KR102296706B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR102296706B1
KR102296706B1 KR1020197030074A KR20197030074A KR102296706B1 KR 102296706 B1 KR102296706 B1 KR 102296706B1 KR 1020197030074 A KR1020197030074 A KR 1020197030074A KR 20197030074 A KR20197030074 A KR 20197030074A KR 102296706 B1 KR102296706 B1 KR 102296706B1
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South Korea
Prior art keywords
substrate
speed
coating liquid
period
rate
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Korean (ko)
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KR20190125469A (ko
Inventor
다케히로 와지키
히데토시 사가와
Original Assignee
가부시키가이샤 스크린 홀딩스
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
KR1020197030074A 2017-08-30 2018-07-27 기판 처리 장치 및 기판 처리 방법 Active KR102296706B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017165379A JP6873011B2 (ja) 2017-08-30 2017-08-30 基板処理装置および基板処理方法
JPJP-P-2017-165379 2017-08-30
PCT/JP2018/028337 WO2019044314A1 (ja) 2017-08-30 2018-07-27 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
KR20190125469A KR20190125469A (ko) 2019-11-06
KR102296706B1 true KR102296706B1 (ko) 2021-09-01

Family

ID=65526446

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197030074A Active KR102296706B1 (ko) 2017-08-30 2018-07-27 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP6873011B2 (enrdf_load_stackoverflow)
KR (1) KR102296706B1 (enrdf_load_stackoverflow)
CN (1) CN110537245B (enrdf_load_stackoverflow)
TW (1) TWI669751B (enrdf_load_stackoverflow)
WO (1) WO2019044314A1 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12216406B2 (en) 2019-07-04 2025-02-04 Tokyo Electron Limited Coating method and coating apparatus
JP7339150B2 (ja) * 2019-12-20 2023-09-05 ラピスセミコンダクタ株式会社 基板処理装置、基板処理方法
KR102682854B1 (ko) 2020-06-02 2024-07-10 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP7520665B2 (ja) * 2020-09-25 2024-07-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP2022178694A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 塗布処理方法および塗布処理装置
JP7598821B2 (ja) 2021-05-20 2024-12-12 株式会社Ｓｃｒｅｅｎホールディングス 塗布処理方法および塗布処理装置
KR102600411B1 (ko) * 2021-08-12 2023-11-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP2023102138A (ja) * 2022-01-11 2023-07-24 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及びプログラム
KR102488391B1 (ko) 2022-01-11 2023-01-13 (주)예성글로벌 도어클로저 기능을 갖는 패닉바
JP2024127644A (ja) 2023-03-09 2024-09-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009207997A (ja) 2008-03-04 2009-09-17 Toshiba Corp 回転塗布方法、および回転塗布装置
JP2009207984A (ja) 2008-03-04 2009-09-17 Tokyo Electron Ltd 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP2016096345A (ja) * 2015-12-04 2016-05-26 株式会社東芝 回転塗布装置および回転塗布方法

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* Cited by examiner, † Cited by third party
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KR100284556B1 (ko) * 1993-03-25 2001-04-02 다카시마 히로시 도포막 형성방법 및 그를 위한 장치
JP3471168B2 (ja) * 1996-04-25 2003-11-25 大日本スクリーン製造株式会社 基板処理方法およびその装置
JP3527459B2 (ja) 2000-04-12 2004-05-17 東京エレクトロン株式会社 塗布膜形成方法および塗布処理装置
JP5065071B2 (ja) * 2007-03-15 2012-10-31 東京エレクトロン株式会社 塗布処理方法、塗布処理装置及びコンピュータ読み取り可能な記憶媒体
KR101447759B1 (ko) * 2008-12-16 2014-10-06 도쿄엘렉트론가부시키가이샤 도포 처리 방법 및 도포 처리 장치
JP5485672B2 (ja) * 2009-12-07 2014-05-07 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5337180B2 (ja) * 2010-04-08 2013-11-06 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP2014050803A (ja) * 2012-09-07 2014-03-20 Toshiba Corp 回転塗布装置および回転塗布方法
TWI666684B (zh) * 2015-11-16 2019-07-21 日商東京威力科創股份有限公司 塗佈膜形成方法、塗佈膜形成裝置及記憶媒體

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009207997A (ja) 2008-03-04 2009-09-17 Toshiba Corp 回転塗布方法、および回転塗布装置
JP2009207984A (ja) 2008-03-04 2009-09-17 Tokyo Electron Ltd 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP2016096345A (ja) * 2015-12-04 2016-05-26 株式会社東芝 回転塗布装置および回転塗布方法

Also Published As

Publication number Publication date
WO2019044314A1 (ja) 2019-03-07
TW201913728A (zh) 2019-04-01
CN110537245B (zh) 2023-05-02
KR20190125469A (ko) 2019-11-06
TWI669751B (zh) 2019-08-21
CN110537245A (zh) 2019-12-03
JP2019046850A (ja) 2019-03-22
JP6873011B2 (ja) 2021-05-19

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