KR102262617B1 - Deposition control device and method for manufacturing display using thereof - Google Patents

Abstract

Provided are a deposition control device for effectively measuring a deposition rate, and a display manufacturing method using the same. According to some embodiments, the deposition control device comprises: a first deposition source spraying a deposition material along a first spraying path; a second deposition source spraying the deposition material along a second spraying path; a deposition sensor for measuring deposition thickness of the deposition material; and a first deposition measurement position control mechanism having a first opening and a second opening, wherein the first deposition position control mechanism is moved so that the first spraying path passes the first opening to meet the deposition sensor.

Description

A deposition control device and a display manufacturing method using the same

The present invention relates to a deposition control apparatus and a display manufacturing method using the same. In more detail, the deposition sensor and the sensor driving device of the sensing unit for measuring the deposition rate do not move, but only the deposition measurement position control mechanism moves, and the deposition control device and the display using the same measure only the rate of the deposition material sprayed from a specific nozzle It relates to a manufacturing method.

Recently, an organic light emitting diode display (OLED), which has excellent luminance characteristics and viewing angle characteristics, and does not require a separate light source unlike a liquid crystal display device, is attracting attention as a next-generation flat panel display device. Since the organic light emitting diode display does not require a separate light source, it can be manufactured to be lightweight and thin. In addition, the organic light emitting diode display has characteristics such as low power consumption, high luminance, and high response speed.

An organic light emitting diode display includes an organic light emitting diode including an anode, an organic light emitting layer, and a cathode. In the organic light-emitting device, holes and electrons are respectively injected from the anode and the cathode to form excitons, and light is emitted while the excitons transition to a ground state.

A deposition apparatus for manufacturing an organic light emitting display device includes a deposition source for providing a deposition material on a substrate and a sensing unit for measuring a thickness of the deposition material deposited on the substrate. The sensing unit includes a deposition sensor, and the deposition sensor measures an evaporation amount and a deposition rate of a deposition material evaporated from an deposition source. The thickness of the deposition material deposited on the substrate is determined according to the evaporation rate and the deposition rate (or rate) measured by the deposition sensor. Therefore, in order to make the deposition thickness formed on the substrate uniform, it is necessary to accurately measure the deposition rate. In this case, when a plurality of deposition sources are used for deposition in order to increase the uniformity of the deposition thickness in the substrate on a large-area substrate, the deposition sensor independently measures the evaporation amount and deposition rate of the deposition material sprayed from the measurement target deposition source.

The technical problem to be solved by the present invention is to select only the deposition material sprayed from the deposition source to be measured through the movement of the deposition measurement position control mechanism surrounding at least a part of the outside of the measurement sensor, not the measurement sensor to efficiently select the deposition material rate It is to provide a deposition control device that measures and controls.

Another technical problem to be solved by the present invention is to select only the deposition material sprayed from the deposition source to be measured through the movement of the deposition measurement position control mechanism surrounding at least a part of the outside of the measurement sensor, not the measurement sensor, to determine the deposition material rate An object of the present invention is to provide a method for manufacturing a display using a deposition control device that efficiently measures and controls.

The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

A deposition control apparatus according to some embodiments of the present invention for achieving the above technical problem includes a first deposition source for spraying a deposition material along a first injection path, and a second deposition for spraying a deposition material along a second injection path won; a deposition sensor for measuring a deposition thickness of the deposition material, and a first deposition measurement position control mechanism including a first opening and a second opening, wherein the first deposition position control mechanism is moved so that the first jetting path is changed to a first It passes through the opening and meets the deposition sensor.

In the deposition control apparatus according to some embodiments, the first deposition position control mechanism is moved so that the second jetting path passes through the second opening to meet the deposition sensor.

The deposition control apparatus according to some embodiments further includes a motor drive shaft for moving the first deposition position control mechanism, and a drive shaft position sensor for sensing a position of the motor drive shaft.

A deposition control device according to some embodiments includes a sensor driving device for driving a deposition sensor, a controller for calculating a deposition rate by controlling the sensor driving device and a driving shaft position sensor, and a PID for generating a PID calculation value by performing a PID calculation on the deposition rate It further includes an operator and a power supply for generating power using the PID calculation value.

In an apparatus for controlling deposition according to some embodiments, the power supply includes a first power supply and a second power supply, the first power supply supplies the first power to the first deposition source, and the second power supply is the second power supply. A second power is supplied to the deposition source.

In the deposition control apparatus according to some embodiments, the first deposition source and the second deposition source include first and second heaters, respectively, for heating a deposition material.

In the deposition control apparatus according to some embodiments, the first deposition source further includes a third heater configured to heat the deposition material.

A deposition control apparatus according to some embodiments may include a first nozzle connected to a first deposition source to spray a deposition material to a first injection path, and a second deposition source to spray a deposition material to a second injection path. It further includes a second nozzle.

The deposition control apparatus according to some embodiments may further include a third nozzle connected to the first deposition source and configured to spray the deposition material into the third injection path.

A deposition control apparatus according to some embodiments further includes a second deposition measurement position control mechanism including a third opening and a fourth opening, wherein the second deposition position control mechanism is moved so that the first injection path is changed to the first opening and the third opening to meet the deposition sensor, or the second injection path passes through both the second opening and the fourth opening to meet the deposition sensor.

A deposition control apparatus according to some embodiments of the present invention for achieving the above technical problem includes a first deposition source for spraying a deposition material along a first injection path, and a second deposition for spraying a deposition material along a second injection path A circle, a deposition sensor for measuring the deposition thickness of the deposition material, and a deposition measurement position control mechanism connected to the pipe, wherein the deposition position control mechanism is moved so that the first jetting path passes through the pipe and meets the deposition sensor.

The deposition control apparatus according to some embodiments moves the deposition position control mechanism so that the second injection path passes through the pipe and meets the deposition sensor.

The deposition control apparatus according to some embodiments further includes a motor drive shaft for moving the deposition position control mechanism, and a drive shaft position sensor for sensing a position of the motor drive shaft.

A deposition control device according to some embodiments includes a sensor driving device for driving a deposition sensor, a controller for calculating a deposition rate by controlling the sensor driving device and a driving shaft position sensor, and a PID for generating a PID calculation value by performing a PID calculation on the deposition rate It further includes an operator and a power supply for generating power using the PID calculation value.

In an apparatus for controlling deposition according to some embodiments, the power supply includes a first power supply and a second power supply, the first power supply supplies the first power to the first deposition source, and the second power supply is the second power supply. A second power is supplied to the deposition source.

In the deposition control apparatus according to some embodiments, the first deposition source and the second deposition source include first and second heaters, respectively, for heating a deposition material.

In the deposition control apparatus according to some embodiments, the first deposition source further includes a third heater configured to heat the deposition material.

A deposition control apparatus according to some embodiments may include a first nozzle connected to a first deposition source to spray a deposition material to a first injection path, and a second deposition source to spray a deposition material to a second injection path. It further includes a second nozzle.

The deposition control apparatus according to some embodiments may further include a third nozzle connected to the first deposition source and configured to spray the deposition material into the third injection path.

In a display manufacturing method for depositing a deposition material on a substrate using a deposition control device, the display manufacturing method according to some embodiments of the present invention for achieving the above technical problem includes transferring the substrate, and the deposition control device and the substrate Depositing a deposition material evaporated by a deposition control device on a substrate in a state spaced apart by a predetermined interval, and returning the substrate on which the deposition material is deposited, wherein depositing the deposition material is performed through a deposition control device and periodically measuring the deposition rate of the deposition control device, comprising: a first deposition source for jetting a deposition material along a first jetting path; a second deposition source for jetting a deposition material along a second jetting path; a deposition sensor for measuring a deposition thickness of the material, and a deposition measurement position control mechanism comprising a first opening and a second opening, wherein the deposition position control mechanism is moved so that the first jet path passes through the first opening for depositing the material. meets the sensor.

In a display manufacturing method for depositing a deposition material on a substrate using a deposition control device, the display manufacturing method according to some embodiments of the present invention for achieving the above technical problem includes transferring the substrate, and the deposition control device and the substrate Depositing a deposition material evaporated by a deposition control device on a substrate in a state spaced apart by a predetermined interval, and returning the substrate on which the deposition material is deposited, wherein depositing the deposition material is performed through a deposition control device and periodically measuring the deposition rate of the deposition control device, comprising: a first deposition source for jetting a deposition material along a first jetting path; a second deposition source for jetting a deposition material along a second jetting path; a deposition sensor for measuring a deposition thickness of the material, and a deposition measurement position control mechanism connected to the pipe, wherein the deposition position control mechanism is moved so that a first jet path passes through the pipe and meets the deposition sensor.

The details of other embodiments are included in the detailed description and drawings.

The deposition control apparatus and the method of operating the deposition control apparatus of the present invention efficiently move the deposition measurement position control mechanism of the sensing unit to independently determine the deposition rate of deposition materials evaporated from a plurality of deposition sources from one deposition sensor having a fixed position. can be measured and controlled. In addition, by independently controlling the deposition rate of the deposition material evaporated from the plurality of deposition sources, it is possible to improve the uniformity of the deposition thickness in the substrate on a large area substrate.

1 is an exemplary diagram illustrating an apparatus for manufacturing a display including a deposition control apparatus according to some embodiments.
2 is an exemplary diagram illustrating a deposition control apparatus according to some embodiments.
3 is an exemplary diagram illustrating a sensing unit 300 according to some embodiments.
4 is another exemplary diagram illustrating another sensing unit 300 - 2 according to some embodiments.
5 is an exemplary exploded view of the deposition measurement position control mechanism 310 - 2 of FIG. 4 in accordance with some embodiments.
FIG. 6 is an exemplary view for explaining a principle in which a deposition rate is independently measured through the deposition control apparatus of FIG. 2 according to some embodiments.
7 is an exemplary graph in which the controller 200 measures a deposition rate according to some embodiments.
8 is an exemplary diagram illustrating another deposition control apparatus according to some embodiments.
9 is an exemplary view for explaining a principle of measuring a deposition rate through the deposition control apparatus of FIG. 8 according to some embodiments.
10 is an exemplary flowchart for describing a method of operating a deposition control apparatus according to some embodiments.
11 is an exemplary diagram illustrating a deposition control apparatus according to some embodiments.
12 is an exemplary diagram illustrating a sensing unit 300 - 3 of another deposition control apparatus according to some embodiments.
13 is an exemplary exploded view of the sensing unit 300 - 3 of FIG. 12 according to some embodiments.
14 is an exemplary diagram illustrating another deposition control apparatus according to some embodiments.
15 is an exemplary flowchart illustrating another method of operating a deposition control apparatus according to some embodiments.
16 is an exemplary graph in which a thickness of a deposition material deposited on a substrate is measured by a deposition control apparatus according to some embodiments.
17 is another exemplary graph in which a thickness of a deposition material deposited on a substrate is measured by a conventional deposition control apparatus.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims. Relative sizes of layers and regions in the drawings may be exaggerated for clarity of description. Like reference numerals refer to like elements throughout.

When an element is referred to as being “connected to” or “coupled to” another element with another element, it means that it is directly connected or coupled to another element, or with the other element intervening. including all cases. On the other hand, when one element is referred to as "directly connected to" or "directly coupled to" with another element, it indicates that another element is not interposed therebetween.

Like reference numerals refer to like elements throughout. “and/or” includes each and every combination of one or more of the recited items.

Reference to an element or layer “on” or “on” another element or layer includes not only directly on the other element or layer, but also with intervening other layers or elements. include all On the other hand, reference to an element "directly on" or "immediately on" indicates that no intervening element or layer is interposed.

Although first, second, etc. are used to describe various elements, components, and/or sections, it should be understood that these elements, components, and/or sections are not limited by these terms. These terms are only used to distinguish one element, component, or sections from another. Accordingly, it goes without saying that the first element, the first element, or the first section mentioned below may be the second element, the second element, or the second section within the spirit of the present invention.

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. As used herein, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, "comprises" and/or "comprising" refers to the presence of one or more other components, steps, operations and/or elements mentioned. or addition is not excluded.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly defined in particular.

1 is an exemplary diagram illustrating an apparatus for manufacturing a display including a deposition control apparatus according to some embodiments.

Referring to FIG. 1 , a display manufacturing apparatus including a deposition control device according to some embodiments includes a substrate S disposed in a vacuum chamber 30 , a deposition unit 100 , a sensing unit 300 , and a control unit 200 . ) is included.

The vacuum chamber 30 may prevent foreign substances from being introduced from the outside. In addition, when the deposition material formed on the substrate S is sprayed from the deposition unit 100, the vacuum chamber 30 is a vacuum chamber (for example, R1 to R3) in order to ensure straightness of the injection path (eg, R1 to R3). 30) It can keep the inside in a high vacuum state. For reference, the injection path is not limited to this figure and may have more injection paths.

The deposition unit 100 may vaporize the thin film manufacturing target material by heating the deposition material in order to manufacture a display. In this case, the deposition unit 100 includes a first jetting path R1 , a second jetting path R2 , or a third jetting path R3 in which each starting point is arranged in a line parallel to the substrate S in the x-axis direction. may be injected to the substrate S through the . The substrate S may be fixed by a supporting means although not shown. Also, although not shown, the substrate S may be transferred in the y-axis direction by a transfer means.

The deposition area 20 is formed on the substrate S by spraying the deposition material through each of the first jetting path R1, the second jetting path R2, or the third jetting path R3. It can be an area.

Although the deposition regions 20 corresponding to the first to third injection paths R1 , R2 , and R3 are shown to be spaced apart from each other, this is only for convenience of description and is not limited thereto. For example, at least a portion of the first injection path R1 and the second injection path R2 may overlap. Through this, at least a portion of the deposition region 20 on the substrate S may include the deposition material that has moved through the first jetting path R1 and the second jetting path R2 .

In order to improve the operation reliability of the display manufacturing apparatus, the uniformity of the thickness of the deposition material forming the deposition region 20 should be improved. In order to improve the uniformity of the thickness of the deposition material forming the deposition region 20 , the rate (or speed) of the deposition material sprayed from the deposition unit 100 is independently measured for each injection path through the sensing unit 300 . It needs to be measured and controlled.

In order to measure the rate of the deposition materials sprayed from the deposition unit 100 , the sensing unit 300 is independently configured for each deposition material injected through the first injection path R1 to the third injection path R3 . measure the rate.

For example, the sensing unit 300 may be sprayed through the second injection path R2 and the third injection path R3 in order to increase accuracy of rate measurement of the deposition material injected through the first injection path R1. The ingress of the deposition material must be prevented. Alternatively, the sensing unit 300 may include the deposition material injected through the first injection path R1 and the third injection path R3 in order to increase the accuracy of rate measurement of the deposition material injected through the second injection path R2 . should prevent the influx of Alternatively, the sensing unit 300 may include the deposition material injected through the first injection path R1 and the second injection path R2 in order to increase the accuracy of rate measurement of the deposition material injected through the third injection path R3 . should prevent the influx of

At this time, in the case of measuring the deposition material rate of the corresponding injection path by moving the measuring sensor and the sensor driving device in the sensing unit 300 , for example, due to the movement of the weight of the heavy measuring sensor and the sensor driving device, the display manufacturing apparatus The load on the can be increased.

Accordingly, in the display manufacturing apparatus including the deposition control device according to some embodiments, the measurement sensor and the sensor driving device in the sensing unit 300 are fixed, and through the movement of the deposition measurement position control mechanism surrounding at least a portion of the measurement sensor, Only the injection path of the deposition material to be measured can be selected and measured. Through this, an operation cycle of the display manufacturing apparatus may be accelerated, and control through the controller 200 may be more precise. In addition, since the heavy deposition sensor 340 and the sensor driving device 350 do not move, a load on the display manufacturing device may be reduced.

Hereinafter, the configuration and operation of the deposition control apparatus according to some embodiments will be described in detail. Hereinafter, for convenience of description, the substrate S, the deposition region 20 , and the chamber 30 will be omitted from the drawings.

2 is an exemplary diagram illustrating a deposition control apparatus according to some embodiments. For reference, FIG. 2 shows only two deposition sources 112 and 122 .

1 and 2 , the deposition control apparatus 1 according to some embodiments includes a deposition unit 100 , a control unit 200 , and a sensing unit 300 .

The deposition unit 100 according to some embodiments includes a first deposition source 112 and a second deposition source 122 . The first deposition source 112 and the second deposition source 122 may include organic or inorganic materials.

The first deposition source 112 and the second deposition source 122 may be formed of a non-metallic material such as ceramic or a metallic material according to the characteristics of the deposition thin film deposited on the substrate S. In addition, the first deposition source 112 and the second deposition source 122 may have a cylindrical shape having a predetermined diameter or a polygonal shape having a predetermined cross-sectional area. In addition, the first deposition source 112 and the second deposition source 122 may have rounded corners in order to minimize stress generated at the corners.

The first deposition source 112 and the second deposition source 122 include a first heater 114 and a second heater 124 , respectively. Each of the first heater 114 and the second heater 124 may heat a deposition material included in each of the first deposition source 112 and the second deposition source 122 . The first heater 114 and the second heater 124 heat the evaporation material included in each of the first deposition source 112 and the second deposition source 122 to a predetermined temperature through a signal received from the controller 200 . can do.

In addition, each of the first deposition source 112 and the second deposition source 122 includes a first nozzle 116 for spraying the deposition material through the first jetting path R1 and the deposition material through the second jetting path R2 , respectively. It is connected to the second nozzle 126 for spraying. The first nozzle 116 and the second nozzle 126 may be included in one configuration with the first deposition source 112 and the second deposition source 122 , respectively, or may be detachably coupled as separate configurations.

In the first nozzle 116 and the second nozzle 126 , injection holes may be formed so that the first deposition source 112 and the second deposition source 122 are interlocked with an accommodating space containing the deposition material. A cross-sectional shape of the injection hole in the vertical direction is not limited to this drawing according to the characteristics of the deposition thin film to be deposited, and may have various shapes. According to some embodiments, the first nozzle 116 and the second nozzle 126 may be venturi nozzles whose diameters decrease toward the exit in the height direction. According to some other embodiments, the middle of the conduit between the first nozzle 116 and the second nozzle 126 may be an orifice nozzle having a smaller diameter than the cross-sectional area of the end of the conduit. Each of the deposition paths R1 and R2 may correspond to each of the nozzles 116 and 126 .

The deposition material may be delivered to the deposition sensor 340 in the sensing unit 300 through any one of the first jetting path R1 and the second jetting path R2 . For example, when the deposition material injected from the first nozzle 116 is transferred to the deposition sensor 340 along the first injection path R1 , the deposition material injected from the second nozzle 126 is transferred to the deposition sensor 340 . ) is not transmitted. Conversely, when the deposition material injected from the second nozzle 126 is transferred to the deposition sensor 340 along the second injection path R2 , the deposition material injected from the first nozzle 116 is transferred to the deposition sensor 340 . not transmitted

That is, in order to accurately measure the rate of the deposition material to be measured, the deposition control apparatus 1 according to some embodiments receives only the measurement target deposition material injected from the measurement target nozzle through the sensing unit 300, and measures The deposition material injected from the nozzle other than the target may be controlled not to be transmitted to the sensing unit 300 . In this case, the deposition sensor 340 and the sensor driving device 350 of the sensing unit 300 of the deposition control device 1 do not move along the path of the measurement target evaporation material, but the deposition measurement position control device 310 moves. By doing so, the operation cycle of the deposition control device 1 can be accelerated. In addition, since the deposition sensor 340 and the sensor driving device 350 having a relatively heavy weight do not move, a load is formed on the deposition control device 1 to be small, so that the durability of the deposition control device 1 can be increased. have. The movement of the deposition measuring position control mechanism 310 will be described in detail through the description of the sensing unit 300 .

The deposition unit 100 in this figure is illustrated by way of example, and the shape and number of deposition sources in the deposition unit 100 are not limited thereto.

The sensing unit 300 according to some embodiments includes a deposition sensor 340 measuring a rate or thickness of a deposition material, and a sensor driving device 350 driving the deposition sensor 340 . In addition, the sensing unit 300 according to some embodiments includes a deposition measurement position control mechanism 310 that selects and passes the deposition material sprayed to the deposition sensor 340 . In addition, the sensing unit 300 according to some embodiments includes a motor driving shaft 370 for moving the deposition measurement position control mechanism 310 , and a driving shaft position sensor 330 for detecting a change in the position of the motor driving shaft 370 . .

The deposition sensor 340 may be, for example, a Quartz Crystal Microbalance (QCM) sensor, but is not limited thereto. In the case of a QCM sensor, a modifier (not shown) in the QCM sensor may vibrate at a constant frequency due to the piezoelectric effect. In this case, as the deposition material is deposited on the modifier, a frequency of the modifier may be changed. Through this frequency change, the rate (or velocity) of the deposition material and/or the deposition thickness at which the deposition material is deposited on the deposition region may be measured.

The sensor driving device 350 may include the deposition sensor 340 or may be connected to the deposition sensor 340 to replace the deposition sensor 340 .

The deposition measurement position control mechanism 310 may include a plurality of openings to transmit only the deposition material to be measured by the deposition sensor 340 to the deposition sensor 340 . This will be described in detail with reference to FIG. 3 .

3 is an exemplary diagram illustrating a sensing unit 300 according to some embodiments.

2 and 3 , the deposition measurement position control mechanism 310 may include a first opening 322 and a second opening 324 . The number and shape of the openings are not limited by this drawing, and the deposition measurement position control mechanism 310 may include various shapes and numbers.

The deposition measurement position control mechanism 310 may be connected to the motor driving shaft 370 and rotate together with the rotation of the motor driving shaft 370 . In this case, the deposition measurement position control mechanism 310 may arrange the opening and the deposition sensor 340 in a predetermined direction so that only the target deposition material to be measured by the deposition sensor 340 reaches the deposition sensor 340 .

For example, it is assumed that the rate or the deposition thickness of the deposition material sprayed from the first deposition source 112 through the deposition sensor 340 is measured. At this time, the deposition measuring position control mechanism 310 is rotated through the motor driving shaft 370 to align the first opening 322 and the deposition sensor 340 side by side. When the first opening 322 and the deposition sensor 340 are aligned, the deposition material injected from the first deposition source 112 moves through the first injection path R1 and passes through the first opening 322 and It may meet the deposition sensor 340 . In this case, the second injection path R2 through which the deposition material injected from the second deposition source 122 is injected does not pass through the first opening 322 , and thus cannot meet the deposition sensor 340 .

That is, the second injection path R2 through which the deposition material injected from the second deposition source 122 is injected may meet the remaining area except for the first opening 322 of the deposition measurement position control mechanism 310 .

As another example, it is assumed that the rate or the deposition thickness of the deposition material sprayed from the second deposition source 122 through the deposition sensor 340 is measured. At this time, the deposition measuring position control mechanism 310 is rotated through the motor driving shaft 370 to align the second opening 324 and the deposition sensor 340 side by side. When the second opening 324 and the deposition sensor 340 are aligned, the deposition material injected from the second deposition source 122 moves through the second injection path R2 and passes through the second opening 324 and It may meet the deposition sensor 340 . In this case, the first injection path R1 through which the deposition material injected from the first deposition source 112 is injected does not pass through the second opening 324 , and thus cannot meet the deposition sensor 340 .

That is, the first injection path R1 through which the deposition material injected from the first deposition source 112 is injected may meet the remaining area except for the second opening 324 of the deposition measurement position control mechanism 310 .

According to some embodiments, the deposition measurement position control mechanism 310 may use a plurality of deposition position control mechanisms in order to increase the accuracy that only the target deposition material to be measured by the deposition sensor 340 reaches the deposition sensor 340 . can An example using a plurality of deposition position control mechanisms will be described with reference to FIG. 4 .

4 is another exemplary diagram illustrating another sensing unit 300 - 2 according to some embodiments.

Referring to FIG. 4 , the deposition measurement position control mechanism 310 - 2 includes a first deposition measurement position control mechanism 312 and a second deposition measurement position control mechanism 314 . The number of sub-deposition measurement position control mechanisms included in the deposition measurement position control mechanism 310 - 2 is not limited thereto.

The first deposition measurement position control mechanism 312 may include a first opening 322 and a second opening 324 . In addition, the second deposition measurement position control mechanism 314 may include a third opening 326 and a fourth opening 328 . The number and shape of the openings are not limited by this figure, and the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 may include various shapes and numbers of openings.

The first deposition measurement position control mechanism 312 may be connected to the motor driving shaft 370 and rotate together with the rotation of the motor driving shaft 370 . In this case, the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 may be connected by a first distance D1 . Accordingly, through the rotation of the motor drive shaft 370 , the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 may rotate together. According to some embodiments, the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 may be connected such that the first opening 322 and the third opening 326 are parallel to each other. Also, the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 may be connected such that the second opening 324 and the fourth opening 328 are parallel to each other.

In this case, the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 operate with the opening and deposition so that only the target deposition material to be measured by the deposition sensor 340 reaches the deposition sensor 340 . The sensors 340 may be arranged in a predetermined direction.

For example, it is assumed that the rate or the deposition thickness of the deposition material sprayed from the first deposition source 112 through the deposition sensor 340 is measured. At this time, the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 are rotated through the motor driving shaft 370 to connect the first opening 322 and the third opening 326 to the deposition sensor ( 340) and aligned side by side. When the first opening 322 and the third opening 326 are aligned with the deposition sensor 340 , the deposition material injected from the first deposition source 112 is injected through the first injection path R1 , It may pass through the opening 322 and the third opening 326 and may meet the deposition sensor 340 . In this case, the second injection path R2 through which the deposition material injected from the second deposition source 122 is injected does not pass through the first opening 322 and/or the third opening 326 , so that the deposition sensor 340 . can't meet

That is, the second injection path R2 through which the deposition material injected from the second deposition source 122 is injected is a region other than the first opening 322 of the first deposition measurement position control mechanism 312 and/or the second injection path R2 . 2 may meet the remaining regions except for the third opening 326 of the deposition measurement position control mechanism 314 .

As another example, it is assumed that the rate or the deposition thickness of the deposition material sprayed from the second deposition source 122 through the deposition sensor 340 is measured. At this time, the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 are rotated through the motor driving shaft 370 to connect the second opening 324 and the fourth opening 328 to the deposition sensor ( 340) and aligned side by side. When the second opening 324 and the fourth opening 328 are aligned with the deposition sensor 340 , the deposition material injected from the second deposition source 122 is injected through the second injection path R2 , and the second It may pass through the opening 324 and the fourth opening 328 and may meet the deposition sensor 340 . At this time, the first injection path R1 through which the deposition material injected from the first deposition source 112 is injected does not pass through the second opening 324 and/or the fourth opening 328 , so that the deposition sensor 340 . can't meet

That is, the first injection path R1 through which the deposition material injected from the first deposition source 112 is injected is a region other than the second opening 324 of the first deposition measurement position control mechanism 312 and/or the second injection path R1 . 2 It may meet the remaining regions except for the fourth opening 328 of the deposition measurement position control mechanism 314 .

5 is an exemplary exploded view of the deposition measurement position control mechanism 310 - 2 of FIG. 4 in accordance with some embodiments.

Referring to FIG. 5 , the first deposition measurement position control mechanism 312 and the second deposition measurement position control mechanism 314 may be connected to be spaced apart from each other by a first distance D1 , and the first distance D1 may be arbitrarily selected. can be set. Further, the deposition measurement position control mechanism according to some embodiments is not limited to the two deposition measurement position control mechanisms described above, but may be three, four, or more.

Referring back to FIG. 2 , the sensing unit 300 may accurately select the measurement material injected through the injection path to be measured through the deposition sensor 340 by moving the deposition measurement position control mechanism 310 and adjusting it. In this case, the deposition measurement position control mechanism 310 may determine the current position of the motor driving shaft 370 through the driving shaft position sensor 330 . Based on the current position of the motor driving shaft 370 detected by the driving shaft position sensor 330 , it may be confirmed through which injection path the deposition material to be measured currently enters. Also, when it is necessary to change the deposition material to be measured, the motor driving shaft 370 may be moved through the driving shaft position sensor 330 to move the deposition measurement position control mechanism 310 .

The operation of the sensing unit 300 may be controlled through the control unit 200 . In more detail, the controller 202 of the sensing unit 300 may control the position of the driving shaft 370 by determining the deposition material to be measured from the driving shaft position sensor 330 . Also, the controller 202 of the sensing unit 300 may determine the deposition material to be measured, and set a measurement time for measuring the deposition material to be measured.

The controller 202 may determine whether to replace the deposition sensor 340 and transmit a replacement command for the deposition sensor 340 to the sensor driving device 350 . The controller 202 may also calculate the deposition rate by using the information on the deposition material received through the deposition sensor 340 . Referring to FIG. 6 , the principle of independently measuring the deposition rate by the controller 202 will be described in detail.

FIG. 6 is an exemplary view for explaining a principle in which a deposition rate is independently measured through the deposition control apparatus of FIG. 2 according to some embodiments.

Referring to FIG. 6 , the deposition sensor 340 measures the rate of the deposition material injected through the first injection path R1 and the principle of measuring the rate of the deposition material injected through the second injection path R2. Explain the principle.

For convenience of description, the deposition measurement position mechanism is omitted from the drawings, and it is assumed that the deposition material injected through each injection path is the deposition material that reached the deposition sensor 340 through the movement of the deposition measurement position mechanism. .

Here, the first imaginary line L1 is an imaginary line parallel to the direction in which the first deposition source 112 and the first nozzle 116 are erected toward the substrate. The second imaginary line L2 is an imaginary line parallel to the direction in which the second deposition source 122 and the second nozzle 126 are erected toward the substrate. The third imaginary line L3 is a imaginary line perpendicular to a surface where the deposition material meets the deposition sensor 340 .

First, a principle in which the deposition sensor 340 measures the rate of the deposition material injected from the first deposition source 112 will be described.

1)을 형성하여 증착 센서(340)로 분사될 수 있다. 이때, 제1 분사 경로(R1)를 통해 분사된 증착 물질은 제3 가상선(L3)과 제1 수신각(φ1)을 형성하여 증착 센서(340)와 만날 수 있다. 이를 통해, 제1 증착원(112)으로부터 분사된 증착 물질의 레이트(G1)는 아래의 수학식 1과 같이 표현될 수 있다.The deposition material sprayed through the first injection path R1 has a first imaginary line L1 and a first injection angle (

1) may be formed and sprayed to the deposition sensor 340 . In this case, the deposition material sprayed through the first injection path R1 may form a third virtual line L3 and a first reception angle φ1 to meet the deposition sensor 340 . Through this, the rate G1 of the deposition material injected from the first deposition source 112 may be expressed as Equation 1 below.

수학식 1

Equation 1

In Equation 1, K _{1 is a proportional coefficient, and the first nozzle 116 at a point on the substrate (r 1} = 1m) that is 1 meter away from the center of the first nozzle 116 in the direction of the first imaginary line L1. corresponds to the deposition rate by , and has a larger value as the temperature of the first heater 114 increases. n ₁ is an evaporation distribution index of the deposition material injected from the first nozzle 116 .

Next, a principle in which the deposition sensor 340 measures the rate of the deposition material sprayed from the second deposition source 122 will be described.

2)을 형성하여 증착 센서(340)로 분사될 수 있다. 이때, 제2 분사 경로(R2)를 통해 분사된 증착 물질은 제3 가상선(L3)과 제2 수신각(φ2)을 형성하여 증착 센서(340)와 만날 수 있다. 이를 통해, 제2 증착원(122)으로부터 분사된 증착 물질의 레이트(G2)는 아래의 수학식 2와 같이 표현될 수 있다.The deposition material sprayed through the second injection path R2 may have a second imaginary line L2 and a second injection angle (

2) may be formed and sprayed to the deposition sensor 340 . In this case, the deposition material injected through the second injection path R2 may form a third virtual line L3 and a second reception angle φ2 to meet the deposition sensor 340 . Through this, the rate G2 of the deposition material injected from the second deposition source 122 may be expressed as Equation 2 below.

수학식 2

Equation 2

In Equation 2, K _{2 is a proportional coefficient, and the second nozzle 126 at a point on the substrate (r 2} = 1m) that is 1 meter away from the center of the second nozzle 126 in the direction of the second imaginary line L2. corresponds to the deposition rate by , and has a larger value as the temperature of the second heater 124 increases. n ₂ is an evaporation distribution index of the deposition material injected from the second nozzle 126 .

7 is an exemplary graph in which the controller 200 measures a deposition rate according to some embodiments.

2 and 7, the deposition sensor 340 obtains the rate (eg, G1 in Equation 1) of the deposition material sprayed from the first deposition source 112 during the first period P1, During the second period P2 , the deposition sensor 340 may obtain a rate (eg, G2 in Equation 2) of the deposition material injected from the second deposition source 122 .

The first section P1 and the second section P2 may vary according to a measurement time set by the controller 202 .

The controller 202 may obtain an average deposition rate in each of the first period P1 and the second period P2 .

For reference, the controller 200 of FIG. 2 is not limited thereto, and is divided into a controller that obtains an average deposition rate in the first section P1 and a controller that obtains an average deposition rate in the second section P2. can

1), 제1 수신각(φ1), 제1 노즐(116)의 증발 분포 지수(n₁), 제2 분사각(

2), 제2 수신각(φ2), 제2 노즐(136)의 증발 분포 지수(n₂) 등의 상수값을 상술한 수학식 1과 수학식 2에 대입하면, 비례 계수 K₁과 K₂가 산출된다.The rate of deposition material measured by the deposition sensor 340 (eg, G1 in Equation 1, G2 in Equation 2) and the first injection angle (eg, G2 in Equation 2) obtained through separate measurement

1), the first reception angle (φ1), the evaporation distribution index of the first nozzle 116 (n ₁ ), the second injection angle (

2), when constant values such as the second reception angle φ2 and the evaporation distribution index (n ₂ ) of the second nozzle 136 are substituted into the above-mentioned Equations 1 and 2, the proportional coefficients K ₁ and K ₂ is calculated

Referring to FIGS. 1 and 6 , in a conventional display manufacturing apparatus, since the substrate is disposed perpendicular to the first imaginary line L1 and the second imaginary line L2, the uniformity of the thickness of the deposition material deposited on the substrate is proportional The coefficients K ₁ and K ₂ are determined. Therefore, the rate (eg, G1 of Equation 1, G2 of Equation 2) measured through the deposition sensor 340 is calculated so _{that K 1} and K ₂ values that minimize the thickness uniformity on the substrate are obtained. When controlled, the thickness uniformity of the deposition material deposited on the substrate S may be improved.

Referring back to FIG. 2 , the deposition rate calculated through the controller 202 may be transmitted to each of the first PID operator 212 and the second PID operator 222 .

The first PID operator 212 may generate a first PID operation value by performing a PID operation using the rate of the deposition material injected through the first injection path R1 received from the controller 202 . Thereafter, the first PID operator 212 may transmit the first PID operation value to the first power supply 214 to adjust the power delivered to the first deposition source 112 .

Similarly, the second PID operator 222 may generate a second PID operation value by performing a PID operation using the rate of the deposition material injected through the second injection path R2 received from the controller 202 . have. Thereafter, the second PID operator 222 may transmit the second PID operation value to the second power supply 224 to control the power delivered to the second deposition source 122 .

Thereafter, the first power supply 214 and the second power supply 224 receiving the first PID operation value and the second PID operation value from each of the first PID operator 212 and the second PID operator 222 are Power to be supplied to the first deposition source 112 and the second deposition source 122 may be transmitted, respectively.

For reference, the first PID operator 212 and the second PID operator 222 of FIG. 2 are not limited thereto, and the first PID operator 212 and the second PID operator 222 are merged into one PID operator. can be merged. That is, each PID operation may be performed using the rate of the deposition material injected through each injection path within one PID operator.

The first deposition source 112 and the second deposition source 122 supplied with power from the first power supply 214 and the second power supply 224, respectively, have a first heater 114 and a second heater 124, respectively. ) by heating the deposition material, the deposition material may be sprayed again through the first nozzle 116 and the second nozzle 126 .

For reference, the power supply 214 and the power supply 224 of FIG. 2 are not limited thereto, and may be merged into one power supply. That is, power to be supplied to the first deposition source 112 and the second deposition source 122 may be transmitted through one power supply, respectively.

Hereinafter, the deposition control apparatus of FIG. 1 according to some exemplary embodiments and the deposition control apparatus according to some other exemplary embodiments will be described with reference to FIG. 8 . Since the method of measuring the rate of the deposition material is the same as that described above, a description overlapping with the above description will be omitted and the differences will be mainly described.

8 is an exemplary diagram illustrating another deposition control apparatus according to some embodiments.

Referring to FIG. 8 , the deposition unit 100 - 2 of the deposition control apparatus 2 according to some embodiments is different from the deposition unit 100 of FIG. 2 . That is, in the deposition control apparatus 2 according to some embodiments, the deposition material injected through the first injection path R1 and the deposition material injected through the second injection path R2 are separated from one deposition source 112 . can be sprayed.

A plurality of heaters are included in the deposition source 112 according to some embodiments. For example, the deposition source 112 includes a first heater 114 and a second heater 124 , and includes a deposition material sprayed through the first injection path R1 and a second injection path R2 . Each of the sprayed deposition materials is heated.

The deposition source 112 according to some embodiments is connected to the first nozzle 116 and the second nozzle 126 , and each of the first nozzle 116 and the second nozzle 126 is connected to the first injection path R1 . ) and the deposition material injected through the second injection path R2 may be injected to the deposition sensor 340 .

9 is an exemplary view for explaining a principle of measuring a deposition rate through the deposition control apparatus of FIG. 8 according to some embodiments.

Referring to FIG. 9 , a deposition rate measurement principle in the case of spraying a deposition material through a plurality of injection paths through a single deposition source 112 will be described. Although the principle of measuring the deposition rate of the deposition material sprayed from the plurality of deposition sources has been described in FIG. 6 , the deposition rate measurement principle of FIG. 9 is the same as that of FIG. 6 except that the shape of the deposition source is different, and thus a description thereof will be omitted.

10 is an exemplary flowchart for describing a method of operating a deposition control apparatus according to some embodiments.

For reference, the display manufacturing method according to some embodiments may include an operation of transferring the substrate before the operation of the deposition control apparatus described in FIG. 10 and transferring the substrate after the operation of the deposition control apparatus.

Referring to FIGS. 2 and 10 , first, the position of the motor driving shaft 370 is determined through the driving shaft position sensor 330 ( S100 ), and the deposition rate of the deposition material to be measured is periodically measured.

Thereafter, based on the position of the motor drive shaft 370 , a measurement target nozzle for spraying a measurement target deposition material to be transmitted to the deposition sensor 340 through the deposition measurement position control mechanism 310 is determined, and the measurement target deposition material is selected A measurement time for measurement is set (S110).

The deposition rate of the deposition material sprayed from the nozzle to be measured during the previously set measurement time is calculated through the controller 202 ( S120 ).

Through the controller 202, the PID calculators 212 and/or 222 generate a PID calculation value based on the deposition rate of the deposition material calculated for the set measurement time (S130).

The power supply 214 and/or 224 receives the PID operation value and generates power (S140).

Power generated by power supply 214 and/or 224 may be delivered to evaporation source 112 and/or 122 or heater 114 and/or 124 to power each.

11 is an exemplary diagram illustrating a deposition control apparatus according to some embodiments.

Referring to FIG. 11 , unlike the sensing unit 300 of FIG. 2 , a pipe 360 is connected to the deposition measuring position device 310 - 3 of the sensing unit 300 - 3 . Further, a deposition sensor 340 and a sensor driving device 350 are disposed in the deposition measurement position mechanism 310 - 3 .

If the deposition control apparatus of FIGS. 2 and 8 according to some embodiments selectively passes the deposition material to be measured through the deposition sensor 340 through the opening in the deposition measurement position control mechanism, the deposition control apparatus of FIG. 11 according to some embodiments The deposition control device 6 may selectively pass the deposition material to be measured through the deposition sensor 340 through the pipe 360 connected to the deposition measurement location device 310 - 3 .

An operation of selectively passing the deposition material to be measured through the pipe 360 by the deposition control device 6 according to some embodiments to the deposition sensor 340 will be described in detail with reference to FIG. 12 .

12 is an exemplary diagram illustrating a sensing unit 300 - 3 of another deposition control apparatus according to some embodiments.

11 and 12 , the deposition sensor 340 and the sensor driving device 350 are fixed, and the deposition measurement position control mechanism 310 - 3 may move in M1 and M2 directions. For reference, although only a 180 degree rotation is illustrated in the drawings, this is for convenience of description and the deposition measuring position control mechanism 310 - 3 may be rotatable by 360 degrees.

As the deposition measurement position control mechanism 310 - 3 moves in the M1 and M2 directions, the pipe 360 may also move in the M1 and M2 directions. That is, only the deposition material to be measured may be incident into the pipe 360 by changing the position of the pipe 360 through the movement of the deposition measurement position control mechanism 310 - 3 . The shape of the pipe 360 is not limited to this figure.

For example, to measure the rate or thickness of the deposition material injected from the first deposition source 112 through the deposition sensor 340 , the deposition measurement position control mechanism 310 is rotated through the motor driving shaft 370 . to make the first injection path (R1) pass through the pipe (360). Thereafter, the deposition material injected from the first deposition source 112 may be injected through the first injection path R1 , pass through the pipe 360 , and may meet the deposition sensor 340 . In this case, the second injection path R2 through which the deposition material injected from the second deposition source 122 is injected does not pass through the pipe 360 , and thus cannot meet the deposition sensor 340 .

That is, the second injection path R2 through which the deposition material injected from the second deposition source 122 is injected may meet the remaining area except for the pipe 360 of the deposition measurement position control mechanism 310 - 3 .

For another example, if it is desired to measure the rate or the deposition thickness of the deposition material sprayed from the second deposition source 122 through the deposition sensor 340 , the deposition measurement position control mechanism 310 is operated through the motor driving shaft 370 . Rotate to make the second injection path (R2) pass through the pipe (360). Thereafter, the deposition material injected from the second deposition source 122 may be injected through the second injection path R2 , may pass through the pipe 360 , and may meet the deposition sensor 340 . In this case, the first injection path R1 through which the deposition material injected from the first deposition source 112 is injected does not pass through the pipe 360 , and thus cannot meet the deposition sensor 340 .

That is, the first injection path R1 through which the deposition material injected from the first deposition source 112 is injected may meet the remaining area except for the pipe 360 of the deposition measurement position control mechanism 310 - 3 .

13 is an exemplary exploded view of the sensing unit 300 - 3 of FIG. 12 according to some embodiments.

Referring to FIG. 13 , the deposition measurement position control mechanism 310 - 3 may move through the rotation of the motor driving shaft 370 .

Hereinafter, some different embodiments of the deposition control apparatus will be described with reference to FIG. 14 . Since the method of measuring the rate of the deposition material is the same as that described above, a description overlapping with the above description will be omitted and the differences will be mainly described.

14 is an exemplary diagram illustrating another deposition control apparatus according to some embodiments.

Referring to FIG. 14 , the deposition unit 100 - 2 of the deposition control apparatus 7 according to some embodiments is different from the deposition unit 100 of FIG. 11 . That is, in the deposition control apparatus 7 according to some embodiments, the deposition material injected through the first injection path R1 and the deposition material injected through the second injection path R2 are separated from one deposition source 112 . can be sprayed.

A plurality of heaters are included in the deposition source 112 according to some embodiments. For example, the deposition source 112 includes a first heater 114 and a second heater 124 , and includes a deposition material sprayed through the first injection path R1 and a second injection path R2 . Each of the sprayed deposition materials is heated.

The deposition source 112 according to some embodiments is connected to the first nozzle 116 and the second nozzle 126 , and each of the first nozzle 116 and the second nozzle 126 is connected to the first injection path R1 . ) and the deposition material injected through the second injection path R2 may be injected to the deposition sensor 340 .

15 is an exemplary flowchart illustrating another method of operating a deposition control apparatus according to some embodiments.

For reference, the display manufacturing method according to some embodiments may include an operation of transferring the substrate before the operation of the deposition control apparatus described in FIG. 10 and transferring the substrate after the operation of the deposition control apparatus.

11 and 15 , first, the position of the pipe 360 is determined ( S200 ) and the deposition rate of the deposition material to be measured is periodically measured.

Thereafter, based on the position of the pipe 360 , a measurement target nozzle for spraying a measurement target deposition material to be transmitted to the deposition sensor 340 through the deposition measurement position control mechanism 310 - 3 is determined, and the measurement target deposition material A measurement time is set for measuring (S210).

The deposition rate of the deposition material injected from the measurement target nozzle during the previously set measurement time is calculated through the controller 202 ( S220 ).

Through the controller 202, the PID calculators 212 and/or 222 generate a PID calculation value based on the deposition rate of the deposition material calculated for the set measurement time (S230).

The power supply 214 and/or 224 receives the PID operation value and generates power (S240).

Power generated by power supply 214 and/or 224 may be delivered to evaporation source 112 and/or 122 or heater 114 and/or 124 to power each.

16 is an exemplary graph in which a thickness of a deposition material deposited on a substrate is measured by a deposition control apparatus according to some embodiments.

1, 11 and 16 , it is assumed that the substrate S has a width of 1100 mm in the x-axis direction. In addition, it is assumed that four deposition sources are spaced apart from each other in the x-axis direction in the deposition part 100 under the substrate S.

Through the deposition control apparatus according to some embodiments, the rate of each deposition material sprayed from the four deposition sources included in the deposition unit 100 may be measured and controlled.

In this case, the graph of FIG. 16 is an exemplary graph in which the thickness of the deposition material deposited on the substrate (the vertical axis of the graph of FIG. 16 ) is measured along the x-axis direction (the horizontal axis of the graph of FIG. 16 ) of the substrate S.

Referring to Equations 1 and 2 described above, proportional coefficients K ₁ , K ₂ , K ₃ , and K ₄ corresponding to each of the four deposition sources exist. In this case, the ratio of proportional coefficients corresponding to each of the four deposition sources may be K ₁ : K ₂ : K ₃ : K ₄ = 2 : 1 : 1 : 2 . That is, by independently measuring and controlling the rate of the deposition material sprayed from each of the four deposition sources through the deposition control device according to some embodiments, the uniformity of the deposition thickness has a result within ±2% based on the average value of the thickness. can

17 is another exemplary graph in which a thickness of a deposition material deposited on a substrate is measured by a conventional deposition control apparatus.

Referring to FIG. 17 , the substrate has a width of 1100 mm in the x-axis direction. In addition, it is assumed that four deposition sources are spaced apart from each other in the x-axis direction in the deposition part under the substrate.

Through the conventional deposition control apparatus, it is possible to measure and control the rate of each deposition material sprayed from the four deposition sources included in the deposition unit.

At this time, the graph of FIG. 17 measures and controls the deposition rate of any one of the four deposition sources. Also, a power value that is uniformly proportional to a power value applied to one of the deposition sources may be applied to the remaining three deposition sources.

The graph of FIG. 17 shows the thickness of the deposition material deposited on the substrate (vertical axis of the graph of FIG. 17) in the x-axis direction (horizontal axis of the graph of FIG. 17) of the substrate when the deposition material is deposited on the substrate under the conditions as described above. It is an exemplary graph measured along.

By measuring and controlling the rate of the deposition material sprayed from each of the four deposition sources through a conventional deposition control device, the uniformity of the deposition thickness may be within ±5% based on the average value of the thickness.

Through this, it can be seen that the uniformity of the deposition thickness measured by the deposition control apparatus according to some embodiments shown in FIG. 16 is more uniform than the uniformity in the deposition thickness measured by the conventional deposition control apparatus illustrated in FIG. 17 . .

Although embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but may be manufactured in various different forms, and those of ordinary skill in the art to which the present invention pertains. It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

S: substrate 20: deposition region 30: vacuum chamber 100: deposition unit 112: first deposition source 114: first heater 116: first nozzle 122: second deposition source 124: second heater 126: second nozzle 200: controller 212: first PID operator 214: first power supply 222: second PID operator 224: second power supply R1: first injection path R2: second injection path 300: sensing unit 310: deposition measurement position control mechanism 312: second DESCRIPTION OF SYMBOLS 1 deposition measurement position control mechanism 314: second deposition measurement position control mechanism 322: first opening 324: second opening 326: third opening 328: fourth opening 330: drive shaft position sensor 340: deposition sensor 350: sensor driving device 360 : pipe 370: motor drive shaft D1: first distance L1: first virtual line L2: second virtual line L3: third virtual line P1: first section P2: second section

Claims (21)

a first deposition source for jetting a deposition material along a first jetting path on the substrate;
a second deposition source configured to spray the deposition material along a second injection path on the substrate;
a deposition sensor for measuring a deposition thickness of the deposition material;
a first deposition measurement position control mechanism comprising a first opening and a second opening;
a motor drive shaft for moving the first deposition measurement position control mechanism;
a drive shaft position sensor for detecting a position of the motor drive shaft;
a sensor driving device for driving the deposition sensor;
a controller controlling the sensor driving device and the driving shaft position sensor to calculate respective deposition rates by the first deposition source and the second deposition source from signal values of the deposition sensor measured for a set time;
a PID calculator for generating a PID calculated value by performing a PID operation on the deposition rate; and
a power supply for generating power to be respectively supplied to the first deposition source and the second deposition source by using the PID calculation value;
while the deposition material is simultaneously jetted onto the substrate along the first jetting path and the second jetting path, moving the first deposition measuring position control mechanism so that the first jetting path passes through the first opening to meet the deposition sensor,
The deposition control apparatus moves the first deposition measurement position control mechanism so that the second injection path passes through the second opening and meets the deposition sensor. delete delete delete The method of claim 1,
The power supply includes a first power supply and a second power supply,
The first power supply supplies a first power to the first deposition source,
The second power supply is a deposition control device for supplying a second power to the second deposition source. The method of claim 1,
and the first deposition source and the second deposition source include first and second heaters respectively configured to heat the deposition material. 7. The method of claim 6,
The first deposition source may further include a third heater configured to heat the deposition material. The method of claim 1,
a first nozzle connected to the first deposition source and configured to spray the deposition material into the first injection path; and
and a second nozzle connected to the second deposition source and configured to spray the deposition material into the second injection path. 9. The method of claim 8,
and a third nozzle connected to the first deposition source and configured to spray the deposition material through a third injection path. The method of claim 1,
a second deposition measurement position control mechanism comprising a third opening and a fourth opening;
The second deposition measurement position control mechanism moves,
The first injection path passes through both the first opening and the third opening to meet the deposition sensor, or the second injection path passes through both the second opening and the fourth opening to meet the deposition sensor Deposition control device. a first deposition source for jetting a deposition material along a first jetting path on the substrate;
a second deposition source configured to spray the deposition material along a second injection path on the substrate;
a deposition sensor for measuring a deposition thickness of the deposition material;
a deposition measurement position control mechanism connected to the pipe;
a motor drive shaft for moving the deposition measurement position control mechanism;
a drive shaft position sensor for detecting a position of the motor drive shaft;
a sensor driving device for driving the deposition sensor;
a controller controlling the sensor driving device and the driving shaft position sensor to calculate respective deposition rates by the first deposition source and the second deposition source from signal values of the deposition sensor measured for a set time;
a PID calculator for generating a PID calculated value by performing a PID operation on the deposition rate; and
a power supply for generating power to be respectively supplied to the first deposition source and the second deposition source by using the PID calculation value;
while the deposition material is simultaneously jetted onto the substrate along the first jetting path and the second jetting path, moving the deposition measuring position control mechanism so that the first jetting path passes through the pipe to the deposition sensor meet with,
The deposition control device moves the deposition measurement position control mechanism so that the second injection path passes through the pipe and meets the deposition sensor. delete delete delete 12. The method of claim 11,
The power supply includes a first power supply and a second power supply,
The first power supply supplies a first power to the first deposition source,
The second power supply is a deposition control device for supplying a second power to the second deposition source. 12. The method of claim 11,
and the first deposition source and the second deposition source include first and second heaters respectively configured to heat the deposition material. 17. The method of claim 16,
The first deposition source may further include a third heater configured to heat the deposition material. 12. The method of claim 11,
a first nozzle connected to the first deposition source and configured to spray the deposition material into the first injection path; and
and a second nozzle connected to the second deposition source and configured to spray the deposition material into the second injection path. 19. The method of claim 18,
and a third nozzle connected to the first deposition source and configured to spray the deposition material through a third injection path. A method of manufacturing a display for depositing a deposition material on a substrate using a deposition control device, the method comprising:
transferring the substrate;
depositing the deposition material evaporated by the deposition control device on the substrate while the deposition control device and the substrate are spaced apart by a predetermined distance;
returning the substrate on which the deposition material is deposited;
depositing the deposition material comprises periodically measuring a deposition rate of the deposition material via the deposition control device;
The deposition control device,
a first deposition source for spraying a deposition material along a first injection path on the substrate;
a second deposition source configured to spray the deposition material along a second injection path on the substrate;
a deposition sensor for measuring a deposition thickness of the deposition material;
a deposition measurement position control mechanism comprising a first opening and a second opening;
a motor drive shaft for moving the deposition measurement position control mechanism;
a drive shaft position sensor for detecting a position of the motor drive shaft;
a sensor driving device for driving the deposition sensor;
a controller controlling the sensor driving device and the driving shaft position sensor to calculate respective deposition rates by the first deposition source and the second deposition source from signal values of the deposition sensor measured for a set time;
a PID calculator for generating a PID calculated value by performing a PID operation on the deposition rate; and
a power supply for generating power to be respectively supplied to the first deposition source and the second deposition source by using the PID calculation value;
while the deposition material is simultaneously jetted onto the substrate along the first jetting path and the second jetting path, moving the deposition measuring position control mechanism so that the first jetting path passes through the first opening meet the deposition sensor,
The method for manufacturing a display by moving the deposition measurement position control mechanism so that the second jetting path passes through the second opening and meets the deposition sensor. A method of manufacturing a display for depositing a deposition material on a substrate using a deposition control device, the method comprising:
transferring the substrate;
depositing the deposition material evaporated by the deposition control device on the substrate while the deposition control device and the substrate are spaced apart by a predetermined distance;
returning the substrate on which the deposition material is deposited;
depositing the deposition material comprises periodically measuring a deposition rate of the deposition material via the deposition control device;
The deposition control device,
a first deposition source for spraying a deposition material along a first injection path on the substrate;
a second deposition source configured to spray the deposition material along a second injection path on the substrate;
a deposition sensor for measuring a deposition thickness of the deposition material;
a deposition measurement position control mechanism connected to the pipe;
a motor drive shaft for moving the deposition measurement position control mechanism;
a drive shaft position sensor for detecting a position of the motor drive shaft;
a sensor driving device for driving the deposition sensor;
a controller controlling the sensor driving device and the driving shaft position sensor to calculate respective deposition rates by the first deposition source and the second deposition source from signal values of the deposition sensor measured for a set time;
a PID calculator for generating a PID calculated value by performing a PID operation on the deposition rate; and
a power supply for generating power to be respectively supplied to the first deposition source and the second deposition source by using the PID calculation value;
while the deposition material is simultaneously jetted onto the substrate along the first jetting path and the second jetting path, moving the deposition measuring position control mechanism so that the first jetting path passes through the pipe to the deposition sensor meet with,
The method for manufacturing a display by moving the deposition measurement position control mechanism so that the second injection path passes through the pipe and meets the deposition sensor.

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