KR102271159B1 - 반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템 - Google Patents
반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템 Download PDFInfo
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- KR102271159B1 KR102271159B1 KR1020187013813A KR20187013813A KR102271159B1 KR 102271159 B1 KR102271159 B1 KR 102271159B1 KR 1020187013813 A KR1020187013813 A KR 1020187013813A KR 20187013813 A KR20187013813 A KR 20187013813A KR 102271159 B1 KR102271159 B1 KR 102271159B1
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- H01L33/12—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- H01L33/20—
-
- H01L33/22—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20150144060 | 2015-10-15 | ||
| KR1020150144060 | 2015-10-15 | ||
| PCT/KR2016/011576 WO2017065566A1 (ko) | 2015-10-15 | 2016-10-14 | 반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180061373A KR20180061373A (ko) | 2018-06-07 |
| KR102271159B1 true KR102271159B1 (ko) | 2021-07-01 |
Family
ID=58517467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187013813A Expired - Fee Related KR102271159B1 (ko) | 2015-10-15 | 2016-10-14 | 반도체 소자, 반도체 소자 패키지, 및 이를 포함하는 조명 시스템 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10340417B2 (enExample) |
| EP (1) | EP3364465B1 (enExample) |
| JP (1) | JP7224020B2 (enExample) |
| KR (1) | KR102271159B1 (enExample) |
| CN (1) | CN108352425B (enExample) |
| WO (1) | WO2017065566A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190082691A (ko) * | 2019-06-21 | 2019-07-10 | 엘지전자 주식회사 | 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI630729B (zh) * | 2017-08-28 | 2018-07-21 | 友達光電股份有限公司 | 發光裝置 |
| KR102611981B1 (ko) * | 2017-10-19 | 2023-12-11 | 삼성전자주식회사 | 발광 장치 및 그 제조 방법 |
| US12132151B2 (en) * | 2019-06-27 | 2024-10-29 | Lumileds Llc | Nanocone arrays for enhancing light outcoupling and package efficiency |
| CN111864019B (zh) * | 2020-07-10 | 2021-11-30 | 武汉大学 | 一种具有嵌入式散射层的倒装发光二极管及其制备方法 |
| US20220199857A1 (en) * | 2020-12-17 | 2022-06-23 | Seoul Viosys Co., Ltd. | Unit pixel and displaying apparatus including the unit pixel |
| US12419140B2 (en) * | 2021-05-17 | 2025-09-16 | Seoul Viosys Co., Ltd. | UV light emitting diode |
| US20230034456A1 (en) * | 2021-07-30 | 2023-02-02 | Seoul Viosys Co., Ltd. | Light emitting module and display apparatus by using the same |
| CN118120065A (zh) * | 2022-11-09 | 2024-05-31 | 厦门三安光电有限公司 | 发光器件、发光器件的制作方法及发光装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013539922A (ja) * | 2010-10-12 | 2013-10-28 | コーニンクレッカ フィリップス エヌ ヴェ | エピ応力が低減された発光デバイス |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7227192B2 (en) * | 2004-03-31 | 2007-06-05 | Tekcove Co., Ltd | Light-emitting device and manufacturing process of the light-emitting device |
| JP4993435B2 (ja) | 2006-03-14 | 2012-08-08 | スタンレー電気株式会社 | 窒化物半導体発光素子の製造方法 |
| KR101316115B1 (ko) * | 2007-03-29 | 2013-10-11 | 서울바이오시스 주식회사 | 수직형 발광 다이오드 제조방법 |
| JP5330040B2 (ja) | 2009-03-17 | 2013-10-30 | 株式会社東芝 | 半導体素子、半導体装置、半導体ウェーハ及び半導体結晶の成長方法 |
| KR101166132B1 (ko) | 2010-04-13 | 2012-07-23 | 한국광기술원 | 희생층을 구비한 발광다이오드 및 그 제조방법 |
| EP2579297B1 (en) | 2010-06-07 | 2020-12-16 | Soko Kagaku Co., Ltd. | Method of producing template for epitaxial growth and nitride semiconductor device |
| JP5277270B2 (ja) * | 2010-07-08 | 2013-08-28 | 学校法人立命館 | 結晶成長方法および半導体素子 |
| KR20120079392A (ko) | 2011-01-04 | 2012-07-12 | (주)세미머티리얼즈 | 반도체 발광소자의 제조방법 |
| CN102760803B (zh) | 2011-04-29 | 2015-08-26 | 清华大学 | 发光二极管 |
| KR101804408B1 (ko) * | 2011-09-05 | 2017-12-04 | 엘지이노텍 주식회사 | 발광소자 |
| KR20130072825A (ko) * | 2011-12-22 | 2013-07-02 | 엘지이노텍 주식회사 | 발광소자 |
| KR20130099529A (ko) | 2012-02-29 | 2013-09-06 | 엘지이노텍 주식회사 | 발광소자 |
| US9000415B2 (en) * | 2012-09-12 | 2015-04-07 | Lg Innotek Co., Ltd. | Light emitting device |
| KR20140034665A (ko) | 2012-09-12 | 2014-03-20 | 엘지이노텍 주식회사 | 발광소자 |
| US9660140B2 (en) | 2012-11-02 | 2017-05-23 | Riken | Ultraviolet light emitting diode and method for producing same |
| JP5624700B1 (ja) * | 2012-12-21 | 2014-11-12 | パナソニック株式会社 | 電子部品パッケージおよびその製造方法 |
| KR102094471B1 (ko) * | 2013-10-07 | 2020-03-27 | 삼성전자주식회사 | 질화물 반도체층의 성장방법 및 이에 의하여 형성된 질화물 반도체 |
| JP2015216352A (ja) * | 2014-04-24 | 2015-12-03 | 国立研究開発法人理化学研究所 | 紫外発光ダイオードおよびそれを備える電気機器 |
-
2016
- 2016-10-14 WO PCT/KR2016/011576 patent/WO2017065566A1/ko not_active Ceased
- 2016-10-14 EP EP16855783.3A patent/EP3364465B1/en active Active
- 2016-10-14 JP JP2018519445A patent/JP7224020B2/ja active Active
- 2016-10-14 KR KR1020187013813A patent/KR102271159B1/ko not_active Expired - Fee Related
- 2016-10-14 US US15/768,282 patent/US10340417B2/en active Active
- 2016-10-14 CN CN201680060204.1A patent/CN108352425B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013539922A (ja) * | 2010-10-12 | 2013-10-28 | コーニンクレッカ フィリップス エヌ ヴェ | エピ応力が低減された発光デバイス |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190082691A (ko) * | 2019-06-21 | 2019-07-10 | 엘지전자 주식회사 | 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법 |
| KR102659984B1 (ko) | 2019-06-21 | 2024-04-24 | 엘지전자 주식회사 | 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법 |
| US12289934B2 (en) | 2019-06-21 | 2025-04-29 | Lg Electronics Inc. | Display device using micro LED, and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7224020B2 (ja) | 2023-02-17 |
| WO2017065566A1 (ko) | 2017-04-20 |
| EP3364465A4 (en) | 2018-10-10 |
| US20180315887A1 (en) | 2018-11-01 |
| CN108352425A (zh) | 2018-07-31 |
| JP2018530924A (ja) | 2018-10-18 |
| KR20180061373A (ko) | 2018-06-07 |
| EP3364465A1 (en) | 2018-08-22 |
| CN108352425B (zh) | 2022-02-11 |
| US10340417B2 (en) | 2019-07-02 |
| EP3364465B1 (en) | 2019-12-18 |
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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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