SG11201700026XA - Cleaning device and roll cleaning member - Google Patents

Cleaning device and roll cleaning member

Info

Publication number
SG11201700026XA
SG11201700026XA SG11201700026XA SG11201700026XA SG11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA SG 11201700026X A SG11201700026X A SG 11201700026XA
Authority
SG
Singapore
Prior art keywords
cleaning
roll
cleaning device
cleaning member
roll cleaning
Prior art date
Application number
SG11201700026XA
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201700026XA publication Critical patent/SG11201700026XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Cleaning In General (AREA)
SG11201700026XA 2014-07-04 2015-07-01 Cleaning device and roll cleaning member SG11201700026XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014138685 2014-07-04
JP2015129639A JP6366544B2 (en) 2014-07-04 2015-06-29 Cleaning device and roll cleaning member
PCT/JP2015/003314 WO2016002219A1 (en) 2014-07-04 2015-07-01 Cleaning device and roll cleaning member

Publications (1)

Publication Number Publication Date
SG11201700026XA true SG11201700026XA (en) 2017-02-27

Family

ID=55018792

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700026XA SG11201700026XA (en) 2014-07-04 2015-07-01 Cleaning device and roll cleaning member

Country Status (8)

Country Link
US (1) US10453708B2 (en)
JP (1) JP6366544B2 (en)
KR (1) KR102282899B1 (en)
CN (1) CN106663620B (en)
MY (1) MY176791A (en)
SG (1) SG11201700026XA (en)
TW (1) TWI686868B (en)
WO (1) WO2016002219A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269555B2 (en) * 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
KR102629528B1 (en) * 2018-01-09 2024-01-25 도쿄엘렉트론가부시키가이샤 Cleaning device, cleaning method, and computer storage medium
USD923890S1 (en) * 2018-09-07 2021-06-29 Maradyne Corporation Mattress surface cleaning agitator
CN109007900B (en) * 2018-09-20 2023-09-12 安徽科技学院 Kelp nondestructive cleaning device and cleaning method thereof
USD897111S1 (en) * 2019-03-11 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906682S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906681S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906683S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906680S1 (en) * 2019-03-11 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD897112S1 (en) * 2019-03-25 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906684S1 (en) * 2019-03-28 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD906685S1 (en) * 2019-04-02 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD907370S1 (en) * 2019-04-05 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907925S1 (en) * 2019-04-23 2021-01-19 Ali Ebrahimi Afrouzi Side brush
USD897113S1 (en) * 2019-04-25 2020-09-29 Ali Ebrahimi Afrouzi Side brush
USD906686S1 (en) * 2019-04-30 2021-01-05 Ali Ebrahimi Afrouzi Side brush
USD907371S1 (en) * 2019-05-03 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907372S1 (en) * 2019-06-10 2021-01-12 Ali Ebrahimi Afrouzi Side brush
USD907926S1 (en) * 2019-06-10 2021-01-19 Ali Ebrahimi Afrouzi Side brush
CN111790682B (en) * 2020-06-30 2022-06-28 鹰潭拓新机电股份有限公司 Mould part belt cleaning device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6502273B1 (en) 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JP3403108B2 (en) * 1999-02-26 2003-05-06 アイオン株式会社 Sponge roller for cleaning
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2000270929A (en) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp Washing brush
EP1680260B1 (en) * 2003-08-08 2014-04-30 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
JP2006075718A (en) * 2004-09-09 2006-03-23 Aion Kk Elastic roller
JP2008311481A (en) * 2007-06-15 2008-12-25 Sony Corp Substrate cleaning method, substrate cleaning device, and semiconductor manufacturing method
JP2009066527A (en) * 2007-09-13 2009-04-02 Nec Electronics Corp Washing roller and washing apparatus
US20100043160A1 (en) * 2008-08-20 2010-02-25 United Microelectronics Corp. Wafer cleaning roller
JP5977175B2 (en) * 2010-02-22 2016-08-24 インテグリス・インコーポレーテッド Cleaning brush after CMP
JP5535687B2 (en) 2010-03-01 2014-07-02 株式会社荏原製作所 Substrate cleaning method and substrate cleaning apparatus
JP2011233646A (en) * 2010-04-26 2011-11-17 Sumitomo Metal Mining Co Ltd Method of washing semiconductor substrate

Also Published As

Publication number Publication date
JP2016027641A (en) 2016-02-18
TWI686868B (en) 2020-03-01
JP6366544B2 (en) 2018-08-01
CN106663620A (en) 2017-05-10
MY176791A (en) 2020-08-21
KR20170029536A (en) 2017-03-15
WO2016002219A1 (en) 2016-01-07
US20170170034A1 (en) 2017-06-15
CN106663620B (en) 2020-03-27
US10453708B2 (en) 2019-10-22
KR102282899B1 (en) 2021-07-27
TW201604962A (en) 2016-02-01

Similar Documents

Publication Publication Date Title
SG11201700026XA (en) Cleaning device and roll cleaning member
IL249875A0 (en) Aerosol-generating device and system
IL252216B (en) Difluoromethyl-aminopyridines and difluoromethyl-aminopyrimidines
HUE042596T2 (en) Cleaning device and method
HK1249004A1 (en) Massage device
GB201417457D0 (en) Hygiene device
AU360502S (en) Massage device
HK1195705A2 (en) Portable visual cleaning device
AU360504S (en) Massage device
HK1248996B (en) Cleaning device
HK1223815A1 (en) Massage device
ZA201702623B (en) Classifier cleaning device
AU360503S (en) Massage device
SG11201606317VA (en) Massage device
HK1243077A1 (en) Piperidinylpyrazolopyrimidinones and their use
IL247418B (en) Inkjet-head cleaning device and method
TWM490697U (en) Roll call device
ZA201700162B (en) Cleaning device
PL3285631T3 (en) Manually-displaceable cleaning device having counter-rotatable rollers
PT3461798T (en) Rollers cleaning device
PL3045637T3 (en) Fitting device
HK1215128A2 (en) Ionizer device
SG10201606599TA (en) Cleaning device
EP3020315C0 (en) Surface cleaning device
GB201616789D0 (en) Cleaning device