KR102261223B1 - 네거티브형 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법 - Google Patents

네거티브형 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법 Download PDF

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Publication number
KR102261223B1
KR102261223B1 KR1020190042603A KR20190042603A KR102261223B1 KR 102261223 B1 KR102261223 B1 KR 102261223B1 KR 1020190042603 A KR1020190042603 A KR 1020190042603A KR 20190042603 A KR20190042603 A KR 20190042603A KR 102261223 B1 KR102261223 B1 KR 102261223B1
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KR
South Korea
Prior art keywords
photosensitive resin
resin composition
group
negative photosensitive
general formula
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Application number
KR1020190042603A
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English (en)
Korean (ko)
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KR20190120710A (ko
Inventor
슈지로 시오사키
도모히토 오구라
Original Assignee
아사히 가세이 가부시키가이샤
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Publication of KR20190120710A publication Critical patent/KR20190120710A/ko
Application granted granted Critical
Publication of KR102261223B1 publication Critical patent/KR102261223B1/ko

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020190042603A 2018-04-16 2019-04-11 네거티브형 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법 KR102261223B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-078687 2018-04-16
JP2018078687 2018-04-16

Publications (2)

Publication Number Publication Date
KR20190120710A KR20190120710A (ko) 2019-10-24
KR102261223B1 true KR102261223B1 (ko) 2021-06-04

Family

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KR1020190042603A KR102261223B1 (ko) 2018-04-16 2019-04-11 네거티브형 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법

Country Status (3)

Country Link
JP (2) JP7252020B2 (ja)
KR (1) KR102261223B1 (ja)
TW (2) TWI798592B (ja)

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CN111522200B (zh) * 2020-04-07 2021-07-27 中国科学院化学研究所 一种用于12英寸硅晶圆的负型pspi树脂及其制备方法与应用
TW202208507A (zh) 2020-05-20 2022-03-01 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜之製造方法及半導體器件
WO2022172962A1 (ja) * 2021-02-12 2022-08-18 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、環化樹脂の前駆体

Citations (2)

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JP2007056196A (ja) * 2005-08-26 2007-03-08 Tokyo Institute Of Technology ポリイミド前駆体組成物、ポリイミド膜の製造方法及び半導体装置
JP2017111383A (ja) * 2015-12-18 2017-06-22 住友ベークライト株式会社 感光性樹脂材料

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US5326643A (en) 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
JP4952918B2 (ja) 2007-05-23 2012-06-13 Jsr株式会社 感放射線性樹脂組成物、液晶表示素子のスペーサーおよび保護膜ならびにそれらの形成方法
FR2935981B1 (fr) * 2008-09-15 2010-10-01 Centre Nat Rech Scient Nouveaux chromophores, leur procede de preparation et leur utilisation
JP5421585B2 (ja) 2008-12-24 2014-02-19 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
TWI554534B (zh) * 2012-09-25 2016-10-21 住友電木股份有限公司 含馬來醯亞胺之環烯烴聚合物及其應用
CN110941142B (zh) 2014-03-17 2021-05-25 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法、以及半导体装置
CN107428935B (zh) * 2015-03-27 2019-04-02 东丽株式会社 二胺化合物、使用其的耐热性树脂或耐热性树脂前体
JP6297757B2 (ja) * 2015-08-21 2018-03-20 旭化成株式会社 感光性樹脂組成物、ポリイミドの製造方法および半導体装置
SG11201802076PA (en) * 2015-09-30 2018-04-27 Toray Industries Negative photosensitive resin composition, cured film, element and display device each provided with cured film, and method for manufacturing display device
JP6808928B2 (ja) 2015-11-09 2021-01-06 東レ株式会社 感光性樹脂組成物
JP6487875B2 (ja) * 2016-04-19 2019-03-20 信越化学工業株式会社 テトラカルボン酸ジエステル化合物、ポリイミド前駆体の重合体及びその製造方法、ネガ型感光性樹脂組成物、ポジ型感光性樹脂組成物、パターン形成方法、及び硬化被膜形成方法
JPWO2018038074A1 (ja) 2016-08-24 2019-06-20 東レ株式会社 感光性ペースト、セラミックグリーンシート、電子部品、パターンの製造方法および電子部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056196A (ja) * 2005-08-26 2007-03-08 Tokyo Institute Of Technology ポリイミド前駆体組成物、ポリイミド膜の製造方法及び半導体装置
JP2017111383A (ja) * 2015-12-18 2017-06-22 住友ベークライト株式会社 感光性樹脂材料

Also Published As

Publication number Publication date
TW202117446A (zh) 2021-05-01
KR20190120710A (ko) 2019-10-24
JP7252020B2 (ja) 2023-04-04
TW201944175A (zh) 2019-11-16
TWI798592B (zh) 2023-04-11
TWI703406B (zh) 2020-09-01
JP2023068131A (ja) 2023-05-16
JP2019185031A (ja) 2019-10-24

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