KR102243063B1 - Unit for supplying liquid, Apparatus for treating substrate, and Method for treating substrate - Google Patents

Abstract

The present invention provides an apparatus and method for forming a liquid film on a substrate. The unit for supplying the photoresist on the substrate includes a coating nozzle for supplying the photoresist, wherein the coating nozzle has a main flow path through which the photosensitive liquid flows, and a plurality of discharge holes through which the photosensitive liquid is discharged outside by being connected to the main flow path. And a piezoelectric element installed in the body and the body, provided above the main flow path, and applying pressure so that the photosensitive liquid flowing through the main flow path is discharged through the discharge hole. Accordingly, it is possible to reduce the amount of consumption of the photoresist used for forming the liquid film, and the amount of volatilization of fume or volatile substances generated in the process of discharging the photoresist is extremely small, thus minimizing contamination of peripheral equipment.

Description

Liquid supply unit, substrate processing device, and substrate processing method {Unit for supplying liquid, Apparatus for treating substrate, and Method for treating substrate}

The present invention relates to an apparatus and method for liquid processing a substrate, and more particularly, to an apparatus and method for forming a liquid film on a substrate.

In order to manufacture a semiconductor device, various processes such as cleaning, deposition, photographing, etching, and ion implantation are performed. Among these processes, in the photographic process, coating, exposure, and development processes are sequentially performed, and before and after each process is performed, a bake step of baking the substrate is performed. The coating process is a process of applying a photosensitive liquid such as a resist to the surface of the substrate. The exposure process is a process of exposing a circuit pattern on a substrate on which a photosensitive film is formed. In the developing process, the exposed area of the substrate is selectively developed.

In general, the coating process rotates a substrate and supplies a photoresist onto the rotated substrate. The photoresist is supplied to the center of the substrate and diffuses by the centrifugal force of the substrate. However, such a coating method generates a difference in thickness between the center region and the edge region of the photoresist film, and is a factor in forming an uneven photoresist film.

In addition, when a photoresist is applied on a rotating substrate, its thickness is adjusted by controlling the rotational speed of the substrate. For this reason, the photoresist must be supplied in a larger amount than the required amount, and a part of the photoresist is recovered. In this process, a large amount of fume is generated from the photoresist, contaminating the peripheral device. In addition, when the liquid is applied to such a rotating substrate, the consumption of the liquid is large.

Korean Patent Publication No.: 2009-0070602

An object of the present invention is to provide an apparatus and method capable of reducing the consumption amount of a coating liquid when performing a coating process.

Another object of the present invention is to provide an apparatus and method capable of minimizing contamination of peripheral devices when performing the coating process.

Another object of the present invention is to provide a substrate processing apparatus and method capable of performing coating and developing processes in the same chamber.

An embodiment of the present invention provides an apparatus and method for forming a liquid film on a substrate. The unit for supplying the photoresist on the substrate includes a coating nozzle for supplying the photoresist, wherein the coating nozzle has a main flow path through which the photosensitive liquid flows, and a plurality of discharge holes through which the photosensitive liquid is discharged outside by being connected to the main flow path. And a piezoelectric element installed in the body and the body, provided above the main flow path, and applying pressure so that the photosensitive liquid flowing through the main flow path is discharged through the discharge hole.

An introduction flow path connected to the main flow path and a plurality of supply flow paths connected to the introduction flow path are further formed inside the body, and different types of photoresist solutions may be selectively supplied to the introduction flow path from the plurality of supply flow paths. I can.

The introduction passage may be positioned above the main passage, and the piezoelectric element may be positioned between the introduction passage and the main passage. The body may further include a plurality of cleaning liquid flow paths connected to each of the supply flow paths and supplying a cleaning liquid to the supply flow path so that the supply flow path and the introduction flow path are cleaned.

The unit further includes a controller for controlling a valve for opening and closing each of the plurality of supply flow paths and the plurality of cleaning liquid flow paths, wherein the controller is supplied with a photosensitive liquid from one of the supply flow paths, and the photosensitive liquid is supplied from the other. Before being supplied, the valve can be controlled so that the cleaning liquid is supplied to the one.

The unit further includes a coating nozzle driver for moving a relative position between the coating nozzle and the substrate, and a controller for controlling the coating nozzle driver and the coating nozzle, wherein the controller moves the coating nozzle while the photoresist is supplied to the substrate. The coating nozzle driver can be controlled so as to be possible.

The unit further includes a wetting liquid nozzle for supplying a wetting liquid on a substrate and a wetting liquid nozzle driver controlled by the controller, and the controller further includes a wetting liquid nozzle for supplying the wetting liquid on the substrate before the photoresist is supplied. The wetting liquid nozzle driver may be controlled so that the movement of the wetting liquid nozzle is stopped while being supplied to the substrate.

An apparatus for forming a liquid film on a substrate includes a photosensitive liquid supply unit having a substrate support unit supporting the substrate and a coating nozzle supplying the photosensitive liquid onto the substrate, wherein the coating nozzle has a main flow path through which the photosensitive liquid flows, A body connected to the main flow path and provided with a plurality of discharge holes through which the photosensitive solution is discharged to the outside, and installed in the body, and provided above the main flow path to apply pressure so that the photosensitive liquid flowing through the main flow path is discharged through the discharge hole. It includes a piezoelectric element to be applied.

An introduction flow path connected to the main flow path and a plurality of supply flow paths connected to the introduction flow path are further formed inside the body, and different types of photoresist solutions may be selectively supplied to the introduction flow path from the plurality of supply flow paths. I can.

The introduction passage may be positioned above the main passage, and the piezoelectric element may be positioned between the introduction passage and the main passage. The body may further include a plurality of cleaning liquid flow paths connected to each of the supply flow paths and supplying a cleaning liquid to the supply flow path so that the supply flow path and the introduction flow path are cleaned. The liquid supply unit further includes a controller for controlling a valve for opening and closing each of the plurality of supply flow paths and the plurality of cleaning liquid flow paths, wherein the controller is supplied with a photosensitive liquid from one of the supply flow paths, and Before the photosensitive liquid is supplied, the valve may be controlled so that the cleaning liquid is supplied to the one.

The unit further includes a coating nozzle driver for moving a relative position between the coating nozzle and the substrate, and a controller for controlling the coating nozzle driver and the coating nozzle, wherein the controller moves the coating nozzle while the photoresist is supplied to the substrate. The coating nozzle driver can be controlled so as to be possible.

The controller may further control the substrate support unit so that rotation of the substrate is stopped while the photoresist is supplied to the substrate.

The apparatus may further include a developer supply unit having a developing nozzle for supplying a developer onto a substrate supported by the substrate support unit.

In addition, the method of treating the substrate includes a coating step of applying a photoresist onto the substrate, wherein the photosensitive liquid is supplied to the substrate in an inkjet manner.

The body from which the photoresist is discharged has a main flow path through which the photoresist flows and a plurality of discharge holes through which the photoresist is discharged are formed therein, and different types of photoresist are selectively introduced into the body. I can. The different types of photosensitive liquids are selectively supplied by a plurality of supply flow paths connected to the body, and after the applying step, a cleaning liquid is selectively supplied to a supply flow path supplied with the photosensitive liquid among the plurality of supply flow paths. It may further include a cleaning step of cleaning the supply passage and the inside of the body.

In the applying step, rotation of the substrate may be stopped.

In the coating step, the coating nozzle may be moved so that the relative position of the coating nozzle for supplying the photoresist and the substrate is changed.

According to this embodiment of the present invention, the photoresist is discharged in an inkjet manner. Accordingly, it is possible to reduce the consumption amount of the photoresist used for forming the liquid film.

In addition, according to the embodiment of the present invention, since the photoresist is used in a small amount, the volatilization amount of fume or volatile substances generated in the process of discharging the photoresist is extremely small, there is no recovery amount of the photoresist, and contamination of peripheral equipment can be minimized. have.

In addition, according to an embodiment of the present invention, the coating nozzle selectively supplies various types of photoresist. This simplifies equipment and improves space efficiency.

Further, according to the embodiment of the present invention, the cleaning liquid is supplied to each supply passage. Accordingly, it is possible to prevent the photosensitive liquids from being mixed in the process of selectively discharging a plurality of photoresist with a single application nozzle.

1 is a cross-sectional view showing a liquid film formed by supplying a photoresist on a rotating substrate.
2 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
3 is a front view of the substrate processing apparatus of FIG. 2.
4 is a plan view of a substrate processing apparatus showing a process block of FIG. 2.
5 is a diagram illustrating an example of a hand of the transfer robot of FIG. 3.
6 is a plan view schematically showing an example of the processing chamber of FIG. 4.
7 is a front view of the processing chamber of FIG. 6.
8 is a cross-sectional view showing the processing unit of FIG. 7.
9 is a plan view showing the processing unit of FIG. 8.
10 is a cross-sectional view showing the application nozzle of FIG. 9.
11 is a perspective view showing the application nozzle of FIG. 10.
12 is a perspective view showing the developing nozzle of FIG. 9.
13 to 19 are views illustrating a process of processing a substrate using the apparatus of FIG. 8.
20 is a perspective view showing another embodiment of the application nozzle of FIG. 11.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those with average knowledge in the industry. Therefore, the shape of the element in the drawings is exaggerated to emphasize a clearer description.

2 is a perspective view schematically illustrating a substrate processing apparatus according to an embodiment of the present invention, and FIG. 3 is a front view of the substrate processing apparatus of FIG. 2. 4 is a plan view of a substrate processing apparatus showing a process block of FIG. 2.

Referring to FIGS. 2 to 4, the substrate processing apparatus 1 includes an index module 20, a treating module 30, and an interface module 40. According to an embodiment, the index module 20, the processing module 30, and the interface module 40 are sequentially arranged in a line. Hereinafter, the direction in which the index module 20, the processing module 30, and the interface module 40 are arranged is referred to as a first direction 12, and a direction perpendicular to the first direction 12 when viewed from the top is referred to as The second direction 14 is referred to as, and a direction perpendicular to both the first direction 12 and the second direction 14 is referred to as the third direction 16.

The index module 20 transfers the substrate W from the container 10 in which the substrate W is stored to the processing module 30, and stores the processed substrate W into the container 10. The longitudinal direction of the index module 20 is provided in the second direction 14. The index module 20 has a load port 22 and an index frame 24. The load port 22 is located on the opposite side of the processing module 30 based on the index frame 24. The container 10 in which the substrates W are accommodated is placed on the load port 22. A plurality of load ports 22 may be provided, and a plurality of load ports 22 may be disposed along the second direction 14.

As the container 10, a container 10 for sealing such as a front open unified pod (FOUP) may be used. The container 10 may be placed on the load port 22 by an operator or a transport means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. I can.

An index robot 2200 is provided inside the index frame 24. In the index frame 24, a guide rail 2300 in which the longitudinal direction is provided in the second direction 14 may be provided, and the index robot 2200 may be provided to be movable on the guide rail 2300. The index robot 2200 includes a hand 2220 on which the substrate W is placed, and the hand 2220 moves forward and backward, rotates about the third direction 16, and rotates the third direction 16. It may be provided to be movable along the way.

The processing module 30 performs a coating process and a developing process on the substrate W. The processing module 30 includes a plurality of process blocks 31. The process block 31 performs a coating process, a developing process, and a bake process on the substrate W. The process blocks 31 are provided to be stacked on each other. According to the embodiment of Fig. 1, four process blocks 31 are provided. According to an example, the two process blocks 31 perform the same process with each other, and may be provided with the same structure.

Referring to FIG. 4, the process block 31 includes a transfer chamber 3400, a processing chamber 3600, and a buffer chamber 3800. The processing chamber 3600 performs a bake process, a coating process, and a developing process on the substrate W. For example, the bake process may be a heat treatment process, and the application process may be a liquid film formation process. The heat treatment process includes a cooling process and a heating process, and the liquid film may include a photoresist film or an antireflection film. The transfer chamber 3400 transfers the substrate W between the process chambers 3600 located in the process block 31 and between the process chamber 3600 and the buffer chamber 3800.

The conveying chamber 3400 is provided with its longitudinal direction parallel to the first direction 12. A transfer robot 3422 is provided in the transfer chamber 3400. The transfer robot 3422 transfers the substrate W between the processing chambers 3600 and between the processing chamber 3600 and the buffer chamber 3800. According to an example, the transfer robot 3422 has a hand 3420 on which the substrate W is placed, and the hand 3420 moves forward and backward, a rotation about the third direction 16, and a third direction. It may be provided to be movable along (16). In the transfer chamber 3400, a guide rail 3300 whose longitudinal direction is provided in parallel with the first direction 12 may be provided, and the transfer robot 3422 may be provided to be movable on the guide rail 3300. .

5 is a diagram illustrating an example of a hand of the transfer robot of FIG. 4. 5, the hand 3420 has a base 3428 and a support protrusion 3429. The base 3428 may have an annular ring shape in which a part of the circumference is bent. The base 3428 has an inner diameter larger than the diameter of the substrate W. The support protrusion 3429 extends inwardly from the base 3428. A plurality of support protrusions 3429 are provided and support an edge region of the substrate W. According to an example, the support protrusions 3429 may be provided with four at equal intervals.

The processing chamber 3600 is provided in plural. Some of the processing chambers 3600 may be provided to be stacked on each other. 3 and 4, processing chambers 3600 are disposed on both sides of the transfer chamber 3402. The processing chambers 3600 are arranged side by side along the first direction 12. Some of the processing chambers 3600 are provided at positions adjacent to the index module 20. Hereinafter, these processing chambers 3600 are referred to as a front treating chamber 3602. Other portions of the processing chambers 3600 are provided in positions adjacent to the interface module 40. Hereinafter, these processing chambers 3600 are referred to as rear treating chambers 3604 (rear treating chambers).

The front processing chamber 3602 and the post processing chamber 3604 are provided with different types of liquids used in the coating process. According to an embodiment, the coating liquid may be an antireflection film in the application process of the front processing chamber 3602, and the coating liquid may be a photoresist in the coating process of the subsequent processing chamber 3604. The photoresist may be applied on the substrate W on which the antireflection film is applied. Optionally, the coating liquid of the front processing chamber 3602 may be a photoresist, and the coating liquid of the rear processing chamber 3604 may be an antireflection film. In this case, the antireflection film may be applied on the substrate W on which the photoresist is applied. Optionally, the coating liquid used in the coating process of each of the front processing chamber 3602 and the subsequent processing chamber 3604 may be of the same type, and all of them may be photoresist.

All of the processing chambers 3602 and 3604 have the same structure, and the shear processing chamber 3602 will be described as an example. 6 is a plan view schematically illustrating an example of the processing chamber of FIG. 4, and FIG. 7 is a front view of the processing chamber of FIG. 6.

6 and 7, the shear processing chamber 3602 includes a housing 3210, a cooling unit 3220, and a processing unit 800. The housing 3210 is generally provided in the shape of a rectangular parallelepiped. A carry-in port (not shown) through which the substrate W enters and exits is formed on the sidewall of the housing 3210. The entrance can be kept open. A door (not shown) may be provided to selectively open and close the entrance. The cooling unit 3220 and the processing unit 800 are provided in the housing 3210. The cooling unit 3220 and the processing unit 800 are provided side by side along the second direction 14. According to one example, the cooling unit 3220 may be located closer to the transfer chamber 3400 than the processing unit 800.

The cooling unit 3220 includes a cooling plate 3240, a guide rail 3249, and a driver 3246. The cooling plate 3240 has a substantially circular plate shape when viewed from the top, and has a diameter corresponding to the substrate W. According to an example, the cooling plate 3240 may be provided as a flow path through which the cooling fluid flows. A notch 3244 is formed at the edge of the cooling plate 3240. The notch 3244 may have a shape corresponding to the protrusion 3429 formed on the hand 3420 of the transfer robot 3422 and 3424 described above. In addition, the notch 3244 is provided in a number corresponding to the protrusion 3429 formed in the hand 3420 and is formed at a position corresponding to the protrusion 3429. When the vertical position of the hand 3420 and the cooling plate 3240 is changed in the position where the hand 3420 and the cooling plate 3240 are aligned in the vertical direction, the substrate W between the hand 3420 and the cooling plate 3240 is changed. Delivery takes place. The guide rail 3249 and the driver 3246 are provided as plate moving members 3249 and 3246 for moving the cooling plate. The cooling plate 3240 is mounted on the guide rail 3249 and may be moved between the first position and the second position along the guide rail 3249 by a driver 3246. Here, the first position is a position where the cooling plate 3240 faces the substrate support unit 830, and the second position is a position away from the first position. The second position is a position closer to the entry/exit of the housing than the first position. The cooling plate 3240 is provided with a plurality of slit-shaped guide grooves 3242. The guide groove 3242 extends from the end of the cooling plate 3240 to the inside of the cooling plate 3240. The guide groove 3242 is provided along the second direction 14 in its longitudinal direction, and the guide grooves 3242 are positioned to be spaced apart from each other along the first direction 12. The guide groove 3242 prevents the cooling plate 3240 and the lift pin 1340 from interfering with each other when the substrate W is transferred between the cooling plate 3240 and the processing unit 800.

The substrate W is heated while the substrate W is directly placed on the support plate 1320, and the cooling plate 3240 on which the substrate W is placed is the cooling plate 3222. It is made in the state of being in contact with. The cooling plate 3240 is made of a material having a high heat transfer rate so that heat transfer between the cooling plate 3222 and the substrate W is well performed. According to an example, the cooling plate 3240 may be made of a metal material.

8 is a cross-sectional view illustrating the processing unit of FIG. 7, and FIG. 9 is a plan view illustrating the processing unit of FIG. 8. The processing unit 800 is provided as an apparatus for forming a liquid film on the substrate W. The processing unit 800 includes a processing vessel 850, an airflow providing unit 820, a substrate (W) support unit 830, a heating unit 860, an elevating unit 890, a liquid supply unit 900, and a controller. Including 990.

The processing vessel 850 is located in the inner space of the housing 810. The processing container 850 is provided to have a cup shape with an open top. The processing container 850 provides a processing space 812 in which a coating process, a baking process, and a developing process of the substrate W are performed. The processing container 850 includes a first collecting container 852 and a second collecting container 858. The first recovery container 852 is provided as a container for recovering the photoresist treated with the substrate W, and the second recovery container 858 is provided as a container for recovering the developer treated with the substrate W. Each of the first recovery container 852 and the second recovery container 858 has an annular ring shape, and the second recovery container 858 has a shape surrounding the first recovery container 852.

The first collection container 852 includes an inner cup 854 and an outer cup 856. The space between the outer cup 856 and the inner cup 854 functions as an inlet through which the photoresist is introduced.

The inner cup 854 is provided in a circular plate shape surrounding the rotation shaft 834. When viewed from the top, the inner cup 854 is positioned to overlap the inner exhaust port 814. When viewed from above, the upper surface of the inner cup 854 is provided so that the outer region and the inner region each are inclined at different angles from each other. According to an example, the outer region of the inner cup 854 faces a downwardly inclined direction as it moves away from the substrate support unit 830, and the inner region faces an upwardly inclined direction as it moves away from the substrate support unit 830. Is provided to A point where the outer region and the inner region of the inner cup 854 meet each other is provided to correspond to the side end portion of the substrate W in the vertical direction. An area outside the upper surface of the inner cup 854 is provided to be rounded. An area outside the upper surface of the inner cup 854 is provided concave down. An area outside the upper surface of the inner cup 854 may be provided as an area through which the treatment liquid flows.

The outer cup 856 is provided to have a cup shape surrounding the substrate support unit 830 and the inner cup 854. The outer cup 856 has a bottom wall, a side wall, an upper wall, and an inclined wall. The bottom wall is provided to have a circular plate shape having a hollow. A recovery line 855 is formed on the bottom wall. The recovery line 855 recovers the processing liquid supplied on the substrate W. The treatment liquid recovered by the recovery line 855 may be reused by an external liquid recovery system. The sidewall is provided to have a circular cylindrical shape surrounding the substrate support unit 830. The side wall extends in a vertical direction from the side end of the bottom wall. The side wall extends upward from the bottom wall.

The inclined wall extends in the inner direction of the outer cup 856 from the upper end of the side wall. The inclined wall is provided so as to be closer to the substrate support unit 830 as it goes upward. The inclined wall is provided to have a ring shape. The upper end of the inclined wall is positioned higher than the substrate W supported by the substrate support unit 830.

The second collection container 858 is provided in a cup shape surrounding the outer cup 856. The second collection container 858 is provided in a shape larger than the outer cup 856 so as to surround the outer cup 856. The space between the second collection container 858 and the outer cup 856 functions as an inlet through which the developer is introduced.

The airflow providing unit 820 forms a downward airflow in the housing 3210. The airflow providing unit 820 includes a fan 824, an airflow supply line 822, and a filter 826. The fan 824 is positioned to face the processing vessel 850 on the ceiling surface of the housing 3210. The fan 824 forms a downward airflow in the processing space 812 of the processing container 850. Airflow supply line 822 is connected to fan 824 outside of housing 3210. The airflow supply line 822 supplies external air into the housing 3210. The filter 826 filters air provided from the airflow supply line 822. The filter 826 removes impurities contained in air. When air is supplied to the fan 824 from the airflow supply line 822, the fan 824 supplies air in a downward direction.

The substrate support unit 830 supports the substrate W in the processing space 812. The substrate support unit 830 supports and rotates the substrate W. The substrate support unit 830 includes a support plate 832, rotation drivers 834 and 836, and a lift pin 1340. The support plate 832 is provided in a generally circular shape when viewed from the top. The upper surface of the support plate 832 is provided as a seating surface on which the substrate W is placed. The substrate W may be placed on the upper surface of the support plate 832 in contact with it. When viewed from the top, the support plate 832 has a size smaller than that of the substrate W, but is provided in a predetermined size or more. For example, the area of the upper surface of the support plate 832 may be 80% or more of the substrate W. This is for conducting heat through the support plate 832 to heat more than a certain portion of the substrate W. According to an example, the support plate 832 may chuck the substrate W by vacuum suctioning the substrate W. Optionally, the support plate 832 may be provided as an electrostatic chuck for chucking the substrate W using static electricity. In addition, the support plate 832 may chuck the substrate W with a physical force.

The rotation drivers 834 and 836 support the support plate 832 and selectively rotate the support plate 832. The rotation drivers 834 and 836 include a rotation shaft 834 and a driver 836. The rotation shaft 834 supports the support plate 832 under the support plate 832. The rotation shaft 834 is provided so that its longitudinal direction faces up and down. The rotation shaft 834 is provided to be rotatable about its central axis. The driver 836 provides a driving force so that the rotation shaft 834 is rotated. For example, the driver 836 may be a motor capable of varying the rotational speed of the rotation shaft 834.

The lift pin 1340 is moved up and down to lower the substrate W on the support plate 832 or lift the substrate W from the support plate 832. The lift pins 1340 are provided in plural, and are arranged to have an annular ring shape by being combined with each other. When viewed from the top, the lift pins 1340 are positioned to overlap with the support plate 832. The lift pin 1340 is provided on the support plate 832, and the lift pin 1340 may be moved up and down to be inserted into the support plate 832 or positioned to protrude upward from the support plate 832.

Optionally, when viewed from the top, the lift pins 1340 may be positioned to surround the support plate 832. When viewed from above, the lift pins 1340 do not overlap with the support plate 832, but may be positioned so as to overlap with the substrate W placed on the support plate 832.

The heating unit 860 heats the substrate W supported on the support plate 832. The heating unit 860 includes a plurality of heaters 862. A plurality of heaters 862 are located within the support plate 832, each of which is located on the same plane. The heaters 862 heat different regions of the seating surface of the support plate 832. When viewed from above, regions of the support plate 832 corresponding to each heater 862 may be provided as heating zones. Some of the heaters 862 may be located in the central region of the support plate 832, and other parts may be located at the edges. Each heater 862 is independently adjustable in temperature. The heater 862 may be a thermoelectric element or a heating wire.

The elevating unit 890 lifts and moves the first retrieval tank 852 and the second retrieval tank 858, respectively. The lifting unit 890 includes an inner moving member 892 and an outer moving member 894. The inner moving member 892 lifts and moves the first collecting container 852, and the outer moving member 894 moves the second collecting container 858 up and down. Unlike this, the first collection container 852 and the second collection container 858 are provided as an integral type and can be moved up and down together.

The liquid supply unit 900 supplies a photosensitive liquid, a developer, and a rinse liquid on the substrate W. The liquid supply unit 900 includes a photoresist supply unit 920, a developer supply unit 940, and a rinse solution supply unit 960. The photoresist supply unit 920 supplies a photoresist onto the substrate W, the developer supply unit 940 supplies a developer onto the substrate W, and the rinse solution supply unit 960 supplies a photoresist onto the substrate W. Supply rinse aid.

The photosensitive liquid supply unit 920 supplies the photosensitive liquid in an inkjet manner. The photosensitive liquid supply unit 920 includes a guide rail 922, an application arm 924, an application nozzle 930, and a wetting liquid nozzle. The guide rail 922 and the application arm 924 are provided as a driving of the application nozzle 930 to move the application nozzle 930. The guide rail 922 moves the application arm 924 in the horizontal direction. The guide rail 922 is located on one side of the processing container 850. The guide rail 922 is provided so that its longitudinal direction faces the horizontal direction. According to an example, the length direction of the guide rail 922 may be provided to face a direction parallel to the second direction 14. The guide rail 922 is provided with an application arm 924. The application arm 924 may be moved by a linear motor provided inside the guide rail 922. The application arm 924 is provided to face in a longitudinal direction perpendicular to the guide rail 922 when viewed from above. One end of the application arm 924 is mounted on a guide rail 922, and an application nozzle 930 is installed at the other end, respectively. The application nozzle 930 is moved to the process position and the first air port 920a by the guide rail 922. Here, the process position is a position where the application nozzle 930 faces the substrate W supported by the substrate support unit 830, and the first standby port 920a is provided as a position where the application nozzle 930 is waiting.

FIG. 10 is a cross-sectional view illustrating the application nozzle of FIG. 9, and FIG. 11 is a perspective view illustrating the application nozzle of FIG. 10. 10 and 11, the application nozzle 930 includes an application body 932 and a piezoelectric element 934. A flow path through which the photosensitive liquid flows is formed in the coating body 932, and the piezoelectric element 934 applies pressure to the photosensitive liquid flowing through the flow path to control the discharge and discharge pressure of the photosensitive liquid.

The coating body 932 has a discharge hole 932a for discharging the photoresist in a direction toward the substrate W. A plurality of discharge holes 932a are provided, and are arranged in a line on the bottom surface of the application body 932. Optionally, the discharge holes 932a may be arranged in a plurality of rows. A main flow path 932b, an introduction flow path 932c, a supply flow path 936, and a cleaning liquid flow path 938 are formed inside the coating body 932.

The main flow path 932b is a flow path through which the photosensitive liquid flows, and the discharge holes 932a are provided to extend from the main flow path 932b. For example, the main flow path 932b may be provided adjacent to the bottom surface of the application body 932.

The introduction passage 932c functions as a passage through which the photosensitive liquid is introduced into the coating body 932. The introduction flow path 932c is located above the main flow path 932b. A piezoelectric element 934 is positioned between the introduction passage 932c and the main passage 932b. The piezoelectric element 934 applies pressure to the photosensitive liquid flowing through the main flow path 932b. The photosensitive liquid flowing in the main flow path 932b by the pressure by the piezoelectric element 934 is discharged through the discharge holes 932a. For this reason, the photoresist is discharged in an ink jet method.

The supply flow path 936 supplies the photosensitive liquid accommodated in the photosensitive liquid storage unit 937 to the introduction flow path 932c. The supply flow path 936 is connected to the introduction flow path 932c. A plurality of supply passages 936 are provided, through each of which different types of photosensitive liquids are supplied to the introduction passage 932c. The supply passages 936 are provided independently of each other.

The cleaning liquid flow path 938 is connected to each supply flow path 936. A plurality of cleaning liquid flow paths 938 are provided, and are connected one-to-one to the supply flow path 936. The cleaning liquid flow path 938 supplies the cleaning liquid contained in the cleaning liquid storage unit 939 to each supply flow path. The cleaning liquid flow path 938 supplies the cleaning liquid to the corresponding supply flow path 936 so that the introduction flow path 932c and the one-to-one corresponding supply flow path 936 are cleaned. For example, the cleaning liquid may be a thinner.

The wetting liquid nozzle supplies the wetting liquid onto the substrate W before the photosensitive liquid is supplied. The wetting liquid converts the surface of the substrate W into a wet state. The wetting liquid converts the surface of the substrate W into properties similar to those of the photoresist. The wetting liquid nozzle may supply the wetting liquid to the center of the rotating substrate. Accordingly, the wetting liquid may diffuse to the entire area of the substrate by the centrifugal force of the substrate. For example, the wetting liquid nozzle may be installed on the application arm 924 and moved together with the application nozzle 930 or may be moved independently of the application nozzle 930.

The developer supply unit 940 supplies the developer in a dropwise manner. The developer may be supplied in the form of a stream, which is a water stream, and a liquid curtain, respectively. The developer supply unit 940 includes a rotating shaft 942, a developing arm 944, and a developing nozzle 950. The rotation shaft 942 and the developing arm 944 are provided as a nozzle driver for moving the developing nozzle 950. The rotation shaft 942 is located on one side of the processing container 850. The rotation shaft 942 is positioned so as not to overlap with the path through which the application nozzle 930 and the application arm are moved. The rotation shaft 942 is rotatable about a magnetic center axis by a driver (not shown). The developing arm 944 has a bar shape extending in a vertical direction from the upper end of the rotation shaft 942. A developing nozzle 950 is installed at the end of the developing arm 944. The developing nozzle 950 is moved to the process position and the second atmospheric port 940a by the developing arm 944 and the rotating shaft 942. Here, the process position is a position where the developing nozzle 950 faces the substrate W supported by the substrate support unit 830, and the second standby port 940a is provided as a position where the developing nozzle 950 is waiting.

12 is a perspective view showing the developing nozzle of FIG. 9. Referring to FIG. 12, the developing nozzle 950 includes a body 952 and a developing body 956. A circular discharge port 952b and a wetting liquid discharge port 952a are formed on the bottom of the body 952. The circular discharge port 952b and the wetting liquid discharge port 952a are arranged along one direction. The developer is discharged in the form of a circular stream through the dropping method to the circular discharge port 952b, and the pre-wetting liquid is discharged in the form of a circular stream through the dropwise method of the wetting liquid discharge port 952a. The developing body 956 is coupled to one side of the body 952. A slit discharge port 958 is formed in the developing body 956. The slit discharge port 958 has a longitudinal direction parallel to the direction in which the circular discharge port 952b and the wetting liquid discharge port 952a are arranged. The slit discharge port 958 is provided to be inclined downward as it approaches the body. The same type of liquid as the liquid discharged from the circular discharge port 952b may be discharged through the slit discharge port 958. In the slit discharge port 958, the developer is discharged in the form of a stream of a liquid curtain in a dropwise manner. According to an example, the developer may be supplied first through the circular discharge port 952b and then secondly supplied through the slit discharge port 958. The developer in the form of a circular stream forms a uniform developer film on the substrate W, and the developer in the form of a stream in the liquid curtain may increase the thickness of the developer film.

Referring back to FIGS. 8 and 9, the rinse liquid supply unit 960 supplies the rinse liquid in a dropwise manner. The rinse liquid may be supplied in the form of a circular stream. The rinse liquid supply unit 960 includes a rotation shaft 962, a rinse arm 964, and a rinse nozzle 966. The rotation shaft 962 and the rinse arm 964 are provided as a nozzle driver that moves the rinse nozzle 966. The rotating shaft is located on the other side of the processing container 850. The rotation axis is positioned so as not to overlap the path through which the application nozzle 930 and the application arm 924 are moved. The rotation shaft 962 is rotatable about a magnetic center axis by a driver (not shown). The rinse arm 964 has a bar shape that extends in a vertical direction from an upper end of the rotation shaft 962. A rinse nozzle 966 is installed at the end of the rinse arm 964. The rinse nozzle 966 is moved to the process position and the third standby port 960a by the rinse arm 964 and the rotation shaft 962. Here, the process position is a position where the rinse nozzle 966 faces the substrate W supported by the substrate support unit 830, and the third standby port 960a is provided as a position where the rinse nozzle 966 is waiting. For example, the rinse liquid may be a liquid capable of rinsing a developer. The rinse liquid may be pure.

The first waiting port 920a provides a space for the application nozzle 930 to wait. When viewed from the top, the first air port 920a is located on the path through which the application nozzle 930 is moved. The first air port 920a has a cup shape with an open top, and cleans the foreign matter remaining in the coating nozzle 930. The first cleaning liquid is accommodated in the first air port 920a, and the application nozzle 930 is moved so as to be immersed in the first cleaning liquid to clean the application nozzle 930. For example, the first cleaning liquid may be thinner.

The second atmospheric port 940a provides a space in which the developing nozzle 950 waits. When viewed from above, the second atmospheric port 940a is located on a path through which the developing nozzle 950 is moved. The second atmospheric port 940a has a cup shape with an open top, and cleans the foreign matter remaining in the developing nozzle 950. The second cleaning liquid is accommodated in the second air port 940a, and the developing nozzle 950 is moved to be immersed in the second cleaning liquid to clean the developing nozzle 950. For example, the second cleaning solution may be a rinse solution. The second cleaning liquid may be pure.

The third waiting port 960a provides a space for the rinse nozzle 966 to wait. When viewed from above, the third air port 960a is located on the path through which the rinse nozzle 966 is moved. The third air port 960a has a cup shape with an open top, and cleans the foreign matter remaining in the rinse nozzle 966. A third cleaning liquid is accommodated in the third air port 960a, and the rinse nozzle 966 is moved so as to be immersed in the third cleaning liquid to clean the rinse nozzle 966. For example, the third cleaning liquid may be pure water.

The controller 990 controls the photoresist supply unit 920, the developer supply unit 940, the substrate support unit 830, and the heating unit 860. The controller 990 is a coating process of forming a photoresist film by coating and processing a photoresist on the substrate W, a developing process of supplying a developer to the exposed substrate W and developing, and heating to heat the substrate W. Each unit can be controlled so that the process proceeds.

The controller 990 controls the valves installed in the supply flow path 936 so that any one of different types of photoresist is selectively supplied by the plurality of supply flow paths 936 connected to the body 932 during the coating process. do.

After the application process, the controller 990 supplies a cleaning solution to a supply flow path supplied with a photoresist among the plurality of supply flow paths 936 to clean the inside of the supply flow path 936 and the body 932. Valves installed in the cleaning fluid flow path 938 may be controlled as possible. This cleaning process may be performed while waiting in the first waiting port 920a.

For each process, the controller 990 turns off the heater 862 during the liquid treatment process in which the liquid is supplied to the substrate W, and turns on the heater 862 during the heating process. ) To control.

In addition, the controller 990 controls the rotation drivers 834 and 836 to rotate or stop the support plate 832 according to the type of liquid supplied to the substrate W. According to an example, the controller 990 may control the rotation drivers 834 and 836 to stop rotation of the substrate W and the support plate 832 while the photoresist is supplied to the substrate W. In addition, the controller 990 may control the rotation drivers 834 and 836 so that the substrate W and the support plate 832 are rotated while the wetting liquid, the developer, and the rinse liquid are supplied onto the substrate W.

Referring back to FIGS. 3 and 4, a plurality of buffer chambers 3800 are provided. Some of the buffer chambers 3800 are disposed between the index module 20 and the transfer chamber 3400. Hereinafter, these buffer chambers are referred to as a front buffer 3802. The shear buffers 3802 are provided in plural, and are positioned to be stacked with each other along the vertical direction. Other portions of the buffer chambers 3802 and 3804 are disposed between the transfer chamber 3400 and the interface module 40 below. These buffer chambers are referred to as rear buffer 3804. The rear buffers 3804 are provided in plural, and are positioned to be stacked with each other along the vertical direction. Each of the front buffers 3802 and the rear buffers 3804 temporarily stores a plurality of substrates W. The substrate W stored in the shear buffer 3802 is carried in or taken out by the index robot 2200 and the transfer robot 3422. The substrate W stored in the rear buffer 3804 is carried in or taken out by the transfer robot 3422 and the first robot 4602.

The interface module 40 connects the processing module 30 to an external exposure apparatus 50. The interface module 40 has an interface frame 4100, an additional process chamber 4200, an interface buffer 4400, and a transfer member 4600.

A fan filter unit for forming a downward airflow therein may be provided at an upper end of the interface frame 4100. The additional process chamber 4200, the interface buffer 4400, and the transfer member 4600 are disposed inside the interface frame 4100. The additional process chamber 4200 may perform a predetermined additional process before the substrate W having the process completed in the process block 31 is carried into the exposure apparatus 50. Optionally, the additional process chamber 4200 may perform a predetermined additional process before the substrate W, which has been processed in the exposure apparatus 50, is carried into the process block 31. According to an example, the additional process is an edge exposure process of exposing the edge region of the substrate W, a top surface cleaning process of cleaning the upper surface of the substrate W, or a lower surface cleaning process of cleaning the lower surface of the substrate W. I can. A plurality of additional process chambers 4200 may be provided, and they may be provided to be stacked on each other. All of the additional process chambers 4200 may be provided to perform the same process. Optionally, some of the additional process chambers 4200 may be provided to perform different processes.

The interface buffer 4400 provides a space in which the substrate W transferred between the process block 31, the additional process chamber 4200, the exposure apparatus 50, and the process block 31 temporarily stays during transfer. A plurality of interface buffers 4400 may be provided, and a plurality of interface buffers 4400 may be provided to be stacked on each other.

According to an example, an additional process chamber 4200 may be disposed on one side and an interface buffer 4400 may be disposed on the other side based on an extension line in the length direction of the transfer chamber 3400.

The transfer member 4600 transfers the substrate W between the process block 31, the additional process chamber 4200, the exposure apparatus 50, and the process block 31. The transfer member 4600 may be provided as one or a plurality of robots. According to an example, the carrying member 4600 has a first robot 4602 and a second robot 4606. The first robot 4602 transfers the substrate W between the process block 31, the additional process chamber 4200, and the interface buffer 4400, and the interface robot 4606 transfers the interface buffer 4400 and the exposure apparatus ( 50), and the second robot 4604 may be provided to transport the substrate W between the interface buffer 4400 and the process block 31.

Each of the first robot 4602 and the second robot 4606 includes a hand on which the substrate W is placed, and the hand moves forward and backward, rotates about an axis parallel to the third direction 16, and It may be provided to be movable along the three directions (16).

The hand of the index robot 2200, the first robot 4602, and the second robot 4606 may all be provided in the same shape as the hand 3420 of the transfer robots 3422 and 3424. Optionally, the hand of the robot that directly exchanges the substrate (W) with the cooling plate 3240 of the heat treatment chamber is provided in the same shape as the hand 3420 of the transfer robot 3422 and 3424, and the hands of the other robots have a different shape. Can be provided.

According to an embodiment, the index robot 2200 is provided to directly exchange the substrate W with the processing unit 800 of the shear heat treatment chamber 3200 provided in the process block 31.

In addition, the process block 31 and the transfer robot 3422 provided in the process block 31 may be provided to directly exchange the substrate W with the cooling plate 3240 located in the heat treatment chamber 3200.

Next, an embodiment of a method of processing a substrate using the substrate processing apparatus 1 described above will be described.

A coating process, an edge exposure process, an exposure process, and a developing process are sequentially performed on the substrate W.

The coating process and the developing process are respectively performed in the processing chamber 3600. According to an example, the coating process and the developing process may be performed in the same processing chamber 3600 or in different processing chambers 3600. A heating process of heating the substrate W is performed before and after the coating process and before and after the developing process. According to an example, a heating process before application may be performed before the application process, a heating process after application is performed after the application process, a heating process before development may be performed before the development process, and a heating process after development may be performed after the development process. have.

Hereinafter, an example of a conveyance path of the substrate W from the container 10 to the exposure apparatus 50 will be described.

The index robot 2200 takes out the substrate W from the container 10 and transfers the substrate W to the front end buffer 3802. The transfer robot 3422 transfers the substrate W stored in the shear buffer 3802 to one of the processing chambers 3600. The substrate W transports the substrate W to the processing unit 800 by the cooling plate 3240.

In the processing unit 800, a heating process before application of the substrate W, an application process, and a heating process after application are sequentially performed. 13 is a cross-sectional view showing a heating process before application of a substrate, FIG. 14 is a cross-sectional view showing a coating process of a substrate, and FIG. 15 is a cross-sectional view showing a heating process after application of a substrate.

When the substrate W is placed on the substrate support unit 830 of the processing unit 800, a heating process is performed before the substrate W is applied.

When the heating process before application is performed, the substrate W is in a stopped state, and the power source 864 of the heater 862 is turned on to heat the substrate. When the heating process before coating is completed, the coating process is performed.

In the coating process, the substrate W is maintained in a stationary state. The coating nozzle 930 is moved to the process position and supplies a photoresist onto the substrate W in an inkjet manner. The coating nozzle 9300 discharges the photosensitive liquid while scanning and moving the substrate W so that the impact position of the photosensitive liquid includes the entire area of the substrate W. Since the photosensitive liquid is discharged by an inkjet method, the photosensitive liquid is uniform on the substrate W. A film can be formed and a thin photoresist film can be formed compared to the dropping method, thereby reducing the consumption of the photoresist and minimizing volatile substances generated from the photosensitive liquid. In this embodiment, the photoresist is discharged in an ink-jet method, thereby minimizing the consumption of the photoresist to minimize volatile substances. By minimizing it, the coating process can be performed in the same chamber as the developing process and the bake process.

In addition, since excess liquid is not generated among the discharged photosensitive liquid, the recovery of the photosensitive liquid does not occur, thereby preventing contamination of peripheral devices. However, in the above-described embodiment, it has been described that the first collection container recovers the photoresist. In this case, the photoresist may be excessively discharged due to an error or defect of the device, and a first collection container 852 for recovering the photoresist is required in preparation for this case. When the coating process is completed, the coating nozzle 930 is moved to the first waiting port 920a to wait, and a heating process is performed after coating. At this time, the coating nozzle 930 performs a cleaning step of cleaning the inside of the body 932 and the supply passage 936 supplied with the photoresist from the first air port 920a. The cleaning liquid is supplied to the supply flow path 936 to which the photoresist is supplied among the plurality of supply flow paths 936 to clean the supply flow path 936 and the inside of the body 932.

The heating process after application is performed under the same conditions as the heating process before application. However, the heating process after application may heat the substrate W at a lower temperature than the heating process before application.

When the heating process is completed after application, the substrate W is moved from the first position to the second position by the cooling plate 3240. While the substrate W is placed on the cooling plate 3240, the substrate W is cooled. Thereafter, the transfer robot 3422 takes over from the cooling plate 3240 and transfers the substrate W to the rear buffer 3804. The first robot 4602 of the interface module 40 carries out the substrate W from the rear buffer 3804 and transfers the substrate W to the auxiliary process chamber 4200.

An edge exposure process is performed on the substrate W in the auxiliary process chamber 4200.

Thereafter, the first robot 4602 carries out the substrate W from the auxiliary process chamber 4200 and transfers the substrate W to the interface buffer 4400.

Thereafter, the second robot 4606 takes out the substrate W from the interface buffer 4400 and transfers it to the exposure apparatus 50.

Next, an example of a conveyance path of the substrate W from the exposure apparatus 50 to the container 10 will be described.

The second robot 4606 unloads the substrate W from the exposure apparatus 50 and transfers the substrate W to the interface buffer 4400.

Thereafter, the first robot 4602 removes the substrate W from the interface buffer 4400 and transfers the substrate W to the rear buffer 3804. The transfer robot 3422 carries out the substrate W from the rear buffer 3804 and transfers the exposed substrate to the processing chamber 3600.

The transfer robot 3422 takes over the substrate W to the cooling plate 3240 located in the processing chamber 3200. The substrate W is conveyed to the processing unit 800 by the cooling plate 3240. In the processing unit 800, a heating process before development, a development process, a heating process after development, and a rinse process of the substrate W are sequentially performed. 16 is a cross-sectional view showing a heating process before development of a substrate, FIG. 17 is a cross-sectional view showing a developing process of a substrate, FIG. 18 is a cross-sectional view showing a rinsing process of a substrate, and FIG. 19 is a cross-sectional view showing a heating process after development of the substrate to be. When the substrate W is placed on the support plate 832 from the cooling plate 3240, a heating process before development is performed.

When the heating process before development proceeds, the substrate W is in a stopped state, and the power source 864 of the heater 862 is turned on to heat the substrate. When the heating process before development is completed, the developing process is performed.

When the developing process proceeds, the substrate W is rotated. The developing nozzle 950 is moved to the process position to supply the developer onto the substrate W in the form of a circular stream, and then in the form of a liquid curtain. When the developer is supplied in the form of a circular stream, the developing nozzle 950 supplies the developer to the center of the substrate W, and when the developer is supplied in the form of a liquid curtain, the developer moves from the center of the substrate W to the edge region and supplies the developer. do. When the developing process is completed, a rinse process is performed.

When the rinsing process proceeds, the substrate W is maintained in a rotating state. The rinse nozzle 966 is moved to the process position to supply the rinse liquid onto the substrate W. The rinse liquid rinses the developer remaining on the substrate W. When the rinsing process is completed, a heating process is performed after development.

The heating process after development is performed under the same conditions as the heating process before development. However, the heating process after development may heat the substrate at a different temperature than the heating process before development.

When the heating process after development is completed, the cooling plate 3240 moves the substrate W from the substrate support unit 830 to the second position. While the substrate W is placed on the cooling plate 3240, the substrate W is subjected to a cooling process. The substrate W is carried out from the processing chamber 3600 by the transfer robot 3422 and transferred to the front end buffer 3802.

Thereafter, the index robot 2200 takes out the substrate W from the shear buffer 3802 and transfers it to the container 10.

According to the above-described embodiment, it has been described that the discharge holes 932a of the coating nozzle 930 are arranged in a row or in a plurality of rows in one direction. However, the bottom surface of the body 932 of the coating nozzle 930 is provided in a circular shape, and the discharge holes 932a may be uniformly arranged on the circular bottom surface.

It has been described that the coating process and the developing process are respectively performed in the same processing chamber 3600 of the substrate processing apparatus 1 described above. However, unlike this, the coating process and the developing process may be performed in different processing chambers 3600. According to an example, the first substrate W before the coating process performs the coating process in any one of the processing chambers 3600, and the exposed second substrate W is the one of the processing chambers 3600. The development process can be carried out at. Thereafter, the exposed first substrate W may perform a development process in another one of the processing chambers.

In addition, the exposed substrate W may be conveyed to the processing chamber 3600 which is in a process standby state among the processing chambers 3600 to perform a developing process. Here, the processing chamber 3600 waiting for a process is defined as a processing chamber 3600 in which a process is not being processed.

Also, unlike the above-described embodiment, the processing module 30 may include a coating module and a developing module. The coating module and the developing module may be positioned to be stacked on each other.

An application chamber is provided in the application module, and a heating process before application, an application process, and a heating process after application may be performed in the application chamber. In addition, a developing chamber may be provided in the developing module, and a heating process before development, a developing process, a rinsing process, and a heating process after development may be performed in the developing chamber.

Each of the application chamber 3600 and the development chamber 3200 includes a housing 3210, a cooling unit 3220, and a processing unit 800, generally similar to the processing chamber 3600 of FIG. 8. However, the processing unit of the application chamber 3600 has a shape in which the developer supply unit 940 and the rinse solution supply unit 960 are excluded from the processing chamber 3600 of FIG. 8, and the processing unit of the developing chamber 3200 is The photoresist supply unit 920 is excluded from the processing chamber 3600 of FIG. 8. Accordingly, the substrate W is subjected to a coating process and a heating process related thereto in the coating module, and after exposure treatment thereafter, is transferred to the developing module 3200 to perform a developing process and a heating process related thereto.

Optionally, the process module may include the above-described application chamber and development chamber, and may be positioned such that application chambers are arranged on one side of the transfer chamber 3400 and development chambers are arranged on the other side of the transfer chamber 3400.

The detailed description above is to illustrate the present invention. In addition, the above description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in the present specification, the scope equivalent to the disclosed contents, and/or the technology or knowledge in the art. The above-described embodiments are to describe the best state for implementing the technical idea of the present invention, and various changes required in the specific application fields and uses of the present invention are also possible. Therefore, the detailed description of the invention is not intended to limit the invention to the disclosed embodiment. In addition, the appended claims should be construed as including other embodiments.

800: processing unit 830: substrate support unit
850: processing vessel 860: heater unit
900: liquid supply unit 920: photosensitive liquid supply unit
930: application nozzle 932: application body
934: piezoelectric element 932a: discharge hole
932b: main euro 932c: introduction euro

Claims (20)

In the unit for supplying a photoresist onto a substrate,
Including a coating nozzle for supplying a photoresist,
The application nozzle,
A body having a main flow path through which the photosensitive liquid flows, and a plurality of discharge holes through which the photosensitive liquid is discharged to the outside by being connected to the main flow path;
And a piezoelectric element installed in the body and applying pressure to discharge the photosensitive liquid flowing through the main flow path through the discharge hole,
The piezoelectric element,
Supplying the photoresist to the substrate through the discharge hole in an inkjet method,
An introduction passage connected to the main passage and a plurality of supply passages connected to the introduction passage are further formed inside the body,
A liquid supply unit in which different types of photosensitive liquids are selectively supplied to the introduction passage from the plurality of supply passages. delete The method of claim 1
The introduction flow path is located above the main flow path, and the piezoelectric element is a liquid supply unit located between the introduction flow path and the main flow path. The method of claim 3,
A liquid supply unit connected to each of the supply flow paths in the body and further comprising a plurality of cleaning liquid flow paths for supplying a cleaning liquid to the supply flow path so that the supply flow path and the introduction flow path are cleaned. The method of claim 4,
The unit,
Further comprising a controller for controlling a valve for opening and closing each of the plurality of supply flow paths and the plurality of cleaning liquid flow paths,
The controller is a liquid supply unit configured to control the valve so that a photosensitive liquid is supplied from one of the supply flow paths and a cleaning liquid is supplied to the one before the photosensitive liquid is supplied from the other. The method according to any one of claims 1 and 3 to 4,
The unit,
A coating nozzle driver for moving a relative position between the coating nozzle and the substrate;
Further comprising a controller for controlling the coating nozzle driver and the coating nozzle,
The controller is a liquid supply unit for controlling the coating nozzle driver so that the coating nozzle is moved while the photoresist is supplied to the substrate. The method of claim 6,
The unit,
A wetting liquid nozzle for supplying a wetting liquid onto the substrate before the photosensitive liquid is supplied;
Moving the wetting liquid nozzle, further comprising a wetting liquid nozzle driver controlled by the controller,
The controller is a liquid supply unit that controls the wetting liquid nozzle driver so that movement of the wetting liquid nozzle is stopped while the wetting liquid is supplied to the substrate. In the apparatus for forming a liquid film on a substrate,
A substrate support unit supporting a substrate;
Comprising a liquid supply unit having a coating nozzle for supplying a photosensitive liquid on the substrate,
The application nozzle,
A body having a main flow path through which the photosensitive liquid flows, and a plurality of discharge holes through which the photosensitive liquid is discharged to the outside by being connected to the main flow path;
A piezoelectric element installed in the body and provided above the main flow path to apply pressure so that the photosensitive liquid flowing through the main flow path is discharged through the discharge hole,
The piezoelectric element,
Supplying the photoresist to the substrate through the discharge hole in an inkjet method,
An introduction passage connected to the main passage and a plurality of supply passages connected to the introduction passage are further formed inside the body,
A substrate processing apparatus in which different types of photoresist are selectively supplied to the introduction passage from the plurality of supply passages. delete According to claim 8
The introduction passage is positioned above the main passage, and the piezoelectric element is positioned between the introduction passage and the main passage. The method of claim 10,
The substrate processing apparatus further includes a plurality of cleaning liquid flow paths connected to each of the supply flow paths in the body and supplying a cleaning liquid to the supply flow path so that the supply flow path and the introduction flow path are cleaned. The method of claim 11,
The liquid supply unit,
Further comprising a controller for controlling a valve for opening and closing each of the plurality of supply flow paths and the plurality of cleaning liquid flow paths,
The controller controls the valve so that a photosensitive liquid is supplied from one of the supply passages and a cleaning liquid is supplied to the one before the photosensitive liquid is supplied from the other. The method according to any one of claims 8 and 10 to 11,
The liquid supply unit,
A coating nozzle driver for moving a relative position between the coating nozzle and the substrate;
Further comprising a controller for controlling the coating nozzle driver and the coating nozzle,
The controller controls the coating nozzle driver to move the coating nozzle while the photoresist is supplied to the substrate. The method of claim 13,
The controller further controls the substrate support unit so that rotation of the substrate is stopped while the photoresist is supplied to the substrate. The method of claim 13,
The device,
A substrate processing apparatus further comprising a developer supply unit having a developing nozzle for supplying a developer onto a substrate supported by the substrate support unit. In the method of processing a substrate,
Including a coating step of applying a photosensitive solution on the substrate,
The body from which the photosensitive liquid is discharged has a main flow path through which the photosensitive liquid flows and a plurality of discharge holes extending from the main flow path through which the photosensitive liquid is discharged,
In the application step,
The photoresist is,
It is installed in the body and is supplied to the substrate in an inkjet manner through a piezoelectric element that is provided above the main flow path and applies pressure so that the photosensitive liquid flowing through the main flow path is discharged through the discharge hole,
Different types of photoresists are selectively introduced into the body, and the different types of photoresists are selectively supplied by a plurality of supply passages connected to the body. delete The method of claim 16,
The different types of photoresists are selectively supplied by a plurality of supply flow paths connected to the body,
After the applying step, the substrate processing method further comprising a cleaning step of cleaning the inside of the supply channel and the body by supplying a cleaning solution to a supply channel selectively supplied with the photosensitive solution among the plurality of supply channels. The method according to any one of claims 16 or 18,
The substrate processing method in which the rotation of the substrate is stopped in the coating step. The method of claim 19,
In the coating step, the coating nozzle is moved so that the relative position of the coating nozzle for supplying the photoresist and the substrate is changed.

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