KR102282899B1 - 세정 장치 및 롤 세정 부재 - Google Patents

세정 장치 및 롤 세정 부재 Download PDF

Info

Publication number
KR102282899B1
KR102282899B1 KR1020177002741A KR20177002741A KR102282899B1 KR 102282899 B1 KR102282899 B1 KR 102282899B1 KR 1020177002741 A KR1020177002741 A KR 1020177002741A KR 20177002741 A KR20177002741 A KR 20177002741A KR 102282899 B1 KR102282899 B1 KR 102282899B1
Authority
KR
South Korea
Prior art keywords
substrate
longitudinal direction
row
roll cleaning
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177002741A
Other languages
English (en)
Korean (ko)
Other versions
KR20170029536A (ko
Inventor
도모아츠 이시바시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20170029536A publication Critical patent/KR20170029536A/ko
Application granted granted Critical
Publication of KR102282899B1 publication Critical patent/KR102282899B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/02096—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H01L21/02057—
    • H01L21/304—
    • H01L21/30625—
    • H01L21/67046—
    • H01L21/68764—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Cleaning In General (AREA)
KR1020177002741A 2014-07-04 2015-07-01 세정 장치 및 롤 세정 부재 Active KR102282899B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2014-138685 2014-07-04
JP2014138685 2014-07-04
JPJP-P-2015-129639 2015-06-29
JP2015129639A JP6366544B2 (ja) 2014-07-04 2015-06-29 洗浄装置及びロール洗浄部材
PCT/JP2015/003314 WO2016002219A1 (ja) 2014-07-04 2015-07-01 洗浄装置及びロール洗浄部材

Publications (2)

Publication Number Publication Date
KR20170029536A KR20170029536A (ko) 2017-03-15
KR102282899B1 true KR102282899B1 (ko) 2021-07-27

Family

ID=55018792

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177002741A Active KR102282899B1 (ko) 2014-07-04 2015-07-01 세정 장치 및 롤 세정 부재

Country Status (8)

Country Link
US (1) US10453708B2 (https=)
JP (1) JP6366544B2 (https=)
KR (1) KR102282899B1 (https=)
CN (1) CN106663620B (https=)
MY (1) MY176791A (https=)
SG (1) SG11201700026XA (https=)
TW (1) TWI686868B (https=)
WO (1) WO2016002219A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269555B2 (en) 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
JP6990720B2 (ja) * 2018-01-09 2022-01-12 東京エレクトロン株式会社 洗浄装置、洗浄方法及びコンピュータ記憶媒体
USD923890S1 (en) * 2018-09-07 2021-06-29 Maradyne Corporation Mattress surface cleaning agitator
CN109007900B (zh) * 2018-09-20 2023-09-12 安徽科技学院 一种海带无损伤清洗装置及其清洗方法
WO2020160231A1 (en) * 2019-01-31 2020-08-06 Applied Materials, Inc. Substrate cleaning devices and methods thereof
USD906680S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906681S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD897111S1 (en) * 2019-03-11 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906682S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906683S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD897112S1 (en) * 2019-03-25 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906684S1 (en) * 2019-03-28 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906685S1 (en) * 2019-04-02 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD907370S1 (en) * 2019-04-05 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907925S1 (en) * 2019-04-23 2021-01-19 Ali Ebrahimi Afrouzi Side brush
USD897113S1 (en) * 2019-04-25 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906686S1 (en) * 2019-04-30 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD907371S1 (en) * 2019-05-03 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907926S1 (en) * 2019-06-10 2021-01-19 Ali Ebrahimi Afrouzi Side brush
USD907372S1 (en) * 2019-06-10 2021-01-12 Ali Ebrahimi Afrouzi Side brush
CN111790682B (zh) * 2020-06-30 2022-06-28 鹰潭拓新机电股份有限公司 一种模具零件清洗装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000270929A (ja) 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2011233646A (ja) 2010-04-26 2011-11-17 Sumitomo Metal Mining Co Ltd 半導体用基板の洗浄方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6502273B1 (en) 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6299698B1 (en) 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
TWI286096B (en) * 2003-08-08 2007-09-01 Entegris Inc Methods and materials for making a monolithic porous pad onto a rotatable base
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
JP2006075718A (ja) 2004-09-09 2006-03-23 Aion Kk 弾性ローラ
JP2008311481A (ja) * 2007-06-15 2008-12-25 Sony Corp 基板洗浄方法、基板洗浄装置及び半導体製造方法
JP2009066527A (ja) * 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置
US20100043160A1 (en) * 2008-08-20 2010-02-25 United Microelectronics Corp. Wafer cleaning roller
WO2011103538A2 (en) * 2010-02-22 2011-08-25 Entegris,Inc. Post-cmp cleaning brush
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000270929A (ja) 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2011233646A (ja) 2010-04-26 2011-11-17 Sumitomo Metal Mining Co Ltd 半導体用基板の洗浄方法

Also Published As

Publication number Publication date
KR20170029536A (ko) 2017-03-15
US20170170034A1 (en) 2017-06-15
CN106663620B (zh) 2020-03-27
MY176791A (en) 2020-08-21
TW201604962A (zh) 2016-02-01
JP2016027641A (ja) 2016-02-18
US10453708B2 (en) 2019-10-22
JP6366544B2 (ja) 2018-08-01
SG11201700026XA (en) 2017-02-27
WO2016002219A1 (ja) 2016-01-07
TWI686868B (zh) 2020-03-01
CN106663620A (zh) 2017-05-10

Similar Documents

Publication Publication Date Title
KR102282899B1 (ko) 세정 장치 및 롤 세정 부재
JP5886224B2 (ja) 基板洗浄方法
JP5645752B2 (ja) 基板洗浄方法及びロール洗浄部材
TWI590319B (zh) 化學機械研磨後清洗及設備
CN107078046B (zh) 基板清洗辊、基板清洗装置及基板清洗方法
JP6316730B2 (ja) ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
JP2014003273A5 (https=)
JP5775383B2 (ja) 基板洗浄方法
TW201832279A (zh) 刷洗方法及刷洗裝置
CN110957208A (zh) 晶圆洗边方法及晶圆清洗装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000