KR102271159B1 - 반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템 - Google Patents

반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템 Download PDF

Info

Publication number
KR102271159B1
KR102271159B1 KR1020187013813A KR20187013813A KR102271159B1 KR 102271159 B1 KR102271159 B1 KR 102271159B1 KR 1020187013813 A KR1020187013813 A KR 1020187013813A KR 20187013813 A KR20187013813 A KR 20187013813A KR 102271159 B1 KR102271159 B1 KR 102271159B1
Authority
KR
South Korea
Prior art keywords
layer
type semiconductor
disposed
semiconductor layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020187013813A
Other languages
English (en)
Korean (ko)
Other versions
KR20180061373A (ko
Inventor
최재훈
박해진
최낙준
김병조
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Publication of KR20180061373A publication Critical patent/KR20180061373A/ko
Application granted granted Critical
Publication of KR102271159B1 publication Critical patent/KR102271159B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L33/12
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/813Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • H01L33/20
    • H01L33/22
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/814Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/815Bodies having stress relaxation structures, e.g. buffer layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82Roughened surfaces, e.g. at the interface between epitaxial layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
KR1020187013813A 2015-10-15 2016-10-14 반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템 Expired - Fee Related KR102271159B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20150144060 2015-10-15
KR1020150144060 2015-10-15
PCT/KR2016/011576 WO2017065566A1 (ko) 2015-10-15 2016-10-14 반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템

Publications (2)

Publication Number Publication Date
KR20180061373A KR20180061373A (ko) 2018-06-07
KR102271159B1 true KR102271159B1 (ko) 2021-07-01

Family

ID=58517467

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187013813A Expired - Fee Related KR102271159B1 (ko) 2015-10-15 2016-10-14 반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템

Country Status (6)

Country Link
US (1) US10340417B2 (enExample)
EP (1) EP3364465B1 (enExample)
JP (1) JP7224020B2 (enExample)
KR (1) KR102271159B1 (enExample)
CN (1) CN108352425B (enExample)
WO (1) WO2017065566A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190082691A (ko) * 2019-06-21 2019-07-10 엘지전자 주식회사 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI630729B (zh) * 2017-08-28 2018-07-21 友達光電股份有限公司 發光裝置
KR102611981B1 (ko) * 2017-10-19 2023-12-11 삼성전자주식회사 발광 장치 및 그 제조 방법
US12132151B2 (en) * 2019-06-27 2024-10-29 Lumileds Llc Nanocone arrays for enhancing light outcoupling and package efficiency
CN111864019B (zh) * 2020-07-10 2021-11-30 武汉大学 一种具有嵌入式散射层的倒装发光二极管及其制备方法
US20220199857A1 (en) * 2020-12-17 2022-06-23 Seoul Viosys Co., Ltd. Unit pixel and displaying apparatus including the unit pixel
US12419140B2 (en) * 2021-05-17 2025-09-16 Seoul Viosys Co., Ltd. UV light emitting diode
US20230034456A1 (en) * 2021-07-30 2023-02-02 Seoul Viosys Co., Ltd. Light emitting module and display apparatus by using the same
CN118120065A (zh) * 2022-11-09 2024-05-31 厦门三安光电有限公司 发光器件、发光器件的制作方法及发光装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013539922A (ja) * 2010-10-12 2013-10-28 コーニンクレッカ フィリップス エヌ ヴェ エピ応力が低減された発光デバイス

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7227192B2 (en) * 2004-03-31 2007-06-05 Tekcove Co., Ltd Light-emitting device and manufacturing process of the light-emitting device
JP4993435B2 (ja) 2006-03-14 2012-08-08 スタンレー電気株式会社 窒化物半導体発光素子の製造方法
KR101316115B1 (ko) * 2007-03-29 2013-10-11 서울바이오시스 주식회사 수직형 발광 다이오드 제조방법
JP5330040B2 (ja) 2009-03-17 2013-10-30 株式会社東芝 半導体素子、半導体装置、半導体ウェーハ及び半導体結晶の成長方法
KR101166132B1 (ko) 2010-04-13 2012-07-23 한국광기술원 희생층을 구비한 발광다이오드 및 그 제조방법
EP2579297B1 (en) 2010-06-07 2020-12-16 Soko Kagaku Co., Ltd. Method of producing template for epitaxial growth and nitride semiconductor device
JP5277270B2 (ja) * 2010-07-08 2013-08-28 学校法人立命館 結晶成長方法および半導体素子
KR20120079392A (ko) 2011-01-04 2012-07-12 (주)세미머티리얼즈 반도체 발광소자의 제조방법
CN102760803B (zh) 2011-04-29 2015-08-26 清华大学 发光二极管
KR101804408B1 (ko) * 2011-09-05 2017-12-04 엘지이노텍 주식회사 발광소자
KR20130072825A (ko) * 2011-12-22 2013-07-02 엘지이노텍 주식회사 발광소자
KR20130099529A (ko) 2012-02-29 2013-09-06 엘지이노텍 주식회사 발광소자
US9000415B2 (en) * 2012-09-12 2015-04-07 Lg Innotek Co., Ltd. Light emitting device
KR20140034665A (ko) 2012-09-12 2014-03-20 엘지이노텍 주식회사 발광소자
US9660140B2 (en) 2012-11-02 2017-05-23 Riken Ultraviolet light emitting diode and method for producing same
JP5624700B1 (ja) * 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
KR102094471B1 (ko) * 2013-10-07 2020-03-27 삼성전자주식회사 질화물 반도체층의 성장방법 및 이에 의하여 형성된 질화물 반도체
JP2015216352A (ja) * 2014-04-24 2015-12-03 国立研究開発法人理化学研究所 紫外発光ダイオードおよびそれを備える電気機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013539922A (ja) * 2010-10-12 2013-10-28 コーニンクレッカ フィリップス エヌ ヴェ エピ応力が低減された発光デバイス

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190082691A (ko) * 2019-06-21 2019-07-10 엘지전자 주식회사 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법
KR102659984B1 (ko) 2019-06-21 2024-04-24 엘지전자 주식회사 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법
US12289934B2 (en) 2019-06-21 2025-04-29 Lg Electronics Inc. Display device using micro LED, and method for manufacturing same

Also Published As

Publication number Publication date
JP7224020B2 (ja) 2023-02-17
WO2017065566A1 (ko) 2017-04-20
EP3364465A4 (en) 2018-10-10
US20180315887A1 (en) 2018-11-01
CN108352425A (zh) 2018-07-31
JP2018530924A (ja) 2018-10-18
KR20180061373A (ko) 2018-06-07
EP3364465A1 (en) 2018-08-22
CN108352425B (zh) 2022-02-11
US10340417B2 (en) 2019-07-02
EP3364465B1 (en) 2019-12-18

Similar Documents

Publication Publication Date Title
KR102271159B1 (ko) 반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템
KR101729263B1 (ko) 발광 소자, 발광 소자의 제조방법 및 발광 소자 패키지
KR100999779B1 (ko) 발광소자, 발광소자의 제조방법 및 발광소자 패키지
US10177281B2 (en) Light-emitting diode
US20180309029A1 (en) Light emitting device and method of fabricating the same
KR20140054344A (ko) 전류 저감 구조물들을 갖는 발광 소자들 및 전류 저감 구조물들을 갖는 발광 소자들을 형성하는 방법
KR101300781B1 (ko) 개구부가 형성된 전류 분산층을 갖는 발광 다이오드 및 발광 다이오드 패키지
KR20150107400A (ko) 발광 다이오드
KR102237149B1 (ko) 발광소자 및 조명시스템
KR102550006B1 (ko) 발광 다이오드
KR102304123B1 (ko) 발광소자, 발광소자 패키지, 및 이를 포함하는 조명시스템
KR102250523B1 (ko) 발광소자 및 조명시스템
US20170222089A1 (en) Light-emitting diode and lighting system
TWI610416B (zh) 抗靜電放電的led晶片以及包含該led晶片的led封裝
US20240154058A1 (en) Light emitting device and apparatus having the same
KR20110116453A (ko) 반도체 발광소자 및 발광소자 패키지
KR102319812B1 (ko) 발광소자 및 조명시스템
KR102385943B1 (ko) 발광 소자 및 발광 소자 패키지
KR20180018499A (ko) 반사기와 상부 접점을 갖는 발광 디바이스
KR20130074071A (ko) 발광소자 패키지
KR20130074072A (ko) 발광소자 패키지
KR20200054500A (ko) 발광소자 패키지
KR20170072687A (ko) 자외선 발광소자
KR20160088036A (ko) 라이트 유닛

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D12-X000 Request for substantive examination rejected

St.27 status event code: A-1-2-D10-D12-exm-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240625

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240625