KR102304528B1 - 회로 기판의 제조 방법 - Google Patents

회로 기판의 제조 방법 Download PDF

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Publication number
KR102304528B1
KR102304528B1 KR1020150056054A KR20150056054A KR102304528B1 KR 102304528 B1 KR102304528 B1 KR 102304528B1 KR 1020150056054 A KR1020150056054 A KR 1020150056054A KR 20150056054 A KR20150056054 A KR 20150056054A KR 102304528 B1 KR102304528 B1 KR 102304528B1
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KR
South Korea
Prior art keywords
layer
insulating layer
plastic film
circuit board
film support
Prior art date
Application number
KR1020150056054A
Other languages
English (en)
Korean (ko)
Other versions
KR20150123172A (ko
Inventor
시게오 나카무라
겐지 가와이
유키노리 모리카와
히로히사 나라하시
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20150123172A publication Critical patent/KR20150123172A/ko
Application granted granted Critical
Publication of KR102304528B1 publication Critical patent/KR102304528B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections

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  • Engineering & Computer Science (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020150056054A 2014-04-24 2015-04-21 회로 기판의 제조 방법 KR102304528B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-090643 2014-04-24
JP2014090643A JP6503633B2 (ja) 2014-04-24 2014-04-24 回路基板の製造方法

Publications (2)

Publication Number Publication Date
KR20150123172A KR20150123172A (ko) 2015-11-03
KR102304528B1 true KR102304528B1 (ko) 2021-09-27

Family

ID=54599263

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150056054A KR102304528B1 (ko) 2014-04-24 2015-04-21 회로 기판의 제조 방법

Country Status (3)

Country Link
JP (1) JP6503633B2 (ja)
KR (1) KR102304528B1 (ja)
TW (1) TWI666980B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016086000A (ja) * 2014-10-22 2016-05-19 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
WO2019240217A1 (ja) * 2018-06-14 2019-12-19 積水化学工業株式会社 積層フィルム及び積層構造体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007208229A (ja) * 2006-01-31 2007-08-16 Taiyo Yuden Co Ltd 多層配線基板の製造方法
JP2010010639A (ja) * 2008-05-27 2010-01-14 Shinko Electric Ind Co Ltd 配線基板及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101024315A (zh) * 2001-07-06 2007-08-29 钟渊化学工业株式会社 层压体及其制造方法
JP4786657B2 (ja) * 2005-05-13 2011-10-05 三井化学株式会社 ４−メチル−１−ペンテン系重合体を含む積層体およびこれからなる離型フィルム
JP4609850B2 (ja) * 2005-08-01 2011-01-12 古河電気工業株式会社 積層回路基板
JP2008037957A (ja) 2006-08-03 2008-02-21 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板
KR20090123944A (ko) * 2007-03-29 2009-12-02 스미토모 베이클리트 컴퍼니 리미티드 기재 부착 절연 시트, 다층 프린트 배선판, 반도체 장치 및 다층 프린트 배선판의 제조 방법
JP6205692B2 (ja) * 2012-09-03 2017-10-04 味の素株式会社 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007208229A (ja) * 2006-01-31 2007-08-16 Taiyo Yuden Co Ltd 多層配線基板の製造方法
JP2010010639A (ja) * 2008-05-27 2010-01-14 Shinko Electric Ind Co Ltd 配線基板及びその製造方法

Also Published As

Publication number Publication date
TWI666980B (zh) 2019-07-21
KR20150123172A (ko) 2015-11-03
JP2015211085A (ja) 2015-11-24
JP6503633B2 (ja) 2019-04-24
TW201611701A (zh) 2016-03-16

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