KR102305501B1 - 소결 재료 및 이를 이용한 부착 방법 - Google Patents

소결 재료 및 이를 이용한 부착 방법 Download PDF

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KR102305501B1
KR102305501B1 KR1020207014221A KR20207014221A KR102305501B1 KR 102305501 B1 KR102305501 B1 KR 102305501B1 KR 1020207014221 A KR1020207014221 A KR 1020207014221A KR 20207014221 A KR20207014221 A KR 20207014221A KR 102305501 B1 KR102305501 B1 KR 102305501B1
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substrate
film
die
delete delete
sintering
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KR20200057116A (ko
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오스카 카셀레브
바와 싱
빈 모
마이클 티. 마아치
모니르 보우그다
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알파 어셈블리 솔루션스 인크.
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Priority to KR1020217029881A priority Critical patent/KR20210117357A/ko
Priority to KR1020217029880A priority patent/KR102531070B1/ko
Publication of KR20200057116A publication Critical patent/KR20200057116A/ko
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    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Powder Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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  • Life Sciences & Earth Sciences (AREA)
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