KR101983009B1 - Evaporating source and vacuum depositing equipment including the evaporating source - Google Patents

Abstract

An evaporation source and a vacuum deposition apparatus having the evaporation source are disclosed. The evaporation source according to an embodiment includes a crucible for accommodating an evaporation material, a first heating means for directly or indirectly heating the crucible to evaporate the evaporation material, a second heating means connected to the outlet of the crucible, And a plurality of second heating means provided in each region of the jetting nozzles divided into a plurality of regions and capable of independently controlling the temperature.

Description

TECHNICAL FIELD [0001] The present invention relates to an evaporation source and a vacuum deposition apparatus having the evaporation source,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to an evaporation source and a vacuum deposition apparatus having the same.

An organic light emitting diode (OLED) is a light emitting device in which electrons injected through a cathode and an anode are combined in a light emitting layer formed of an organic material, and light of a specific wavelength is generated. In OLED, the wavelength of light generated depending on the type of organic material may be changed. The organic light emitting display device is one of the self-luminous display devices using such an array of OLEDs as a light source. The organic light emitting display device has been attracting attention as a next generation display device because it has excellent luminous efficiency and can be driven at a low voltage, is lightweight, thin, has a wide viewing angle and has a high response speed.

The manufacturing process of the organic light emitting display device includes a device manufacturing process for forming an array of OLEDs by depositing organic and inorganic materials on a glass substrate, and an encapsulation process for sealing the OLEDs manufactured. In the device manufacturing process, a hole injection layer (HIL), a hole transport layer (Hole Transfer Layer), an RGB emission layer (EML), and an electron transport layer (EML) are formed on a glass substrate on which an anode is formed. Layer ETL, an electron injection layer (EIL), and a cathode. In addition, the sealing process is intended to protect organic materials which are vulnerable to moisture. Recently, thin film encapsulation (TFE) technology suitable for the manufacture of flexible, transparent or thin panels has been attracting attention.

In order to manufacture an organic light emitting display device, a plurality of deposition processes for forming a thin film of organic and inorganic materials in the device manufacturing process and / or the encapsulation process must be performed. The deposition process includes a physical vapor deposition (PVD) method such as a vacuum deposition method, an ion plating method, a sputtering method, and a chemical vapor deposition (CVD) method by reaction of two or more process gases. Among them, a vacuum evaporation method is mainly used for manufacturing an organic light emitting display device, in particular, a sealing layer formed of a light emitting layer or a monomer formed of an organic material.

In a vacuum vapor deposition apparatus for performing a vacuum vapor deposition process, an evaporation source is disposed inside a vacuum chamber so as to face a glass substrate. The glass substrate can be supported horizontally or vertically. The evaporation source is an apparatus for generating a vapor of an evaporation material such as an organic material or a monomer. In the light of the above, an evaporation source includes an injection nozzle for guiding or vaporizing the vapor deposition material toward the substrate. For example, the evaporation source includes at least a crucible in which the raw material is accommodated and a heating member for heating the crucible. At one end of the crucible, there is provided a spray nozzle which is a passage through which the evaporated raw material gas is discharged. The spray nozzle includes one or more spray holes.

The evaporation source may be classified into a point source, a linear source, a surface source, and the like depending on the number and / or arrangement of the injection holes. In recent years, linear evaporation sources have attracted more attention than point sources due to the large size of substrates, and the length of linear sources is gradually increasing. This is because the linear source has a higher efficiency of the evaporation material as compared with the point source and can realize a high deposition rate. However, a linear source typically requires a scanning means for scanning the evaporation source left or right or up and down. In addition, in the linear source, it is difficult to control the deposition temperature and the deposition rate, and it is difficult to obtain the uniformity of the deposition. In particular, as the length of the linear source becomes longer so as to be able to cope with a large-area substrate, it becomes more difficult to achieve the uniformity of the deposition as a whole. In addition, the evaporation source is not widely used as an evaporation source because it is not easy to control the deposition rate according to the position at present.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an evaporation source and a vacuum deposition apparatus including the evaporation source that can achieve uniform deposition uniformity even when the size or length of the evaporation source increases in order to cope with the large-

Another problem to be solved by the present invention is to control the deposition rate and the deposition temperature easily, even when the size of the evaporation source is increased, such as the length of the linear evaporation source increases, and the deposition uniformity And to provide a vacuum evaporation apparatus including the evaporation source.

According to an aspect of the present invention, there is provided an evaporation source including a crucible for containing an evaporation material, a first heating means for directly or indirectly heating the crucible to evaporate the evaporation material, And a plurality of spray nozzles which are provided in respective regions of the spray nozzles which are divided into a plurality of regions and which are capable of independently controlling the temperature, And a second heating means.

According to an aspect of the present invention, there is provided a vacuum deposition apparatus including a vacuum chamber, a substrate support, an evaporation source, and a nozzle temperature controller. The substrate supporting portion is provided in the vacuum chamber to support the substrate to be processed. Wherein the evaporation source is installed in the vacuum chamber so as to eject an evaporation material in a gaseous state opposite to the substrate to be processed supported by the substrate support, the evaporation source comprising: a crucible for containing an evaporation material; A first heating means for evaporating the evaporation material, an injection nozzle connected to an outlet of the crucible and having a plurality of injection holes through which the vaporized evaporation material is injected, and a plurality of injection nozzles And a plurality of second heating means provided in the respective regions and capable of independently controlling the temperature. The injection nozzle temperature control unit is for controlling the temperature of the plurality of second heating means of the evaporation source independently.

According to an embodiment of the present invention, the level of deposition uniformity of a vacuum deposition apparatus having a linear evaporation source can be further improved. Even if the deposition uniformity is less than the expectation, it is not necessary to redesign the injection nozzle, thereby relieving the burden of designing the injection nozzle.

FIG. 1 is a schematic view showing a schematic configuration of a vacuum deposition apparatus according to an embodiment of the present invention.
2 is a configuration diagram illustrating a configuration of a linear evaporation source according to an embodiment of the present invention.
Fig. 3 is an example of a perspective view of the injection nozzle of the linear evaporation source of Fig. 2;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The terms used are terms selected in consideration of the functions in the embodiments, and the meaning of the terms may vary depending on the user, the intention or custom of the operator, and the like. Therefore, the meaning of the terms used in the following embodiments is defined according to the definition when specifically defined in this specification, and unless otherwise defined, it should be interpreted in a sense generally recognized by those skilled in the art.

FIG. 1 is a schematic view showing a schematic configuration of a vacuum deposition apparatus according to an embodiment of the present invention. The vacuum deposition apparatus 100 is a device for performing a vacuum deposition process, and there is no particular limitation on the type of deposition material. For example, the vacuum deposition apparatus 100 may be an apparatus for forming an emission layer of an OLED using an organic material as an evaporation material, or an apparatus for forming a thin film constituting an encapsulation layer using a monomer as an evaporation material. However, the present embodiment is not limited thereto, and the vacuum deposition apparatus 100 may be a device for forming a thin film constituting a semiconductor element other than an OLED, or for forming another organic or inorganic thin film constituting an OLED have. Referring to FIG. 1, a vacuum deposition apparatus 100 includes a vacuum chamber 110, a substrate support 120, an evaporation source 130, and an injection nozzle temperature control unit 170. The vacuum deposition apparatus may further include a mask support 140, an evaporation source driver 150, and an alignment device 160.

The inner space of the vacuum chamber 110 maintains a vacuum atmosphere during the thin film deposition process for the substrate G to be processed. For this purpose, an evacuation pump (not shown) for evacuating the internal space of the vacuum chamber 110 may be connected to the vacuum chamber 110. The vacuum chamber 110 may be provided with a substrate supporting part 120 for supporting the substrate G and a mask supporting part 140 for supporting the shadow mask M, respectively.

The deposition process for the substrate G in the inner space of the vacuum chamber 110 can be variously performed. For example, when the substrate G is vertically erected in the vacuum chamber 110 by the substrate supporting part 120, or the linear evaporating source 130 is linearly and / A thin film can be deposited on the surface of the substrate G by supplying the gaseous deposition material to the substrate G while moving. In this case, when a thin film of a predetermined pattern is to be formed on the surface of the substrate G, a shadow mask M having a predetermined pattern supported by the mask supporting unit 140 is disposed on the deposition side of the substrate G . The shadow mask M and the substrate G may be aligned by the alignment device 160 before performing the deposition process. The shadow mask M supported by the mask support 140 may be rotated and / or rotated using the aligning device 160 while the substrate G is fixed by using the substrate support 120. [ To align the shadow mask M with respect to the substrate G at a set position.

A plurality of ejection holes 133a (see FIGS. 2 and 3) are formed in the evaporation source 130. The evaporation source 130 may be a surface evaporation source in which a plurality of injection holes 133a (see FIGS. 2 and 3) are arranged in an array, or a linear evaporation source arranged in a linear manner. In recent years, since the linear evaporation source is widely used as the evaporation source 130, only the case where the evaporation source 130 is linearly evaporated will be described below. However, this embodiment is not limited to the case of linear evaporation.

The linear evaporation source or linear source 130 vaporizes or sublimates the evaporation material to make it into a gaseous state and also injects the produced gaseous evaporation material into the substrate G through the injection hole. The specific configuration of the linear evaporation source 130 will be described later with reference to FIG. 2 and FIG. The linear evaporation source 130 may be linearly scanned in the left and / or the right / up / down direction with respect to the substrate G so as to cover the entire surface of the substrate G. [ The evaporation source driving unit 150 is an example of a driving device for linearly driving the linear evaporation source 130. The evaporation source driving unit 150 may include, for example, a linear actuator (not shown) for providing a driving force for linearly moving the linear evaporating source 130 and a linear guide (not shown) for guiding the linear movement . Alternatively, the linear evaporating source 130 may be driven by a power transmitting device driven by a separate driving source (for example, a guide arm whose one end is connected to the linear evaporating source 130 and the driving source is connected to the other end) It is possible.

Although not shown in the drawing, one end of the guide arm, which is driven in accordance with the linear movement of the linear evaporating source 130 and in which a utility line is disposed, may be connected to the linear evaporating source 130. The other end of the guide arm may be drawn out of the vacuum chamber 110. In this case, the vacuum of the vacuum chamber 110 is not transmitted to the vacuum chamber 110, even though the guide arm moves in the longitudinal direction while pivoting or performing multiple joint operations depending on the linear movement of the linear evaporation source 130. [ maintain. The utility line disposed inside the guide arm may be a line for supplying electricity, a control signal or the like from the outside of the vacuum chamber 110, piping for supplying a cooling gas, a carrier gas, or the like to the linear evaporation source 130 .

FIG. 2 is a view showing a configuration of a linear evaporation source 130 according to an embodiment of the present invention, and FIG. 3 is an example of a perspective view of an injection nozzle of the linear evaporation source 130 of FIG. 2 and 3, the linear evaporation source 130 includes a crucible 131, a first heating means 132, an injection nozzle 133, a second heating means 135, and an induction furnace 136 do. The linear evaporation source 130 is connected to one or more temperature sensors 137 for measuring the temperature of the injection nozzle 133 and / or a deposition rate sensor for measuring the deposition rate of the deposition material injected through the injection nozzle 133. [ (138).

The crucible 131 is a means for accommodating an organic material, a monomer, an inorganic material, etc., which is an evaporation material (S). The evaporation material S may be solid or liquid. The deposition material S accommodated in the crucible 131 may have a structure that allows a process to be performed for a relatively long time since a large amount of the deposition material S is filled in the crucible 131, And may be supplied to the crucible 131 little by little from the outside continuously or intermittently. In the case of the former, although the structure of the crucible 131 has a simple advantage, the process can not proceed while the deposition material is newly filled, or the deposition material is likely to be denatured because a large amount of the material is temporarily deposited. On the other hand, in the latter case, although the deposition process can be continuously performed for a long time or the possibility that the evaporation material is denatured is low, the supply device for supplying the evaporation material to the crucible 131 must be connected, .

The first heating means 132 is a means for heating the crucible 131 to evaporate the evaporation material S contained therein. The kind of the first heating means 132 is not particularly limited. For example, the first heating means 132 may be a heat coil or a heating sheet. Further, the first heating means 132 may be attached to the outer wall of the crucible 131 or may be installed in the furnace. Alternatively, the first heating means 132 may be spaced apart from the crucible 131 by a predetermined distance, and may indirectly heat the crucible 131 through thermal radiation. The first heating means 132 may be divided into a plurality of regions depending on the height so that the crucible 131 can be locally heated or the first heating means 132 and the crucible 131 are relatively heated As shown in FIG.

The injection nozzle 133 is connected to the outlet of the crucible 131 through an induction furnace 136 and a spray hole 133a through which evaporated evaporation material S is injected is linearly arranged on one surface. Here, the fact that the injection holes 133a are arranged linearly means that the plurality of injection holes 133a are arranged in the longitudinal direction of the injection nozzle 133 as a whole, and all of the injection holes 133a are arranged in a line It does not mean that it is. For example, the injection holes 133a may be arranged in two or more rows, or only two or more edge regions (e.g., all or a portion of the regions I and VI) may be arranged in two or more columns. The size and / or the interval of the ejection holes 133a may be uniform or vary depending on the position regardless of the position of the ejection nozzles 133. [ Although the injection holes 133a are shown as being openings formed on one surface of the injection nozzle 133 in the drawing, the present invention is not limited thereto. For example, the injection hole 133a may be a nozzle shape in which a fine-sized tube is coupled to one surface of the injection nozzle 133 (more precisely, a tube coupled to an opening formed in the injection nozzle 133) have.

The injection nozzle 133 may be divided into a plurality of regions. Here, the division of each region is based on the fact that a plurality of second heating means 135, which can be independently controlled, is provided in each region, that is, each region is thermally divided. Accordingly, this division of the injection nozzle 133 may not be identified merely by the external shape of the injection nozzle 133 itself. 2 and 3, the injection nozzle 133 is shown divided into six regions (regions I to VI), but this is only an example. The injection nozzle 133 may be divided into, for example, three or more to ten or less regions, and may be divided into ten or more regions depending on the embodiment. In this specification, one or more regions, for example, one or two regions (for example, regions I and II in the case of the present embodiment) adjacent to the end of the injection nozzle 133 among a plurality of regions Area VI corresponds to the edge area of the spray nozzle 133 and corresponds to one or more areas corresponding to the center part between both ends of the spray nozzle 133, for example, one to three areas (for example, in the case of this embodiment Region III and region IV) may correspond to the central region of the injection nozzle 133. [

As described above, the second heating means 135 is provided in each region of the injection nozzle 133. As with the first heating means 132, there is no limitation to the type of the second heating means 135. [ For example, the second heating means 135 may be a heating wire coil or a heating sheet installed or built in the main body of the injection nozzle 133. The second heating means 135 basically prevents the evaporated evaporation material from being deposited on the inner wall of the injection nozzle 135 or the entrance of the injection hole 133a by heating to a temperature higher than a predetermined temperature of the injection nozzle 133 Or minimizes it. The second heating means 135 can be independently controlled according to each region of the injection nozzle 133 as described above.

The second heating means 135 disposed in each region of the injection nozzle 133 can be independently controlled by the injection nozzle temperature control unit 170. [ The injection nozzle temperature control unit 170 is a component for performing a function of the apparatus control unit for controlling the operation of the vacuum deposition apparatus 100 of FIG. 1 or may be a component for controlling the temperature of each region of the injection nozzle 133 May be a component additionally installed in the vacuum vapor deposition apparatus 100 of FIG.

The injection nozzle temperature control unit 170 may control the second heating means 135 in each region according to a predetermined method at the beginning of the deposition process. For example, the injection nozzle temperature control unit 170 controls the second heating unit 135 so that the entire area of the injection nozzle 133 becomes the same temperature in the initial stage, or the temperature of each zone is symmetric with respect to the center area The second heating means 135 may be controlled. In the latter case, the temperature of each region of the injection nozzle 133 may be varied.

Alternatively, the injection nozzle temperature control 170 may control the second heating means 135 such that the temperature of the edge regions (e.g., region I and region VI) is higher than the central region (e.g., region III and region IV) have. Generally, the deposition area of the spray nozzle 133 is lower than that of the central area, or deposition of the evaporation material in the spray nozzle 133 is much generated due to stagnation of the airflow, The deposition uniformity can be achieved. Alternatively, the injection nozzle temperature controller 170 may control the second heating means 135 of each zone to reflect the previous process conditions (e.g., the zone where the deposition rate is relatively low in the previous process is set to a temperature higher than before) May be independently controlled.

The spray nozzle temperature controller 170 may adaptively control the second heating means 135 during the course of the process. More specifically, the injection nozzle temperature control unit 170 may measure the temperature and / or the deposition rate of each region of the injection nozzle 133 and then control the second heating means 135 based on the measurement result. For example, when the temperature and / or the deposition rate of the specific region is lower than those of the other regions, the injection nozzle temperature control unit 170 controls the second heating means 135 (135) so that the temperature of the injection nozzle 133 of the corresponding region is higher Can be controlled.

To this end, the linear evaporation source 130 may be provided with a temperature sensor 137 capable of measuring the temperature of the injection nozzle 133 by region. In addition, the deposition rate sensor 138 may be provided in the linear evaporation source 130 to measure the deposition rate of the deposition material in the gaseous state injected through the injection nozzle 133 by region. The temperature sensor 137 and the deposition rate sensor 138 may be provided individually or in a plurality of at least one in each region. In the case where only one temperature sensor 137 or deposition rate sensor 138 is installed, the temperature sensor 137 or the deposition rate sensor 138 can be installed so as to be able to measure the temperature or the deposition rate for each region. On the other hand, in the case where a plurality of temperature sensors 137 or deposition rate sensors 138 are provided in at least one area in each area, it is not necessary to move them, so that the structure can be simplified.

Meanwhile, the temperature sensor 137 and / or the deposition rate sensor 138 may be installed in other components of the vacuum deposition apparatus 100 of FIG. 1 instead of the linear evaporation source 130. For example, the temperature sensor 137 may be installed in the vacuum chamber 110 (see FIG. 1), in which case the temperature of the injection nozzle 133 may be indirectly measured. The deposition rate sensor 138 may be disposed at a predetermined position inside the vacuum chamber 110 (see FIG. 1) adjacent to the injection nozzle 133. Hereinafter, the case where the temperature sensor 137 and the deposition rate sensor 138 are provided in the injection nozzle 133 will be mainly described.

There is no particular limitation on the position of the injection nozzle 133 on which the temperature sensor 137 is installed. For example, a plurality of temperature sensors 137 may be provided on each area of the spray nozzle 133 to directly contact one surface of the spray nozzle 133 to measure the temperature. Alternatively, the temperature sensor 137 provided in the injection nozzle 133 may be a non-contact type in which the temperature can be measured without being in contact with the injection nozzle 133.

Also, as described above, one or more deposition rate sensors 138 may be provided in the linear evaporation source 130, which can measure the deposition rates of the deposition materials injected through the respective regions of the injection nozzles 133 by region have. The deposition rate sensor 138 may be provided in a direction in which the deposition material is injected through the injection hole 133a (between the substrate support 120 and the injection nozzle 133 of the linear evaporation source 130). In this case, the injection nozzle 133 need not have a separate measurement hole for measuring the deposition rate.

Alternatively, for measuring the deposition rate, the injection nozzle 133 may be provided with a separate measurement hole 133b. The measurement hole 133b is not necessarily an opening formed in the injection nozzle 133, and may be a nozzle type. The measurement hole 133b may be provided on a surface different from the surface on which the injection hole 133a is formed in the injection nozzle 133, but is not limited thereto. When the deposition rate sensor 138 is disposed between the injection nozzle 133 and the substrate support 120 in a state where no separate measurement hole 133b is formed and the deposition rate sensor 138 disposed in the middle of the evaporation path 138), there is a possibility that the deposition uniformity is lowered. However, if the deposition rate is measured by disposing a separate measurement hole 133b on the surface different from the deposition surface on which the injection hole 133a is formed, the deposition rate sensor 138 ), There is no problem that the uniformity of deposition is lowered.

The induction furnace 136 is disposed between the crucible 131 and the jetting nozzle 133 so as to connect the jetting nozzle 133 to the outlet of the crucible 131. That is, the induction furnace 136 is a passage through which the evaporation material S in a gaseous state evaporated in the crucible 131 flows to the spray nozzle 133. The induction furnace 136 may be provided with a third heating means 136a capable of independently controlling the temperature. The third heating means 136a prevents the evaporation material from being deposited inside the induction furnace 136 and allows the evaporation material in the gaseous state to be smoothly supplied from the crucible 131 to the spray nozzle 133. [ The kind and installation method of the third heating means 136a are not particularly limited as in the case of the first and second heating means 132 and 135.

As described in detail above, according to the embodiment of the present invention, the injection nozzle can be divided into a plurality of regions, and each region is provided with heating means capable of independently controlling the temperature. That is, the temperature control of the injection nozzles is not made entirely of one channel but is performed individually through multiple channels which are independent of each other. According to this, it is possible to further improve the deposition uniformity level of a vacuum deposition apparatus having an evaporation source (for example, an injection nozzle of a linear evaporation source whose length increases) corresponding to an increase in the size of the substrate. This is because the linear evaporation source according to the embodiment of the present invention can individually manage the regions where the deposition rate is relatively low or high. In addition, according to an embodiment of the present invention, it is not necessary to design and manufacture the injection nozzle again even if the deposition uniformity is less than the expectation, thereby relieving the burden of designing the injection nozzle.

100: vacuum deposition apparatus
110: vacuum chamber
120:
130: Linear evaporation source
140: mask support
150: evaporation source driver
160: Alignment device
170: injection nozzle temperature control section
131: Crucible
132, 135, 137: Heating means
133: injection nozzle
133a: injection hole
133b: Measurement hole
136: induction furnace
G: Substrate, M: Shadow mask, S: Deposition material
137: Temperature sensor
138: deposition rate sensor

Claims (13)

A crucible for containing an evaporation material;
First heating means for directly or indirectly heating the crucible to evaporate the evaporation material;
An injection nozzle connected to an outlet of the crucible and having a plurality of injection holes through which the evaporated evaporation material is injected, the injection nozzle being divided into a plurality of regions; And
And a plurality of second heating means provided in each of the plurality of regions of the injection nozzle,
Wherein each of the plurality of second heating means is independently temperature controllable. The method according to claim 1,
Wherein the evaporation source is linear evaporation in which the plurality of ejection holes are linearly arranged. 3. The method according to claim 1 or 2,
Further comprising a temperature sensor for measuring the temperature of each of the plurality of regions of the injection nozzle. 3. The method according to claim 1 or 2,
Further comprising a deposition rate sensor for measuring a deposition rate for each of the plurality of areas of the injection nozzle. 3. The method according to claim 1 or 2,
Wherein an evaporation source is provided in each region of the injection nozzle so that a deposition rate can be measured using a deposition rate sensor. 3. The method according to claim 1 or 2,
Further comprising an induction furnace disposed between the outlet of the crucible and the spray nozzle to provide a third heating means capable of temperature control independently. A vacuum chamber;
A substrate support installed in the vacuum chamber to support a substrate to be processed;
An evaporation source according to claim 1 installed in the vacuum chamber so as to eject an evaporation material in a gaseous state opposite to a target substrate supported on the substrate supporter; And
And an injection nozzle temperature control unit for independently controlling a temperature of the plurality of second heating means of the evaporation source. 8. The method of claim 7,
Wherein the plurality of ejection holes of the evaporation source are linearly arranged. 9. The method according to claim 7 or 8,
Wherein the vacuum deposition apparatus further comprises a temperature sensor for measuring a temperature for each of a plurality of regions of the injection nozzle of the evaporation source,
Wherein the injection nozzle temperature control unit independently controls the plurality of second heating means based on the temperature of each of the plurality of areas measured using the temperature sensor. 9. The method according to claim 7 or 8,
Wherein the vacuum deposition apparatus further comprises a deposition rate sensor for measuring a deposition rate for each of a plurality of regions of the injection nozzle of the evaporation source,
Wherein the injection nozzle temperature control unit independently controls the plurality of second heating means based on the deposition rates of the plurality of regions measured using the deposition rate sensor. 11. The method of claim 10,
Wherein a measurement hole is provided in each region of the injection nozzle so that the deposition rate can be measured using the deposition rate sensor. 9. The method according to claim 7 or 8,
Wherein the injection nozzle temperature control unit controls the plurality of second heating means so that the temperature of the injection nozzle is symmetrical with respect to a central region of the injection nozzle. 9. The method according to claim 7 or 8,
Wherein the injection nozzle temperature control unit controls the plurality of second heating means such that the temperature of the edge region of the injection nozzle is higher than the central region of the injection nozzle.

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