빵 굽는 냄새가 나는 식품 포장용 고분자 제품 및 이의 제조방법
KR102270480B1 (ko) * 2014-02-28 2021-06-29 닛토덴코 가부시키가이샤 도전성 점착 테이프 및 도전성 점착 테이프가 부착된 표시 장치
JP2015196741A (ja) * 2014-03-31 2015-11-09 デクセリアルズ株式会社 導電性シールドテープ
WO2016203510A1 (ja) * 2015-06-15 2016-12-22 株式会社寺岡製作所 粘着剤組成物及び粘着テープ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079127A (ja) * 2007-09-26 2009-04-16 Nitto Denko Corp 導電性粘着テープ
JP2009091485A (ja) 2007-10-10 2009-04-30 Nitto Denko Corp 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP2014136778A (ja) 2013-01-18 2014-07-28 Dic Corp 導電性粘着シート
JP2015178595A (ja) 2014-02-28 2015-10-08 日東電工株式会社 導電性粘着テープ、および導電性粘着テープ付表示装置

Also Published As

Publication number Publication date
JP6748203B2 (ja) 2020-08-26
CN109415608B (zh) 2021-11-23
WO2017216947A1 (ja) 2017-12-21
JPWO2017216947A1 (ja) 2019-04-04
TWI756215B (zh) 2022-03-01
TW201800531A (zh) 2018-01-01
CN109415608A (zh) 2019-03-01
KR20190007472A (ko) 2019-01-22

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