KR102246569B1 - 임프린트 장치, 임프린트 방법 및 물품의 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 물품의 제조 방법 Download PDF

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KR102246569B1
KR102246569B1 KR1020170137234A KR20170137234A KR102246569B1 KR 102246569 B1 KR102246569 B1 KR 102246569B1 KR 1020170137234 A KR1020170137234 A KR 1020170137234A KR 20170137234 A KR20170137234 A KR 20170137234A KR 102246569 B1 KR102246569 B1 KR 102246569B1
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South Korea
Prior art keywords
substrate
mold
imprint
mesa
pattern
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Korean (ko)
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KR20180048323A (ko
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다다시 핫토리
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020170137234A 2016-10-31 2017-10-23 임프린트 장치, 임프린트 방법 및 물품의 제조 방법 Active KR102246569B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-213544 2016-10-31
JP2016213544A JP6779748B2 (ja) 2016-10-31 2016-10-31 インプリント装置、インプリント方法、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20180048323A KR20180048323A (ko) 2018-05-10
KR102246569B1 true KR102246569B1 (ko) 2021-04-30

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KR1020170137234A Active KR102246569B1 (ko) 2016-10-31 2017-10-23 임프린트 장치, 임프린트 방법 및 물품의 제조 방법

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JP (1) JP6779748B2 (https=)
KR (1) KR102246569B1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7278163B2 (ja) * 2019-07-11 2023-05-19 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7475185B2 (ja) 2020-04-10 2024-04-26 キヤノン株式会社 計測方法、インプリント装置及び物品の製造方法
JP7604257B2 (ja) 2021-02-10 2024-12-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7652645B2 (ja) * 2021-06-30 2025-03-27 キヤノン株式会社 平坦化装置、および物品製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008279772A (ja) 2008-06-23 2008-11-20 Canon Inc 微細加工方法及び微細加工装置
JP2010258259A (ja) 2009-04-27 2010-11-11 Dainippon Printing Co Ltd ナノインプリント転写用基板およびナノインプリント転写方法
JP2013062286A (ja) * 2011-09-12 2013-04-04 Canon Inc インプリント装置、それを用いた物品の製造方法
US20130093113A1 (en) 2011-10-14 2013-04-18 Canon Kabushiki Kaisha Imprint apparatus and article manufacturing method using same
KR101642627B1 (ko) 2012-03-14 2016-07-25 캐논 가부시끼가이샤 임프린트 장치, 몰드, 임프린트 방법 및 물품의 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810496B2 (ja) * 2007-04-25 2011-11-09 株式会社東芝 パターン形成装置、パターン形成方法及びテンプレート
JP2011066180A (ja) * 2009-09-17 2011-03-31 Toshiba Corp テンプレート作成管理方法、テンプレート及びテンプレート作成管理装置
US20120261849A1 (en) * 2011-04-14 2012-10-18 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method using same
JP5865208B2 (ja) * 2012-08-07 2016-02-17 富士フイルム株式会社 モールドの製造方法
JP6412317B2 (ja) * 2013-04-24 2018-10-24 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6381184B2 (ja) * 2013-07-09 2018-08-29 キヤノン株式会社 校正方法、測定装置、露光装置および物品の製造方法
JP6317620B2 (ja) * 2014-05-02 2018-04-25 キヤノン株式会社 インプリント方法、インプリント装置及び物品の製造方法
JP6450105B2 (ja) * 2014-07-31 2019-01-09 キヤノン株式会社 インプリント装置及び物品製造方法
JP6379937B2 (ja) * 2014-09-30 2018-08-29 大日本印刷株式会社 ステージ制御方法、修正テンプレートの製造方法、およびテンプレート観察修正装置
CN105487151A (zh) * 2016-01-22 2016-04-13 武汉理工大学 一种基于纳米压印的图形转移制备光栅的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008279772A (ja) 2008-06-23 2008-11-20 Canon Inc 微細加工方法及び微細加工装置
JP2010258259A (ja) 2009-04-27 2010-11-11 Dainippon Printing Co Ltd ナノインプリント転写用基板およびナノインプリント転写方法
JP2013062286A (ja) * 2011-09-12 2013-04-04 Canon Inc インプリント装置、それを用いた物品の製造方法
US20130093113A1 (en) 2011-10-14 2013-04-18 Canon Kabushiki Kaisha Imprint apparatus and article manufacturing method using same
JP2013102132A (ja) 2011-10-14 2013-05-23 Canon Inc インプリント装置、それを用いた物品の製造方法
KR101642627B1 (ko) 2012-03-14 2016-07-25 캐논 가부시끼가이샤 임프린트 장치, 몰드, 임프린트 방법 및 물품의 제조 방법

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JP2018074041A (ja) 2018-05-10
KR20180048323A (ko) 2018-05-10

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