KR20080114305A - Evaporation control unit, evaporation equipment having the same, and method for controlling evaporation - Google Patents

Abstract

An evaporation control unit, a deposition apparatus including the same, and a method for controlling an amount of evaporation are provided to reduce the number of an evaporation sensor with a high price by sensing the amount of evaporation of each evaporation source while moving one evaporation sensor in an arrangement direction of a plurality of evaporation sources. An evaporation control unit(140) includes an evaporation sensor(141), an evaporation sensor driving unit(143), a power unit, and a control unit. An evaporation sensor includes a hot wire which receives and heats the deposition material. The evaporation sensor senses an amount of evaporation of a plurality of evaporation sources which are arranged separately. The evaporation sensor driving unit moves an evaporation sensor to a position to sense an amount of evaporation of each evaporation source. A power supply supplies a current to a heat source so that each evaporation source is heated. The controller sets up a reference temperature based on the amount of evaporation per unit hour at each evaporation source inputted from the evaporation sensor. The controller controls an evaporation sensor driving unit.

Description

Evaporation amount control unit, a vapor deposition apparatus and an evaporation amount control method including the same {EVAPORATION CONTROL UNIT, EVAPORATION EQUIPMENT HAVING THE SAME, AND METHOD FOR CONTROLLING EVAPORATION}

1A is a front perspective view schematically showing a deposition apparatus according to an embodiment of the present invention;

Figure 1b is a detailed view of the portion A of Figure 1a,

Figure 1c is a detailed view of the portion B of Figure 1a,

FIG. 2A is a rear perspective view of the deposition apparatus shown in FIG. 1; FIG.

Figure 2b is a detailed view of the portion C of Figure 2a,

Figure 2c is a detailed view of the portion D of Figure 2a,

3 is a control block diagram of the deposition apparatus shown in FIG. 1;

4 is a flowchart illustrating a method of controlling an evaporation amount of the deposition apparatus illustrated in FIG. 1;

5 is a detailed flowchart of the main part of FIG.

<Description of main reference numerals in the drawings>

100; Frame 120; Evaporation source

140; Evaporation control unit 141; Evaporation Sensor

143; Evaporation detection sensor drive unit 144; Drive motor for evaporation control

145; Ball screw 146 for adjusting evaporation amount; Guide unit for adjusting evaporation amount

150; A power supply unit 151; Control

160; Monitoring sensor unit 161; Monitoring sensor

164; Drive motor 165 for monitoring; Ball screw for monitoring

166; Guide unit for monitoring

The present invention relates to a deposition apparatus, and more particularly, to an evaporation amount adjusting unit capable of measuring and controlling evaporation amounts of a plurality of evaporation sources with one sensor, a deposition apparatus including the same, and a method for controlling evaporation amount.

Organic semiconductor devices including organic light emitting devices and the like can be largely divided into a method of manufacturing by evaporating a low molecular weight material in a vacuum, and a method of manufacturing by spin coating by dissolving a polymer material in a solvent.

In the case of manufacturing a low molecular weight organic light emitting device that manufactures a thin film at high vacuum (about 10 ^-7 Torr), the material packed in the evaporation source is heated and evaporated in a vacuum chamber exhausted and reduced by a vacuum pump to attach to a substrate. .

Recently, there is an increasing demand for a deposition apparatus capable of depositing materials on a large area substrate. Due to this increase in demand, a number of evaporation sources are installed in recently developed deposition apparatus. Each of the plurality of evaporation sources is provided with a measurement sensor for measuring the amount of evaporation of each evaporation source corresponding to the number of evaporation sources. The evaporation amount of each evaporation source is individually adjusted according to the evaporation amount input from each sensor. As such, the deposition rate is improved by performing the deposition operation using the plurality of evaporation sources, but there is a problem that not only the size of the equipment increases but also the price of the equipment increases. In particular, by installing a plurality of expensive sensors corresponding to the plurality of evaporation sources, not only the structure of the deposition apparatus is complicated, but also the cost of the deposition equipment is increased.

The present invention has been made in view of the above-described point, and an object of the present invention is to provide an evaporation amount control unit capable of simplifying a structure and reducing costs, a deposition apparatus having the same, and an evaporation amount control method.

Another object of the present invention is to provide an evaporation amount adjusting device capable of precisely controlling the evaporation amount while simplifying a structure, a deposition apparatus having the same, and a method for controlling evaporation amount.

Evaporation amount control unit according to the present invention for achieving the object as described above is a vaporization amount sensor for detecting the evaporation amount of a plurality of evaporation sources are arranged spaced apart from each other and provided with a heating wire for heating the received deposition material is accommodated deposition material ; An evaporation amount sensor driving unit for moving the evaporation amount detection sensor to a position capable of detecting the evaporation amount of each evaporation source; A power supply unit supplying current to the heat source so that each evaporation source can be heated; And controlling the power supply unit so that each evaporation source is heated to a predetermined reference temperature T ₀ , and setting the reference temperature based on an evaporation amount per unit time of each evaporation source input from the evaporation amount sensor, and the evaporation amount And a controller configured to control the evaporation amount sensor driving unit to move the evaporation amount detection sensor to a position where a detection sensor can measure the evaporation amount of each of the plurality of evaporation sources.

On the other hand, the above object is a frame; A plurality of evaporation sources installed on the support frame to be spaced apart from each other, having a deposition material to be deposited on a substrate, and having a heating wire for heating the received deposition material; An evaporation amount sensor installed on the frame to be able to sequentially measure the evaporation amounts of the plurality of evaporation sources so as to be movable in an arrangement direction of the plurality of evaporation sources; An evaporation amount sensor driving unit for moving the evaporation amount detection sensor in the plurality of evaporation source arrangement directions; A power supply unit supplying a current to the heating wire so that the deposition material contained in the plurality of evaporation sources can be evaporated and attached to the substrate; And controlling the power supply unit so that each evaporation source is heated to a predetermined reference temperature, and setting the reference temperature based on an evaporation amount per unit time of each evaporation source input from the evaporation detection sensor, wherein the evaporation detection sensor is configured to provide the plurality of evaporation sensors. It can also be achieved by a deposition apparatus including a control unit for controlling the evaporation amount sensor driving unit to move the evaporation amount detection sensor to a position capable of measuring the evaporation amount of each evaporation source of.

According to one embodiment of the invention, the evaporation sensor detection unit is a drive motor for adjusting the evaporation amount; An evaporation amount adjusting ball screw connected to the power supply by the driving motor for adjusting the evaporation amount, the evaporation amount detecting sensor coupled to move in a direction in which the plurality of evaporation sources are arranged; And an evaporation amount adjusting guide unit for guiding the movement of the evaporation amount detecting sensor.

The guide unit may include a guide rail for adjusting an evaporation amount formed in the plurality of evaporation source arrangement directions; And an evaporation amount adjusting guide member fixed to the evaporation amount sensor and having an evaporation amount adjusting guide groove inserted into the evaporation amount adjusting guide rail.

The control unit controls the evaporation amount sensor driving unit to move the evaporation amount detection sensor to a position capable of measuring the evaporation amount of the selected evaporation source among the plurality of evaporation sources, and controls the evaporation amount per unit time to be measured per preset unit time. A position at which the reference temperature is set in comparison with the evaporation amount, the power supply unit is controlled to heat the selected evaporation source according to the set reference temperature, and the evaporation amount of any other selected evaporation source among the plurality of evaporation sources can be measured And control the evaporation amount sensor driving unit to move the evaporation amount detection sensor.

The deposition apparatus may include a motoring sensor unit measuring the average amount of evaporation of the plurality of evaporation sources and transmitting the average amount of evaporation of the plurality of evaporation sources to the controller, in which case the controller transmits the average transmitted from the monitoring sensor unit. The evaporation amount is compared with a predetermined reference evaporation amount to determine whether the deposition operation is completed.

The monitoring sensor unit is rotatably installed in the frame, the monitoring ball screw disposed parallel to the arrangement direction of the evaporation source; A driving motor for monitoring connected to the monitoring ball screw to transmit power and providing power for rotating the monitoring ball screw; And a monitoring sensor coupled to the monitoring ball screw so that the monitoring ball screw can be moved in an arrangement direction of the evaporation source as the monitoring ball screw rotates, wherein the control unit reciprocates the monitoring sensor at a predetermined cycle in the arrangement direction of the evaporation source. The monitoring drive motor is controlled to move.

In addition, the above object is a method for controlling the amount of evaporation of a deposition apparatus having a plurality of evaporation sources, comprising the steps of: a) heating the plurality of evaporation sources to a reference temperature to evaporate the deposition material; And b) measuring an evaporation amount per unit time of any one selected from the plurality of evaporation sources, setting the reference temperature based on the measured evaporation amount per unit time, and heating the selected evaporation source to a set reference temperature. It can also be achieved by a control method.

According to an embodiment of the present invention, step b) includes: b1) moving the evaporation detection sensor to any one selected evaporation source; b2) comparing the evaporation amount per unit time of the selected evaporation source measured by the evaporation amount detection sensor with a preset evaporation amount per unit time, and setting the reference temperature according to a comparison result; And b3) heating the selected evaporation source to the preset reference temperature.

In the step b2), when the measured evaporation amount per unit time is smaller than the preset evaporation amount per unit time, the reference temperature is increased and the elevated reference temperature is increased so that the measured evaporation per unit time is equal to the preset evaporation amount per unit time. When the measured evaporation per unit time is greater than the preset evaporation amount per unit time, the reference temperature is lowered and the lowered reference value is set so as to be equal to the preset evaporation amount per unit time. The temperature is set to a new reference temperature, and if the measured evaporation per unit time is equal to the preset reference evaporation per unit time, the reference temperature is not changed.

On the other hand, the above evaporation amount control method includes the steps of c) moving the evaporation detection sensor to any other evaporation source selected from the plurality of evaporation sources; d) comparing the evaporation amount per unit time of the selected other evaporation source measured by the evaporation amount detecting sensor with a preset evaporation amount per unit time, and setting the reference temperature according to a comparison result; And e) heating the selected other evaporation source to the set reference temperature.

Hereinafter, a deposition apparatus according to an embodiment of the present invention will be described in detail.

1A to 3, a deposition apparatus according to an embodiment of the present invention includes a frame 100, a plurality of evaporation sources 120 spaced apart from each other by a predetermined interval, and the plurality of evaporation sources. 120 includes an evaporation amount adjusting unit 140 for measuring and controlling each evaporation amount, and a monitoring sensor unit 160 for determining whether the deposition process is completed.

The frame 100 is for supporting the above-described configurations, and an upper frame 101 on which the monitoring sensor unit 160 is supported, and a lower portion on which the plurality of evaporation sources 120 and the evaporation amount adjusting unit 140 are supported. Frame 102. In the present exemplary embodiment, the frame 100 is divided into an upper frame 101 and a lower frame 102 for convenience. However, unlike the present exemplary embodiment, the upper frame 101 and the lower frame 102 are one frame. Not only may it be manufactured as 100, but also the above-described components may be supported by the lower frame 102 alone.

The plurality of evaporation sources 120 are disposed on the lower frame 102 at regular intervals. In the present exemplary embodiment, the first to fifth evaporator 120a, 120b, 120c, 120d, and 120e are illustrated. However, as long as the evaporation sources 120 are configured in plural, the present invention is not limited thereto. The idea of applies. Although each evaporation source 120 is not shown in the figure, most of the evaporation source has a configuration. That is, each evaporation source 120 includes five crucibles (not shown) in which deposition materials are accommodated, a heating wire (not shown) for heating the crucibles, and five temperature sensors 121 for measuring the temperature of the deposition material. 121a, 121b, 121c, 121d, and 121e are provided. The hot wire is connected to the power supply unit 150 described later. The plurality of evaporation sources 120 are installed to be fixed to the lower frame 102. Therefore, the substrate to which the deposition material is to be attached is moved while moving in a direction perpendicular to the arrangement direction of the plurality of evaporation sources 120. In the present exemplary embodiment, the plurality of evaporation sources 120 are fixed to the lower frame 102, but the plurality of evaporation sources 120 are movable in a direction perpendicular to the arrangement direction of the plurality of evaporation sources 120. It can also be installed, in which case the substrate will remain fixed during the deposition operation.

The evaporation amount adjusting unit 140 is for controlling the evaporation amount of the evaporation material evaporated from each evaporation source 120, the evaporation amount sensor 141, the evaporation amount sensor driving unit 143, the power supply unit 150 and the control unit 151.

The evaporation detection sensor 141 is for detecting the amount of deposition material evaporated from the plurality of evaporation sources 120, a crystal oscillator may be used. The evaporation detection sensor 141 is composed of one, it is installed to reciprocate in the arrangement direction of the evaporation source 120 is to measure the evaporation amount of each evaporation source 120 in sequence. To this end, the evaporation detection sensor 141 must be movable in the arrangement direction of the evaporation source 120, this function is made by the evaporation detection sensor drive unit 143.

The evaporation amount sensor driving unit 143 is for reciprocating the evaporation amount detection sensor 141 in the arrangement direction of the evaporation source 120, the evaporation amount adjustment driving motor 144 for adjusting the evaporation amount and the driving motor for evaporation amount adjustment ( Evaporation amount adjustment ball screw 145 for adjusting the evaporation amount rotated by 144, and evaporation amount adjustment guide unit 146 for adjusting the evaporation amount for guiding the movement of the evaporation detection sensor 141.

The evaporation sensor 141 is coupled to the ball screw 145 for adjusting the evaporation amount via a support 142. And the evaporation amount adjustment ball screw 145 is connected to the evaporation amount control drive motor 144 to rotate. Therefore, when the evaporation amount control drive motor 144 is rotated forward, the evaporation amount adjustment ball screw 145 is rotated in one direction, when the evaporation amount adjustment ball screw 145 is rotated in one direction, the support 142 The evaporation rate sensor 141 moves linearly in one direction in which the evaporation source 120 is disposed. On the other hand, if the evaporation amount control drive motor 144 reversely rotates, the evaporation amount sensor 141 is linearly moved in the other direction in which the evaporation source 120 is disposed.

The evaporation amount adjusting guide unit 146 is coupled to the evaporation amount adjusting guide rail 147 and the support 142 supported by the support leg 103 to the lower frame 102 and the evaporation amount adjusting guide groove 148. It comprises a guide member 149 for monitoring the evaporation amount formed.

The power supply unit 150 is for supplying power to the heating wire and the evaporation amount control driving motor 144 to heat the respective evaporation sources 120, the driving motor 144 for adjusting the heating wire and evaporation amount of each evaporation source 120. Not only electrically connected to, but also communicatively connected to the controller 151.

The control unit 151 is electrically connected to the power supply unit 150 to control the heating temperature of each of the evaporation source (120). More specifically, the control unit 151 controls the power supply unit 150 to heat each evaporation source 120 at a preset reference temperature, and the unit of each evaporation source 120 input from the evaporation amount detecting sensor 141. The reference temperature is varied according to the amount of evaporation per hour to control the power supply unit 150 to heat each evaporation source 120 to a variable reference temperature.

In addition, the controller 151 controls the evaporation amount sensor 141 by controlling the evaporation amount control drive motor 144. More specifically, the evaporation amount control driving motor 144 is controlled to measure the evaporation amount per unit time of any one evaporation source 120, that is, the first evaporation source 120a of the plurality of evaporation sources 120. In addition, after measuring the amount of evaporation per unit time of the first evaporator 120a for a predetermined time, the controller 151 varies the reference temperature of the first evaporator 120a and changes the first evaporator 120a to a variable reference temperature. ) Controls the power supply unit 150 to be heated, and drives the evaporation amount control drive motor 144 to move the evaporation amount sensor 141 to a position capable of detecting the evaporation amount of the second evaporation source 120b. The controller 151 also varies the reference temperature in the same process as that of the first evaporator 120a and heats the second evaporator 120b to the variable reference temperature. Thereafter, the third to fifth evaporation sources 120c, 120d, and 120e are also controlled by the controller 151 in the same process.

The monitoring sensor unit 160 is rotatable to a monitoring sensor 161 composed of a crystal oscillator, a monitoring drive motor 164 for driving the monitoring sensor 161, and the upper frame 101. A pair of rotating monitoring ball screws 165 that are supported and connected to the monitoring drive motor 164, and a pair for connecting the monitoring driving motor 164 and the monitoring ball screw 165 so as to transmit power. It includes a bevel gear 162, and a monitoring guide unit 166 for guiding the monitoring sensor 161 to be moved in the direction of the plurality of evaporation source 120 arrangement. The monitoring guide unit 166 is fixed to the monitoring sensor 161 is installed, the monitoring guide member 149, the monitoring guide groove 148 is formed, and the monitoring guide rail inserted into the guide groove 148 167.

That is, the monitoring sensor 161 is moved in the arrangement direction of the plurality of evaporation sources 120 due to the substantially same configuration as the evaporation detection sensor 141. However, the monitoring sensor 161 is to determine whether to terminate the deposition process by measuring the total evaporation amount, that is, the deposition amount of the plurality of evaporation sources 120, the monitoring sensor 161 periodically the plurality of evaporation sources 120 ) Will reciprocate.

The monitoring sensor 161 is also electrically connected to the control unit 151 in the same manner as the evaporation detection sensor 141, and the evaporation amount measured from the monitoring sensor 161 is transmitted to the control unit 151. Then, the controller 151 determines whether the deposition process is completed by comparing with a preset evaporation amount.

Referring to the operation of the monitoring sensor unit 160 having the above-described configuration, first, when the control unit 151 controls the power supply unit 150 to apply power to the monitoring driving motor 164, the monitoring driving motor ( 164 rotates the monitoring ball screw 165 through the bevel gear 162. When the monitoring ball screw 165 is rotated, the monitoring sensor 161 is linearly moved in the arrangement direction of the plurality of evaporation sources 120. At this time, the control unit 151 periodically repeats the forward and reverse rotation of the monitoring drive motor 164, the monitoring sensor 161 is periodically reciprocated in the direction of the evaporation source 120 arrangement. The movement of the monitoring sensor 161 is guided by the monitoring guide groove 168 moving along the guide rail 167.

 By such an operation, the monitoring sensor 161 can detect an average value of the evaporation amount evaporated from each evaporation source 120. In this embodiment, a separate monitoring sensor 161 is provided to determine whether the deposition process is completed, but whether or not the deposition process is completed from the evaporation amount detected by the evaporation detection sensor 141 without a separate monitoring sensor 161. It is also possible to obtain data on the amount of deposition for determining.

Hereinafter, the evaporation amount control method of the vapor deposition apparatus which has the structure as mentioned above is demonstrated in detail.

3 to 5, the controller 151 controls all of the plurality of evaporation sources 120 to be heated to the reference temperature T ₀ (S10). More specifically, the controller 151 compares the actual temperature input from the temperature sensor 121 of each evaporation source 120 and the reference temperature T ₀ , and is applied to each evaporation source 120 according to the comparison result. The amount of current is controlled. Such a control mode may be defined as a temperature control mode.

In addition, the control unit 151 moves the evaporation detection sensor 141 to a position capable of detecting the evaporation amount of the first evaporation source 120a (S20). More specifically, the controller 151 drives the drive motor 144 for adjusting the evaporation amount. Then, the evaporation amount adjustment ball screw 145 is rotated so that the evaporation amount detection sensor 141 is moved a predetermined distance in the arrangement direction of the plurality of evaporation sources 120 to be positioned above the first evaporation source 120a.

Meanwhile, the control unit 151 drives the monitoring driving motor 164 to periodically measure the total average evaporation amount while moving in the arrangement direction of the plurality of evaporation sources 120. More specifically, when the controller 151 periodically rotates forward and reverse the monitoring drive motor 164, the monitoring ball screw 165 rotates forward and reverse by the monitoring drive motor 164. While the monitoring sensor 161 is periodically reciprocated in the direction of the plurality of evaporation source 120 arrangement direction along the monitoring guide rail 167.

When the evaporation amount detection sensor 141 reaches the upper portion of the first evaporation source 120a, which is a position where the evaporation amount of the first evaporation source 120a can be measured, the controller 151 controls the evaporation amount detection sensor 141 for a preset time. Stopping the operation, the evaporation sensor 141 measures the amount of evaporation per unit time and transmits to the control unit 151 (S30).

Then, the controller 151 compares the preset evaporation amount per unit time with the preset evaporation amount per unit time (S40). That is, it is determined whether the measured evaporation amount per unit time is equal to the preset standard evaporation amount per unit time (S40), and a new reference temperature is set according to the determination result (S50). Such a control method may be defined as an evaporation control mode.

More specifically, when the measured evaporation amount per unit time is not the same as the reference evaporation amount per unit time, it is determined whether the measured evaporation amount per unit time is greater than the preset standard evaporation amount per unit time (S51).

If the measured evaporation per unit time is greater than the preset evaporation per unit time, the reference temperature (T ₀ ) is decreased by a predetermined temperature (ΔT ₀ ) (S52), and the evaporation amount per unit time of the first evaporation source 120a is measured again ( S30), it is determined whether the measured amount of evaporation per unit time is the same as the preset standard amount of evaporation per unit time (S40). By repeating the above process, the new reference temperature T ₀ is found when the measured evaporation amount per unit time is the same as the preset evaporation amount per unit time.

If the measured evaporation per unit time is not greater than the preset evaporation per unit time, it means that the measured evaporation per unit time is smaller than the preset evaporation per unit time, so that the reference temperature (T ₀ ) is increased by a constant temperature (ΔT ₀ ) In operation S53, the amount of evaporation per unit time of the first evaporation source 120a is measured again (S30), and it is determined whether the measured amount of evaporation per unit time is the same as a preset standard evaporation amount per unit time (S40). By repeating the above process, the new reference temperature T ₀ is found when the measured evaporation amount per unit time is the same as the preset evaporation amount per unit time.

When the measured evaporation amount per unit time is the same as the reference evaporation amount per unit time, the reference temperature T ₀ is set to the existing reference temperature T ₀ . In other words, the reference temperature T ₀ is not changed.

By the above process, a new reference temperature T ₀ for heating the first evaporator 120a is newly set, and the controller 151 sets the first evaporator 120a at the newly set reference temperature T ₀ . The power supply unit 150 is controlled to be heated (S60).

Thereafter, the controller 151 determines whether the deposition process is finished based on the total average evaporation amount input from the monitoring sensor 161 (S70). More specifically, when the total average evaporation amount input from the monitoring sensor 161 is the same as the average reference evaporation amount, the controller 151 determines that the deposition process is completed and ends the deposition process (S80). In order to terminate the deposition process, the controller 151 controls the power supply unit 150 to cut off power applied to each component.

However, when the total average evaporation amount input from the monitoring sensor 161 is smaller than the average reference evaporation amount, the control unit 151 determines that the deposition process is not finished, and the evaporation amount to the second evaporation source 120b which is the next measurement target evaporation source 120. The sensor 141 controls the driving motor 144 for adjusting the evaporation amount to be moved (S20). Then, the controller 151 performs the same steps of S10 to S70 described above. As such, by controlling the evaporation amount of each evaporation source 120 in the evaporation amount control mode together with the temperature control mode, by setting a new reference temperature (T ₀ ) to control the evaporation amount of each evaporation source 120, the evaporation amount is more precisely controlled. In addition, the plurality of evaporation sources 120 may control the amount of evaporation using one evaporation amount sensor 141. By using one evaporation rate sensor 141 as described above, the number of expensive evaporation rate sensors 141 can be reduced, thereby simplifying the structure of the deposition apparatus and reducing the manufacturing cost of the deposition apparatus. do.

These processes are the same for the third to fifth evaporators 120c, 120d and 120e, and are repeated until the deposition process is completed. In the present exemplary embodiment, the evaporation amount of the five evaporation sources 120 is controlled by using one evaporation detection sensor 141, but the plurality of evaporation sources may be smaller than the number of evaporation sources 120. All cases of controlling the evaporation amount of 120 will be included in the spirit of the present invention.

According to the present invention described above, by detecting one evaporation amount of each evaporation source while moving one evaporation detection sensor in the arrangement direction of the plurality of evaporation sources, the number of expensive evaporation detection sensors can be reduced. As a result, the structure of the deposition apparatus can be simplified, and the cost of the deposition apparatus can be reduced.

In addition, by using the temperature control mode and the evaporation control mode at the same time as a method for controlling the evaporation amount of each evaporation source, it is possible to control the evaporation more precisely and to reduce the number of evaporation detection sensors.

In addition, by providing a separate monitoring sensor to calculate the completion time of deposition, it is possible to deposit the deposition material to a precise thickness on the substrate. In particular, by measuring the deposition thickness while periodically moving the monitoring sensor in the direction of the plurality of evaporation source arrangement, it is possible to deposit the deposition material on the substrate with a more precise thickness.

Although the invention has been described in detail only with respect to the specific embodiments described, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and modifications belong to the appended claims. will be.

Claims (11)

An evaporation amount sensor for sensing an evaporation amount of a plurality of evaporation sources arranged to be spaced apart from each other and having a heating wire for accommodating the deposition material; An evaporation amount sensor driving unit for moving the evaporation amount detection sensor to a position capable of detecting the evaporation amount of each evaporation source; A power supply unit supplying current to the heat source so that each evaporation source can be heated; And The power supply unit is controlled to heat each evaporation source to a predetermined reference temperature, and the reference temperature is set based on the evaporation amount per unit time of each evaporation source input from the evaporation sensor, and the evaporation sensor detects the plurality of evaporation sensors. And a control unit controlling the evaporation amount sensor driving unit to move the evaporation amount detection sensor to a position capable of measuring the evaporation amount of each evaporation source of the evaporation source. The method of claim 1, wherein the evaporation detection sensor drive unit, Drive motors; A ball screw connected to the power transmission unit by the driving motor and coupled to the evaporation rate sensor so as to move in a direction in which the plurality of evaporation sources are arranged; And Evaporation amount adjustment unit comprising a guide unit for adjusting the evaporation amount for guiding the movement of the evaporation sensor. The method of claim 2, wherein the evaporation amount adjustment guide unit, A guide rail for adjusting an evaporation amount formed in the plurality of evaporation source arrangement directions; And Evaporation amount control unit is fixed to the evaporation amount sensor, characterized in that it comprises an evaporation amount adjustment guide member formed with a guide groove for evaporation amount adjustment inserted into the evaporation amount adjustment guide rail. The method of claim 1, wherein the control unit, Controlling the evaporation amount sensor driving unit to move the evaporation amount detection sensor to a position capable of measuring the evaporation amount of the selected evaporation source among the plurality of evaporation sources, The reference temperature is set by comparing the measured amount of evaporation per unit time with a preset amount of evaporation per unit time, Controlling the power supply unit to heat the selected evaporation source according to the set reference temperature; And an evaporation amount detecting sensor driving unit to control the evaporation amount detecting sensor driving unit to move the evaporation amount detecting sensor to a position capable of measuring the evaporation amount of any one selected from among the plurality of evaporating sources. frame; A plurality of evaporation sources installed on the support frame to be spaced apart from each other, having a deposition material to be deposited on a substrate, and having a heating wire for heating the received deposition material; An evaporation amount sensor installed on the frame to be able to sequentially measure the evaporation amounts of the plurality of evaporation sources so as to be movable in an arrangement direction of the plurality of evaporation sources; An evaporation amount sensor driving unit for moving the evaporation amount detection sensor in the plurality of evaporation source arrangement directions; A power supply unit supplying a current to the heating wire so that the deposition material contained in the plurality of evaporation sources can be evaporated and attached to the substrate; And The power supply unit is controlled to heat each of the evaporation sources to a predetermined reference temperature, and the reference temperature is set based on the evaporation amount per unit time of each evaporation source input from the evaporation sensor, and the evaporation sensor detects the plurality of evaporation sensors. And a controller configured to control the evaporation amount sensor driving unit to move the evaporation amount detection sensor to a position capable of measuring an evaporation amount of each evaporation source. The method of claim 5, It includes a motor sensor unit for measuring the average amount of evaporation of the plurality of evaporation source and transmits to the control unit to determine whether the deposition operation is completed, And the control unit compares the average evaporation amount transmitted from the monitoring sensor unit with a preset reference evaporation amount to determine whether the deposition operation is completed. The method of claim 6, The monitoring sensor unit, A monitoring ball screw rotatably installed on the frame and arranged in parallel with an arrangement direction of the evaporation source; A driving motor for monitoring connected to the monitoring ball screw to transmit power and providing power for rotating the monitoring ball screw; And It includes a monitoring sensor coupled to the monitoring ball screw to be moved in the direction of the arrangement of the evaporation source as the monitoring ball screw rotates, And the control unit controls the monitoring driving motor to reciprocate the monitoring sensor at a predetermined cycle in the arrangement direction of the evaporation source. In the evaporation amount control method of the vapor deposition apparatus provided with the some evaporation source, a) evaporating the deposition material by heating the plurality of evaporation sources to a reference temperature; And b) measuring an evaporation amount per unit time of any one selected from the plurality of evaporation sources, setting the reference temperature based on the measured evaporation amount per unit time, and heating the selected evaporation source to a set reference temperature. Way. The method of claim 8, wherein b), b1) moving the evaporation detection sensor to the selected evaporation source; b2) comparing the evaporation amount per unit time of the selected evaporation source measured by the evaporation amount detection sensor with a preset evaporation amount per unit time, and setting the reference temperature according to a comparison result; And b3) heating the selected evaporation source to the set reference temperature. The method of claim 9, wherein the step b2), When the measured evaporation per unit time is less than the preset evaporation per unit time, the reference temperature is increased so that the measured evaporation per unit time is equal to the preset reference evaporation per unit time, and the elevated reference temperature is set as a new reference temperature. , When the measured evaporation per unit time is greater than the preset evaporation per unit time, the reference temperature is lowered so that the measured evaporation per unit time is equal to the preset evaporation per unit time, and the lowered reference temperature is replaced with a new reference temperature. Setting, And the reference temperature is not changed when the measured evaporation amount per unit time is equal to a preset reference evaporation amount per unit time. The method of claim 8, c) moving the evaporation detection sensor to any one selected from among the plurality of evaporation sources; d) comparing the evaporation amount per unit time of the selected other evaporation source measured by the evaporation amount detecting sensor with a preset evaporation amount per unit time, and setting the reference temperature according to a comparison result; And e) heating the selected other evaporation source to the set reference temperature.

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