KR100925898B1 - Coat/develop module with shared dispense - Google Patents

Abstract

An apparatus for dispensing fluid during a processing operation of a semiconductor substrate is provided. The apparatus includes a central fluid dispensing reservoir comprising a plurality of dispensing nozzles connected to a plurality of fluid sources and a first processing chamber located on the first side of the central fluid dispensing reservoir. The apparatus further includes a second processing chamber located on the second side of the central fluid dispensing reservoir and a dispensing arm moving between the central fluid dispensing reservoir, the first processing chamber and the second processing chamber.

Coatings, developing, fluid distribution devices, nozzles, semiconductor substrates, track lithography tools.

Description

Coating / Development Module with Shared Dispensing {COAT / DEVELOP MODULE WITH SHARED DISPENSE}

The present invention generally relates to the field of semiconductor processing equipment. In particular, the present invention relates to a method and apparatus for dispensing fluid on a semiconductor substrate. By way of example only, the method and apparatus apply to two process chambers in a coating / development module that share a central fluid distribution reservoir. However, it will be appreciated that the present invention can be applied to a wider range.

Portions of the electronic device forming process are typically multi-chamber processing systems (eg, clusters) that have the ability to sequentially process substrates (eg, semiconductor wafers) in a controlled processing environment. Performed within a tool (cluster tool). Typical cluster tools used for the deposition (ie, coating) and development of photoresist materials are commonly known as track lithography tools. The cluster tool may include a main frame for receiving a multi-substrate transfer robot, which carries a substrate between a plurality of processing chambers and a pod / cassette mounting device connected to the main frame. do. Cluster tools are often used to be able to process substrates in a repeatable manner in a controlled processing environment. The controlled processing environment has various advantages, including minimizing substrate surface contamination during transfer and during the completion of various substrate processing steps. Thus, processing in a controlled environment reduces the number of defect occurrences and improves device yield.

Two types of process chambers typically included in track lithography tools are substrate coating modules and substrate development modules, collectively referred to as coating / developing modules. In general, in coating modules, a spin coating process is used to form a layer or other coating of photoresist on the top surface of the substrate. One method is to mount the substrate on a spin chuck, which is rotated to thousands of revolutions per minute (RPB). A few mm of liquid (e.g. photoresist) is applied to the central region of the substrate and the rotational action of the spin chuck distributes the liquid over the surface of the substrate. As is well known to those skilled in the art, the coating is processed in subsequent steps to form a feature on the substrate. In the developing module, a developer is applied to the surface of the substrate after exposure of the photoresist. The coating / developing modules include, among other elements, a number of similarities as well as a number of differences including different nozzle designs corresponding to the variation in viscosity of the dispensing fluid.

In certain known coating / developing modules, a single spin bowl is attached to a system for dispensing photoresist or other coating liquid. For certain photoresist coating applications, it is desirable to supply a number of different coatings comprising different thicknesses and materials. In particular, due to the industrial transition to 300 mm substrates, the number of different coating solutions increased. Thus, for a given coating / development module, in particular for a photoresist coating module, the dispensing system may include a plurality of dispensing nozzles that disperse different photoresists. In addition, a number of other dispensing nozzles may be included that supply the photoresist while varying the concentrations of solution and solvent.

In certain coating / development modules, the dispensing nozzles are manufactured to have the correct tolerances according to the tolerances associated with the particular semiconductor processing. For some of these modules, due to the number and quality of the dispensing nozzles, the cost of the dispensing system may be greater than the cost of the spin balls.

In general, application of coating / developing rotates the substrate to reach a predetermined rotational speed, dispenses the coating fluid, and continues to rotate the substrate for a predetermined period after the dispensing step is complete. As noted above, rotation of the substrate is used to distribute the coating fluid over the surface of the substrate. In this process, the dispensing system is inactive while the substrate rotation dispenses resist. Thus, in some distribution systems, the most expensive system components, i.e., the components included in the distribution device, are not used during an important part of the processing time.

Other coating modules known in the art use multiple spin balls. An example of a coating apparatus comprising two spin chucks in a single case is described in US Pat. No. 5,250,114. Wafers are loaded and unloaded onto the spin chuck by a single robot outside the case. A single resist nozzle dispensing resist liquid is attached to a nozzle arm attached to a circulation belt surrounding two rollers. The circulation belt is driven by a motor. By using the motor and the circulation belt, the nozzle arm can support both spin chucks.

The system described in US Pat. No. 5,205,114 has several problems. First, the system provides only one resist nozzle that dispenses one resist. Thus, the system does not supply a number of different coatings, including coatings of different materials. Secondly, only the cup surrounding each spin chuck blocks the spin chuck and other items contained within the case. The cup is raised to a predetermined position during coating. Although the cup design somewhat contaminates the liquid particles dispersed from the wafer surface, the design does not control the air in the vicinity of the wafer. As a result, airborne particles and solvent mists can migrate from one spin chuck to another, or from a waiting trench, where one nozzle waits, to either of the wafers.

Accordingly, there is a need in the art for improved coating / development modules and improved methods of operating such coating / development modules.

According to the present invention, a technique relating to the field of semiconductor processing equipment is provided. In particular, the present invention includes a method and apparatus for dispensing fluid on a semiconductor substrate. By way of example only, the method and apparatus apply to two process chambers in a coating / development module that share a central fluid distribution reservoir. However, it will be appreciated that the present invention can be applied to a wider range.

In certain embodiments of the present invention, an apparatus for dispensing fluid during a processing operation of a semiconductor substrate is provided. The apparatus includes a central fluid dispensing reservoir comprising a plurality of dispensing nozzles connected to a plurality of fluid sources and a first processing chamber located on the first side of the central fluid dispensing reservoir. The apparatus further includes a second processing chamber located on the second side of the central fluid dispensing reservoir and a dispensing arm moving between the central fluid dispensing reservoir, the first processing chamber and the second processing chamber.

In another embodiment of the present invention, a method is provided for dispensing fluid to a semiconductor substrate using a central fluid dispensing reservoir comprising a plurality of dispensing nozzles, a device comprising first and second processing chambers and dispensing arms. . The method includes selecting a first dispensing nozzle from the plurality of dispensing nozzles and moving the dispensing arm to a first position in the first processing chamber. The method further includes dispensing a first fluid from the first dispensing nozzle and returning the dispensing arm to a second position above the central fluid dispensing reservoir.

In another particular embodiment, an apparatus for dispensing fluid during a semiconductor processing operation is provided. The apparatus includes a central fluid dispensing reservoir comprising a plurality of dispensing nozzles connected to a plurality of fluid sources, a first processing chamber located on a first side of the central fluid dispensing storage portion, between the central fluid dispensing storage portion and the first processing chamber. And a first dispensing arm moving in. The apparatus further includes a second processing chamber located on the second side of the central fluid dispensing reservoir and a second dispensing arm moving between the central fluid dispensing reservoir and the second processing chamber.

In another embodiment of the present invention, a track lithography tool is provided. The track lithography tool includes a front end module receiving a FOUP containing a plurality of substrates, a central module including a plurality of processing tools, and a rear module connected to the scanner. The track lithography tool further comprises at least one robot that receives a substrate from the front end module and delivers the substrate to either or both of the processing tool and the rear module, wherein one of the plurality of processing tools is a semiconductor Apparatus for dispensing fluid during substrate processing operations. The apparatus includes a central fluid dispensing reservoir comprising a plurality of dispensing nozzles connected to a plurality of fluid sources, a first processing chamber located on a first side of the central fluid dispensing reservoir, and a second fluid dispensing reservoir located on a second side of the central fluid dispensing reservoir. And a dispensing arm moving between the two processing chambers and the central fluid dispensing reservoir, the first processing chamber and the second processing chamber.

The present invention achieves many advantages over existing technologies. For example, the present technology allows sharing certain common components, reducing system cost, complexity and footprint. In addition, embodiments of the present invention provide increased system reliability while reducing the number of redundant systems provided for each process room. These and other advantages will be described in more detail throughout this specification, and in particular below.

These and other embodiments of the present invention are described in more detail with reference to the following description and the accompanying drawings, along with various advantages and features.

1A is a simplified perspective view of a fluid dispensing apparatus in accordance with one embodiment of the present invention.

1B is a simplified perspective view of a fluid dispensing apparatus according to another embodiment of the present invention.

2 is a simplified plan schematic diagram of a fluid dispensing apparatus according to an embodiment of the present invention.

3A is a simplified plan schematic diagram of a fluid distribution device in a first mode of operation in accordance with an embodiment of the present invention.

3B is a simplified plan schematic diagram of a fluid distribution device in a second mode of operation according to another embodiment of the present invention.

4A is a simplified flowchart illustrating a method of operating a fluid distribution device according to one embodiment of the present invention.

4B is a simplified flowchart illustrating a method of operating a fluid dispensing apparatus according to another embodiment of the present invention.

5 is a simplified flowchart illustrating a method of operating a fluid dispensing apparatus according to another embodiment of the present invention.

6 is a simplified plan schematic diagram of a fluid dispensing apparatus according to another embodiment of the present invention.

7 is a plan view of one embodiment of a track lithography tool illustrating multiple aspects of the present invention.

8 is a simplified timing diagram illustrating the operation of a fluid distribution device according to one embodiment of the invention.

According to the present invention, a technique related to the field of semiconductor processing equipment is provided. In particular, the present invention includes a method and apparatus for distributing fluid to a semiconductor substrate. By way of example only, the method and apparatus apply to two process chambers in a coating / developing module that share a central fluid distribution reservoir. However, it will be appreciated that the present invention can be applied to a wider range.

7 is a top view of one embodiment of a track lithography tool 710 showing multiple aspects of the present invention that may be advantageously used. As shown in FIG. 7, one embodiment of the track lithography tool 710 includes a front end module (also called factory interface) 750, a central module 850, and a rear module (also called scanner interface) 900. . The shear module 750 generally includes one or more pod assemblies, namely FOUPS 805 (eg, items 805A through D), a shear robot 808, and a shear treatment rack 752. The central module 850 generally includes a first central processing rack 852, a second central processing rack 854, and a central robot 807. The rear module 900 generally includes a rear processing rack 902 and a rear robot 809. In one embodiment, the track lithography tool 710 comprises: a shear robot 808 entering a processing module within the shear processing rack 752; A central robot 807 entering the processing module within the shear processing rack 752, the first central processing rack 852, the second central processing rack 854, and / or the rear processing rack 902; And a rear robot 809 entering the processing module in the rear processing rack 902 and in some cases exchanging a substrate with the stepper / scanner 705. In one embodiment, shuttle robot 810 transfers a substrate between two or more adjacent processing modules held in one or more processing racks (eg, shear processing rack 752, first central processing rack 852, etc.). . In one embodiment, the shear receptacle 804 is used to control the environment around the shear robot 808 and between the pod assembly 805 and the shear treatment rack 752.

7 also illustrates in more detail the possible process chamber configurations found in aspects of the present invention. For example, the shear module 750 generally includes one or more pod assemblies, FOUPs 805, shear robot 808 and shear treatment rack 752. One or more pod assemblies 805 generally receive one or more cassettes 806 that can accommodate one or more substrates "W" or wafers to be processed in the track lithography tool 710. The shearing rack 752 includes a number of processing modules (eg, baking plate 790, cold plate 780, etc.) that perform various processing steps in substrate processing. In one embodiment, the shear robot 808 transports the substrate between cassettes mounted in the pod assembly 805 and one or more processing modules held in the shear processing rack 752.

The central module 850 generally includes a central robot 807, a first central processing rack 852 and a second central processing rack 854. The first central processing rack 852 and the second central processing rack 854 may include various processing modules (eg, coater / developer module 100, baking module 790, cold plate 780, etc.) that perform various processing steps in substrate processing. ). In one embodiment, the central robot 807 transfers the substrate between the shear processing rack 752, the first central processing rack 852, the second central processing rack 854, and / or the rear processing rack 902. In one aspect, the central robot 807 is located in the center between the first central processing rack 852 and the second central processing rack 854 of the central module 850.

The rear module 900 generally includes a rear robot 809 and a rear processing rack 902. The rear processing rack 902 generally includes processing modules (eg, coater / developer module 760, baking module 790, cold plate 780, etc.) that perform various processing steps in substrate processing. In one embodiment, the rear robot 809 transfers a substrate between the rear processing rack 902 and a stepper / scanner 705. The stepper / scanner 705, which is Canon USA Inc. of San Jose, Calif., Nikon Precision Inc. of Belmont, Calif., Or Commercially available from ASML US, Inc. of Tempe, AZ, for example, lithographic projections used in the manufacture of integrated circuits (ICs). projection) device. The scanner / stepper tool 705 exposes a photosensitive material (resist) deposited on a substrate in a cluster tool to a form of electromagnetic radiation, which is applied to an individual layer of an integrated circuit (IC) device to be formed on the substrate surface. Create a corresponding circuit pattern.

In one embodiment, a controller 801 is used to control all components and processes performed in the cluster tool 710. The controller 801 generally communicates with the stepper / scanner 705, monitors and controls aspects of the processes performed in the cluster tool 710, and controls all aspects of the overall substrate processing process. The controller 801, typically a microprocessor based controller, receives inputs from a user and / or various sensors in one of the processing chambers and appropriately processes the chamber components in accordance with the various inputs and software instructions held in the memory of the controller. To control. The controller 801 generally includes a memory and a CPU (not shown) used by the controller to hold various programs, process the programs, and execute the programs as necessary. The memory (not shown) is coupled to the CPU and may include one or more random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or some other form of digital. It may be a readily available memory, local or remote, such as a storage device. Software instructions and data may be coded and stored in a memory for instructing the CPU. A support circuit (not shown) is also connected to the CPU which supports the processor in a conventional manner. The support circuitry may include such things as caches, power supplies, clock circuits, input / output circuitry, subsystems, and the like, which are well known in the art. A program (or computer instruction) that is readable by the controller 801 determines which tasks are to be performed in the processing room (s). Advantageously, the program is software readable by the controller 801 and includes instructions for monitoring and controlling processing based on defined rules and input data.

7 illustrates the coater / developer module 100 mounted in the second central processing rack 854, which may perform the photoresist coating step or the developing step in both the processing chambers 110 and 111. . This configuration has the advantage of allowing certain of the common components in the two processing chambers 110 and 111 to be shared, thereby reducing the system cost, complexity and footprint of the tool. As shown in FIG. 7 and described in more detail below, two spin chucks 130 and 131 are provided in process chambers 110 and 111, respectively. A shared central fluid distribution reservoir 112 is located between the two process chambers, and a dispensing arm assembly 118 may select a nozzle from the central fluid distribution reservoir and support both spin chucks. In embodiments of the present invention, the central robot 807 may enter both process chambers 110 and 111 independently.

1A is a simplified perspective view of a fluid dispensing apparatus in accordance with one embodiment of the present invention. In this figure, the fluid dispensing apparatus of the present invention is shown to be applied to the coater / developer module shown in FIG. 7 for ease of description, but the application of the present invention is not limited thereto. The fluid dispensing device 100 is shown to include a frame 102. Additional components are provided by embodiments of the present invention, but not all components are shown for clarity. For example, the inlet and exhaust ports as well as the electrical supply generally located on the sides of the frame are not shown in FIG. 1A. Additional details regarding certain components are provided in FIG. 2.

As shown in FIG. 1A, two separate process chambers 110 and 111 are disposed in the frame 102 at the left and right sides of the central fluid distribution reservoir 112, respectively. In certain coating / development modules, process chambers 110 and 111 are referred to as process stations. In this specification, the terms processing chamber and processing station are used interchangeably. By way of example only, the present invention applies to a coater / developing module comprising a pair of coating / developing bowls arranged on both sides of the central fluid dispensing reservoir in the lateral direction, but this is not essential to the present invention. In certain embodiments, the coating module is a photoresist module comprising different photoresists as well as photoresists combined with solvents of different concentrations. As will be apparent to those skilled in the art, the fluid dispensed by the central fluid dispensing reservoir may be delivered in the form of liquid, vapor, mist, or droplets.

In other embodiments, the treatment chamber is a treatment module capable of performing a coating treatment using, for example, an organic or inorganic fluid, a hybrid organic / inorganic fluid, an aqueous fluid, or the like. Merely by way of example, these fluids have an anti-reflective coating the bottom (bottom antireflection coating; BARC), the resist, the top anti-reflective coating (top antireflection coating; TARC), development, contraction coating ^{(shrink coat), PIQ TM (} Poly-Isoindolo-Quinazolinedione), And spin on materials including spin on glass, spin on dielectric, spin on hardmask, and the like. Also included within the scope of the present invention are treatments using other fluids, including those used for wet clean and the like, as well as those used for electroless and electrochemical plating processes.

In the embodiment shown in FIG. 1A, process chambers 110 and 111 generally include all of the processing components described in US Provisional Application No. 60 / 639,109 in connection with a coater module or developer module. In addition, the two processing chambers share a central fluid distribution reservoir 112. The central fluid dispensing reservoir includes a plurality of dispensing nozzles 114. Each spin chuck 130 and 131 is connected to a motor (not shown) via a shaft (not shown) and rotates about an axis orthogonal to the surface of the spin chuck. In certain embodiments, the spin chucks 130 and 131 include a sealing surface connected to a vacuum source that holds the substrate while the substrate is being rotated.

A controller (not shown) is provided and connected to the motor so that the timing and rotational speed of the spin chuck can be controlled in a predetermined manner. In certain embodiments, the rotational speed may be variable or constant as a function of time. In one embodiment, the rotary motor rotates a 300 mm semiconductor substrate between about 1 RPM and about 5000 RPM with an acceleration up to about 50,000 RPM / s. Those skilled in the art will recognize various modifications, changes and alternatives.

Dispense arm assembly 118 is driven three-dimensionally by motors 105, 106 and 107. Motor 105 is used to move the distribution arm assembly in a first direction, also referred to as a longitudinal direction, along a guide rail 119. The motor is selected to provide operation of the dispense arm assembly at a predetermined speed, accuracy and repeatability. In one embodiment, the running of the distribution arm assembly along the guide rail is sufficient for the distribution arm assembly to reach the center of both wafers. In certain embodiments, stop, positional feedback and interlock are provided, as is well known to those skilled in the art.

The motor 106 is used to move the distribution arm assembly 118 in a second (up and down) direction, also referred to as a traverse direction. The motor is selected to provide operation of the extension arm with a predetermined speed, accuracy, and repeatability. In one embodiment, the running of the extension arm in the transverse direction is sufficient to allow the gripper assembly to reach the dispensing nozzle and also to move the top edge of the cup, while moving to the center of the spin chuck. It is sufficient to lift the dispensing nozzle over the arm entry door and other obstacles. In certain embodiments, stop, positional feedback and interlock are provided, as is well known to those of ordinary skill in the art.

Motor 107 is used to move the gripper assembly 108 in a third direction, also referred to as a lateral direction. As shown in FIG. 1A, the gripper assembly 108 can move along the extension arm 220 and is shown in a first position above the nozzle retainer assembly 117 and in an optional second position above the nozzle retainer assembly 116. The motor is selected to provide operation of the gripper assembly at a predetermined speed, accuracy and repeatability. In one embodiment, the run in the lateral direction of the gripper assembly is sufficient for the gripper assembly to reach both nozzle reservoirs. In embodiments in which one nozzle reservoir disposed in the transverse direction is used, the running of the gripper assembly is sufficient for the gripper assembly to reach all the nozzles in the reservoir. In certain embodiments, stop, positional feedback and interlock are provided, as is well known to those of ordinary skill in the art.

1B is a simplified perspective view of a fluid dispensing apparatus according to another embodiment of the present invention. As shown in FIG. 2, distribution arm entry shutters 122 and 123 are provided within the frame. The dispense arm entry shutter 122 is located between the first process chamber 110 and the central fluid distribution reservoir 112. The dispense arm entry shutter 123 is located between the central fluid distribution reservoir and the second process chamber 111. In embodiments of the invention, the dispensing arm inlet shutter can move between the open and shut off positions and can also be located between. As shown in FIG. 1B, the dispensing arm inlet shutter 122 is substantially in between the open and closed positions. The dispensing arm entry shutter 123 is shown in the closed position. When the dispensing arm inlet shutters are in the open position, the dispensing arm assembly runs freely between the processing chambers and the central fluid dispensing reservoir.

2 is a simplified plan schematic diagram of a fluid dispensing apparatus according to an embodiment of the present invention. 2, cups 140 and 141 are made of a material having suitable strength and solvent-resistance. For example, in certain embodiments of the present invention, cups 140 and 141 may be made of a plastic material (eg, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), polypropylene). ), Or polyvinylidene fluoride (PVDF), a ceramic material, a metal coated with a plastic material (e.g., aluminum or SST coated with PVDF, Halar, etc.), or the center It is made of another material suitable for processing fluids delivered from the fluid distribution reservoir 112.

Lift assemblies (not shown) generally include actuators (not shown), such as air cylinders or servomotors, and guides (not shown), such as linear ball bearing slides, which include the rotatable spin chuck 130. And 131 is raised and lowered to the required position. Thus, the lift assembly lifts the substrate over the top of the cup to position the substrate mounted on the rotatable spin chuck during processing and to exchange the substrate with an external robot located outside of the apparatus 100 during processing. Up. A robot blade (not shown) attached to the external robot enters the device 100 through the robot entry shutters 120 and 121.

As shown in FIG. 2, a pre-wet nozzle 115 is disposed at the distal end of the dispensing arm assembly 118. In certain embodiments, the pre-wet nozzle is laid through components connected with the extension arm. In these embodiments, one prewet nozzle is present in the extension arm, thus simplifying the design of each of the individual dispensing nozzles. In particular, in certain embodiments, a pre-wetting nozzle is not included as part of each dispensing nozzle. As described in more detail below, the extension arm is a telescoping arm, so that the pre-wetting nozzle 115 can be controlled to be positioned at the required distance from the guide mechanism 119. Further, a backside rinse (BSR) nozzle 138 is included as part of a bowl placed under the substrate located at spin chucks 130 and 131. The BSR nozzle provides a solvent applied to the backside of the substrate during the cleaning step. In one embodiment, an edge bead removal (EBR) arm 150 is provided at the edge of each treatment chamber. As shown in FIG. 2, the EBR arm has a pivot 152 disposed at the proximal end of the EBR arm for positioning the end of the EBR arm over an edge of a substrate mounted on the spin chuck. Rotate around. To remove the edge beads present in the substrate, the EBR fluid is dispensed through a nozzle at the end of the EBR arm.

The airflow splitting system delivers a uniform flow of gas through the apparatus 100 and process chambers 110 and 111. In a particular embodiment, the airflow splitting system provides temperature and / or humidity controlled air through supply port 160. Cup vent 162 removes air from the process chamber. Cup drain 164 removes fluid from the cup. As shown in FIG. 2, four ports are shown in relation to the temperature and / or humidity controlled air, the cup vent and the cup drain. In certain embodiments, this diagram is provided because four distribution systems are stacked in a vertical direction to reduce the system footprint. Thus, for example, each of the illustrated cup vents is connected to a cup of any of the four dispensing systems.

The various air and fluid handling components shown in FIG. 2 are shown as four distinct ports, but this is not essential to the invention. In other embodiments, the air and fluid handling components are provided in different numbers depending on the overall system structure. In addition, within each group the ports are shown uniformly in terms of dimensions, but this is not essential to the invention. Furthermore, a combination of individual ports into a larger common port is provided in other embodiments. Those skilled in the art will recognize various modifications, changes and alternatives.

Furthermore, as will be apparent to one of ordinary skill in the art, the supply of controlled temperature and humidity gases, such as air, to the process chamber generally leads to the monitoring and control of various air flow parameters. . By way of example only, in one embodiment of the present invention, the environment of the process chamber is monitored to obtain the required air temperature and humidity, and the partial pressure and vapor concentration of the solvent, air flow rate, air flow rate and other Parameters including the differential pressure in the gases are controlled. Further, in certain embodiments, in addition to the process chamber environment, electrostatic discharge from the film present on the substrate is controlled. Thus, coating characteristics can be controlled by controlling substrate parameters, such as chuck rotation rate, among the process environment and other factors.

Each of the two process chambers also includes a robot entry shutter 120/121 to alternately seal the entry port and provide an entrance through which the robot arm passes through the entry port. The robot entry shutter is opened when the substrate is ready to be processed and the processing chamber is able to process the substrate. A robotic arm (not shown) supporting the substrate moves through the entry port to move the substrate from a position outside the processing chamber to a position above one of the spin chucks. Using a method well known to those skilled in the art, the robot arm places the substrate on the spin chuck and exits the processing chamber, and the robot entry shutter is blocked.

By using the robot entry shutters 120 and 121, the robots may independently load substrates alternately into the processing chambers 110 and 111. In certain embodiments, while the coating / developing process is performed in the process chamber 110, the robot entry shutter 121 is opened to load the substrate into the process chamber 111. On the other hand, while the coating / development process is performed in the processing chamber 111, the robot entry shutter 120 can enter the processing chamber 110 independently. Since stacking and processing of the substrate are performed simultaneously in two processing chambers, system throughput can be improved by embodiments of the present invention.

As shown in FIG. 2, each of the two process chambers further includes a dispensing arm entry shutter 122 and 123 located between the central fluid dispensing storage 112 and each of the spin chucks 130 and 131. The dispensing arm inlet shutter is not shown in the embodiment shown in FIG. 1, but in certain embodiments the dispensing arm inlet shutter provides a shield to isolate the process chamber from the central fluid dispensing shutter during operation of the system. . In general, the dispense arm entry shutter is opened to allow the dispense arm assembly 118 to move into the process chamber and is blocked after the dispense step is complete and the dispense arm assembly returns to the central fluid dispense reservoir region. . Generally, the coating process includes accelerating the substrate to the required rotation rate, dispensing the coating fluid, eg, resist for several seconds, and continuing to rotate the substrate for tens of seconds. By way of example only, in one embodiment of the invention, the substrate is rotated until the turnover reaches 500 RPM, the resist is dispensed for about 3 seconds, and the substrate is held for about 60 seconds at a turnover rate of 1800 RPM. . In this embodiment, after the resist fluid has been dispensed, the dispense arm returns to the central fluid dispense reservoir and the dispense arm entry shutter is blocked while the substrate continues to rotate for about 55 seconds.

In certain embodiments of the present invention, the dispensing arm inlet shutters 122 and 123 are responsible for isolation from the liquid in the central fluid distribution reservoir as well as for further particle control inside each processing chamber. For example, in one embodiment, the dispensing arm inlet shutter seals the process chamber, restricting airborne particles from flowing from the central fluid distribution reservoir into the process chambers. Thus, the distribution arm entry shutter minimizes cross-talk between process chambers and prevents contaminants from moving across process chamber boundaries. In addition, the distribution arm entry shutter substantially limits the flow between the processing chambers, reducing the air flow between each of the processing chambers and the central fluid distribution reservoir. In general, among other reasons, the distribution arm entry shutter is made of a chemical resistant material, such as aluminum, in order to provide a suitable service life.

1B is shown to slide up and down between the open and shut off positions, but this is not essential to the present invention. In other embodiments, the dispensing arm entry shutter moves between various positions in the direction of linear, rotary, angled orbital, and the like. In certain embodiments, the dispense arm entry shutter is driven by air pressure or solenoid, or by a motor, depending on the particular application. In general, the operation of the distribution arm entry shutter is controlled in relation to one or more interlocks. In certain embodiments, the interlock operates using mechanical, electrical, or software switches or controls. One of ordinary skill in the art will recognize various modifications, changes and alternatives.

Furthermore, according to embodiments of the present invention, temperature and / or humidity in the vicinity of each substrate can be controlled independently. For a given coating treatment, the parameters related to the finished coating are a function of the temperature of the coating treatment, the humidity near the substrate, or both. Embodiments of the invention allow for independent control of temperature and / or humidity in process chambers 110 and 111. Thus, for coating treatments that require different temperature and / or humidity settings for a particular treatment, embodiments of the present invention provide the necessary control. By way of example only, in process chamber 110, the coating process may require control over the ambient temperature and humidity surrounding the substrate to be coated, while at the same time, the developing process may only require control of the temperature. In still other embodiments, either or both of temperature, humidity can be controlled independently in the two processing chambers.

In certain embodiments, the temperature and / or humidity inside the processing chamber can be controlled using the robot arm entry door before, during, and after a dispensing operation. For processing operating at a predetermined temperature and / or humidity, the entrance door is opened to receive the dispense arm, partially blocked during the fluid dispense step, and the dispense arm is completely reopened to exit the process chamber. It can be completely blocked while the dispensing process is completed.

The central fluid distribution reservoir 112 includes a plurality of nozzles 114 contained within one or more nozzle holder assemblies 116. As described in more detail in US Provisional Application 60 / 639,109, a fluid distribution system used in a coater or developer module delivers one or more fluids to deliver one or more processing fluids to a surface of a substrate mounted on a spin chuck 130. Source assembly (not shown). In certain embodiments of the invention, the home position of the dispensing arm is a central fluid dispensing reservoir region. Thus, during the substrate loading or unloading operation through the robot entry shutters 120 and 121, the distribution arm is placed in the home position in the central fluid distribution reservoir region.

As shown in FIG. 1, in one embodiment of the invention two dispensing nozzle reservoirs are provided. Each nozzle 114 included in the nozzle retainer assembly 116 is typically a pipe fitting component (the pipe fitting component includes a supply pipe, a pump, a filter, an absorption back valve, a fluid source, and the like). And dispense a single type of processing fluid. In certain embodiments, the treatment fluid is a photoresist, solvent, coating, developer, and the like. Those skilled in the art will recognize various modifications, changes and alternatives. Since the dispensing arm can be located anywhere in the left and right process chambers, each central fluid dispensing reservoir can support both process chambers, thus reducing the redundant portion required for each process chamber.

As will be appreciated by those skilled in the art, the nozzle design used for the various processes generally depends on the characteristics of the particular application. By way of example only, resist nozzle reservoirs typically contain between four and ten nozzles. In a particular embodiment of the invention, the resist nozzle reservoir comprises 10 or more nozzles. In general, resist nozzles dispense a variety of chemicals, including resist, antireflective coatings, and spin-on materials (eg, SOG and SOD). On the other hand, the developing nozzle reservoir typically includes one to three nozzles. In certain embodiments, three or more developing nozzles are included in the developing nozzle reservoir. In addition, certain developing nozzle reservoirs include a plurality of cleaning lines to suit particular applications.

Either resist or development, the design of the nozzle can share similarities in design to suit a particular application. Also, in general, the time it takes for the dispensing operation to be performed will vary so that the resist operation may take several seconds, while the developing operation may take several hundred seconds. Accordingly, embodiments of the present invention provide nozzles suitable for the function of a particular dispensing assembly for a central fluid dispensing reservoir.

As shown in FIGS. 1 and 2, the central fluid dispensing reservoir comprises a plurality of dispensing nozzles. In the embodiment shown in FIGS. 1A, 1B and 2, the dispensing nozzles are arranged in two groups of nozzles, in particular, five nozzles of the first group are included in the nozzle holder assembly 116 and five of the second group. The dog nozzles are included in the nozzle holder assembly 117. As shown, the dispensing nozzle is arranged longitudinally in the nozzle retainer assembly. In other words, the longitudinal direction of the nozzle retainer assembly is aligned parallel to the line connecting the center of the spin chuck 130 and the center of the spin chuck 131. In embodiments where the spin chucks are centered within each processing chamber, the nozzle holder assembly is aligned parallel to the line connecting the center of the first processing chamber and the second processing chamber. Another coordinate that the nozzle holding assembly can refer to is the length of the guide mechanism 119. As shown in FIG. 1, the nozzle retainer assemblies 116 and 117 are aligned to be parallel to the length of the guide mechanism 119.

1-3 illustrate a configuration in which each nozzle retainer assembly 116 includes five nozzles 114, but in other embodiments, the nozzle retainer assembly 116 is further modified without departing from the basic scope of the invention. It may include fewer nozzles or more nozzles. For example, in one embodiment, two reservoirs are provided that include eight nozzles per reservoir. In addition, although the nozzle retainer assembly is shown in FIG. 1 to be aligned parallel to the length of the guide mechanism 119, this is not essential for the present invention. In other embodiments, the nozzle retainer assembly is aligned to be orthogonal to the length of the guide mechanism. Furthermore, in one particular embodiment, one reservoir is provided comprising eight nozzles. In this particular embodiment, the one nozzle reservoir is arranged with the nozzle holder assembly aligned to be orthogonal to the length of the guide mechanism. These other embodiments will be described in more detail below.

As shown in FIG. 1, all dispensing nozzles provided in the nozzle dispensing reservoir are arranged in a single plane parallel to the plane containing the spin chuck. However, this is not essential to the present invention. In other embodiments (not shown), the dispensing nozzles are stacked in a vertical direction such that the plurality of first nozzles are arranged in the first plane and the plurality of second nozzles are arranged in the second plane. In addition, in some embodiments, the nozzles are stacked in the vertical direction and deviated from each other in the lateral direction, so that the nozzles can be approached to suit a particular application.

3A is a simplified cross-sectional schematic diagram of a fluid distribution device in a first mode of operation, in accordance with an embodiment of the present invention. In certain embodiments of the invention the fluid dispensing device is a coater / developer module. As shown in FIG. 3A, the distribution arm assembly 118-also referred to as the nozzle arm assembly-is located above the right processing chamber to distribute the processing fluid to the substrate 210 held on the spin chuck 130. The distribution arm assembly 118 may include an arm 220 and a nozzle retention mechanism 222. The distribution arm assembly 118 is attached to an actuator 224 for transporting and positioning the distribution arm assembly 118 at a predetermined position along the guide mechanism 119. In one embodiment, a system controller (not shown) allows the nozzle 114 to be correctly positioned over the substrate 210 during processing and to allow the nozzle retaining mechanism to lift and lower the nozzle 114 from the nozzle retainer assembly 116. In order to move the distribution arm assembly 118 in the up and down direction. As described above, the distribution arm entry shutter 123 moves up and down to block and isolate the process chamber 111 during processing from the other processing module 110 and the central fluid distribution storage 112 to prevent cross contamination of the substrates during the processing.

3B is a simplified cross-sectional schematic diagram of a fluid distribution device in a second mode of operation, in accordance with another embodiment of the present invention. As shown in FIG. 3B, the distribution arm assembly 118 is positioned above the left processing chamber 110 to distribute the processing fluid to the substrate 310 held on the spin chuck 130. The distribution arm entry shutter 122 moves up and down to block and isolate the process chamber 110 during processing from the other process chamber 111 and the central fluid distribution storage 112 to prevent cross contamination of the substrates during the processing.

6 is a simplified cross-sectional schematic diagram of a fluid dispensing apparatus according to another embodiment of the present invention. As shown in FIG. 6, the fluid dispensing device shares some commonality with the device shown in FIG. 2. For example, the apparatus shown in FIG. 6 includes a central fluid dispensing reservoir 612 comprising a plurality of dispensing nozzles, a home region 614 and two located at both sides of the central fluid dispensing reservoir and the groove region. It includes a processing chamber. As shown in FIG. 6, the central fluid distribution reservoir comprises one nozzle retainer assembly 616, the longitudinal direction of the nozzle retainer assembly being substantially along a line connecting the center of the process chamber 610 and the center of the process chamber 611. Orthogonal.

The assembly shown in FIG. 6 accesses a dispensing nozzle 618 of the nozzle holder assembly included in the shared central fluid dispensing reservoir, selects a dispensing nozzle 618, and is detachably connected to the dispensing nozzle 618. And further three dispensing arm assemblies 620 and 622. Each dispense arm assembly is driven by a motor (not shown) to move the selected dispense nozzle to the desired position on the surface of the associated substrate. For example, dispense arm assembly 620 is associated with spin chuck 630 and dispense arm assembly 622 is associated with spin chuck 632. As shown in FIG. 6, the dispensing arm assembly 622 is disposed in the groove area and is not connected to the dispensing nozzle. On the other hand, the dispensing arm assembly 620 is connected to the dispensing nozzle which was initially at position 640 in the nozzle holding assembly. The dispensing arm assembly 620 also moved to a position where the coating fluid dispensed from the dispensing nozzle would impinge on the center of the substrate 650.

In the embodiment shown in FIG. 6, the dispensing arm inlet shutters are partitioned so that the dispensing arm assembly can individually enter the home position and the central fluid dispensing reservoir. As will be apparent to one of ordinary skill in the art, additional or permanent compartments that are movable are included in other embodiments. By way of example only, the permanent compartment 660 disposed between the central fluid distribution reservoir 612 and the groove area 614 will provide environmental isolation between the central fluid distribution reservoir and the groove area. In the embodiment shown in FIG. 6, each dispensing nozzle can be laid to provide a different fluid solution. Alternatively, the plurality of nozzles may share the same pump and dispense the same fluid, for example a specific resist. Thus, the fluid dispensing apparatus shown in FIG. 6 can perform various modifications of the coating and developing treatment.

4A is a simplified flowchart illustrating a method of operating a fluid dispensing apparatus according to an embodiment of the present invention. The method includes providing a central fluid dispensing reservoir comprising a plurality of dispensing nozzles at step 410. In a particular embodiment, the central fluid dispensing reservoir comprises sixteen nozzles providing sixteen different resists. In another embodiment, sixteen nozzles are provided, but one resist is provided by each nozzle while varying the concentration of solvent with each nozzle. In other embodiments, the central fluid distribution reservoir includes fewer or more nozzles, depending on the particular application. The method includes providing a first processing chamber located on a first side of the central fluid distribution reservoir and a second processing chamber located on a second side of the central fluid distribution reservoir, wherein the first side is opposite the second side. It further includes (step 412). The method further includes providing a dispense arm assembly disposed at a home position at step 414. In embodiments of the invention, the home position is in the central fluid distribution reservoir region and the distribution arm assembly moves between the central fluid distribution reservoir and the first and second processing chambers. It should be understood that the home position is not limited to a specific position within the central fluid dispensing reservoir region, but is a universal position near the dispensing nozzle.

In step 416, a dispense nozzle is selected from the dispense nozzles disposed in the central fluid dispense reservoir, and the selected dispense nozzle is connected to the dispense arm assembly. In embodiments of the invention, selecting the first dispensing nozzle comprises detachably connecting the nozzle to the dispensing arm using a gripper assembly integrated into the extension arm of the dispensing arm assembly. do. As described above, since the dispensing arm assembly is moved in three dimensions, the dispensing arm assembly can lift the selected nozzle from the nozzle holder assembly and move the nozzle into any of the processing chambers. Movement in the up and down direction is used in one embodiment to remove the selected nozzle from the nozzle holder assembly and to position the nozzle at a predetermined distance from the substrate surface prior to the fluid dispensing step. One of ordinary skill in the art will recognize various modifications, changes and alternatives. In step 418, the distribution arm assembly is moved by the driving of a motor connected to the distribution arm assembly. The dispensing arm assembly moves to position the dispensing nozzle at a first position in the first processing chamber.

In certain embodiments, the method includes positioning the nozzle at a first dispensing position above the central region of the substrate mounted on the spin chuck 130, but this is not essential to the present invention. Other embodiments use different locations in the process chamber 110.

The spin chuck rotates to allow the substrate rotation speed to reach a predetermined value. In one embodiment, the spin chuck accelerates the substrate at an acceleration rate of up to about 50,000 RPM / s, allowing the substrate to reach a rotation rate of about 5,000 RPM from a stationary state. On the other hand, the acceleration ranges from about 10 RPM / s to about 50,00 RPM / s, and the rotation rate ranges from about 1 RPM to about 5000 RPM. Of course, the acceleration and rotation rate depend on the particular application.

In embodiments where solvent pre-wet is used, the first location is selected to place a solvent prewet nozzle present in the dispense arm assembly. In a particular embodiment, the dispensing position is where the solvent prewet nozzle is located above the center of the substrate. After the solvent prewet nozzle is positioned, the solvent is dispensed onto the rotating substrate. Next, prior to dispensing fluid from the dispense nozzle, the dispense arm assembly is driven to move the dispense arm assembly to position the dispense nozzle above the center of the substrate.

In step 420, a coating fluid is generally dispensed from the selected dispensing nozzle to a central portion of the substrate mounted on the spin chuck 130. The spin chuck rotates to spread the coating fluid on the surface of the substrate during the dispensing operation. The rotational speed can be variable or constant as a function of time. Those skilled in the art will recognize various modifications, changes and alternatives. In step 422 the dispense arm is returned to the home position and the selected dispense nozzle is returned to the central fluid dispense reservoir.

4B is a simplified flowchart illustrating a method of operating a fluid dispensing device, in accordance with another embodiment of the present invention. Steps 450-460 in FIG. 4B are similar to steps 410-420 in FIG. 4A. In another embodiment shown in FIG. 4B, the dispense arm assembly is returned to the central fluid dispensing reservoir and the selected dispensing nozzle is not returned to the central fluid dispensing reservoir; It is moved to a second position on the central region of the second substrate mounted on the chuck 131. In embodiments where solvent pre-wetting is used, the second location is selected to dispense solvent in the center of the second substrate and to dispense coating fluid from the dispense nozzle prior to adjusting the dispense nozzle position. do.

In a manner similar to the first dispensing operation, the spin chuck 131 rotates to bring the substrate rotational speed to a predetermined value. Depending on the application, the distribution parameters may be the same or different than those used during the first dispensing step. In step 464, optional solvent prewetting and the coating fluid are dispensed from the selected dispensing nozzle to a central portion of the substrate generally mounted on the spin chuck 131. The spin chuck rotates to spread the coating fluid on the surface of the substrate during the dispensing operation. Its rotation speed can be variable or constant as a function of time. Those skilled in the art will recognize various modifications, changes and alternatives. After the second dispensing step, in step 466, the dispensing arm assembly is returned to the home position on the central fluid dispensing reservoir and the selected dispensing nozzle is returned to the central fluid dispensing reservoir.

The above examples use one selected dispensing nozzle for the first and second dispensing steps, but this is not essential to the present invention. In other embodiments, steps are added between steps 460 to 462 such that a first dispensing nozzle is selected for the first dispensing step and a second dispensing nozzle is selected for the second dispensing step. Furthermore, in still other embodiments, the method of dispensing fluid to the substrate does not stop after the second dispensing step and continues for two or more dispensing steps. The dispensing step may be alternated between process chambers, or may use a plurality of consecutive dispensing steps in one process chamber using the same or different coating fluids. Possible variations using a plurality of dispensing nozzles, a plurality of processing chambers and a home position for the dispensing arm assembly in the central fluid dispensing reservoir region will be apparent to those of ordinary skill in the art.

Substrates can be loaded into the two processing chambers using a suitable robot. For example, in one embodiment, the central robot transports the substrate into and out of both processing chambers in an alternating manner of one embodiment of the present invention. In certain embodiments, the dispensing arm assembly is located in a home position within the central fluid dispensing reservoir region while the substrates are loaded into the processing chambers by the central robot. During the robot loading and unloading process, the distribution arm entry door is generally kept closed to limit the movement of air and particles in the air between the processing chambers and the central fluid distribution reservoir region.

The series of steps provide a method of dispensing a fluid on a semiconductor substrate in accordance with one embodiment of the present invention. As described, the method utilizes a combination of steps, including the use of a central fluid distribution reservoir shared by two processing chambers in accordance with one embodiment of the present invention. Further alternatives may be provided, in which steps are added, one or more steps are deleted, or one or more steps are provided in a different order, without departing from the scope of the claims of this specification. Further details of the method will be described throughout this specification.

5 is a simplified flow diagram illustrating a method of operating a fluid dispensing apparatus, in accordance with another embodiment of the present invention. The method includes providing a central fluid dispensing reservoir at step 510. The central fluid dispensing reservoir includes a plurality of dispensing nozzles. In a particular embodiment, the central fluid dispensing reservoir comprises sixteen nozzles providing sixteen different resists. In another embodiment, sixteen nozzles are provided, but one resist is provided by each nozzle while varying the concentration of solvent with each nozzle. In other embodiments, the central fluid distribution reservoir includes fewer or more nozzles, depending on the particular application. The method further comprises providing a first processing chamber (step 512) located on the first side of the central fluid distribution reservoir and a second processing chamber (step 514) located on the second side of the central fluid distribution reservoir. . In a particular embodiment, the first processing chamber and the second processing chamber are located on opposite sides of the central fluid distribution reservoir.

The method includes providing a dispensing arm assembly in a home position (step 516) that moves between the central fluid dispensing reservoir and the first and second processing chambers, and selecting a dispensing nozzle from a plurality of dispensing nozzles. It further includes. In embodiments of the invention, the step of selecting the dispense nozzle comprises the step of detachably connecting the nozzle to the dispense arm assembly using a gripper assembly integrated into the extension arm of the dispense arm assembly. 518). Furthermore, in certain embodiments, after the nozzle is connected to the gripper assembly, the gripper assembly is moved in the up and down direction and in the lateral direction. Movement in the up-down direction is, in one embodiment, to reduce particle counts by separating the tubing connected to the selected dispensing nozzle from tubing connected to other dispensing nozzles in the nozzle retainer assembly. Is used. Those skilled in the art will recognize various modifications, changes and alternatives.

In one particular embodiment, the first and second processing chambers are controlled to provide separate temperature and humidity environments for each processing chamber. Thus, in one embodiment, a dispensing arm entry shutter is provided between the central fluid dispensing reservoir and both processing chambers, thereby enabling environmental control for the processing chambers. In step 520, a first dispensing arm inlet shutter disposed between the central fluid dispensing reservoir and the first processing chamber is opened. By opening the first dispensing arm entry shutter, a path is provided for moving the selected nozzle from the central fluid dispensing reservoir to the first position in the first processing chamber (step 522). In general, the first dispensing position is a position where the dispensing nozzle is disposed above the central region of the substrate mounted on the spin chuck 130, but this is not essential to the present invention. Other embodiments use other locations within the process chamber 110, for example, where the solvent prewet nozzle is disposed above the center of the substrate.

The spin chuck rotates to allow the substrate rotation speed to reach a predetermined value. In one embodiment, the spin chuck accelerates the substrate at an acceleration of up to about 50,000 RPM / s, allowing the substrate to reach about 5,000 RPM rotation rate from a stationary state. On the other hand, the acceleration ranges from about 10 RPM / s to about 50,00 RPM / s, and the rotation rate ranges from about 1 RPM to about 5000 RPM. Of course, the acceleration and rotation rate depend on the particular application.

In step 524, coating fluid is dispensed from the dispensing nozzle to a central portion of the substrate generally mounted on the spin chuck 130. The spin chuck rotates to spread the coating fluid on the surface of the substrate during the dispensing operation. The rotational speed can be variable or constant as a function of time. Those skilled in the art will recognize various modifications, changes and alternatives. In step 526 the dispense arm assembly is moved to the home position. In certain embodiments, the time the substrate is rotated after fluid dispensing is less than the travel time the dispensing arm assembly moves from the dispensing position to the central fluid dispensing reservoir region. Thus, in this particular embodiment, the dispensing arm assembly exits the first processing chamber after the dispensing step and the first dispensing arm entry shutter is shut off before the rotating step is completed.

In step 530, a second dispensing arm inlet shutter disposed between the central fluid dispensing reservoir and the second processing chamber is opened. By opening the second dispensing arm entry shutter, a path is provided for moving the selected nozzle from the central fluid dispensing reservoir to a second position in the second processing chamber (step 532). Generally, the second dispensing position is a position where the dispensing nozzle is disposed over the central region of the substrate mounted on the spin chuck 131, but this is not essential to the present invention. Other embodiments use other locations within the process chamber 111, for example, where the solvent prewet nozzle is disposed above the center of the substrate. As described in connection with the process chamber 110, the spin chuck 131 rotates so that the substrate rotational speed reaches a predetermined value.

In step 534, coating fluid is dispensed from the dispensing nozzle to a central portion of the substrate generally mounted on the spin chuck 131. The spin chuck rotates to spread the coating fluid on the surface of the substrate during the dispensing operation. The rotational speed can be variable or constant as a function of time. Those skilled in the art will recognize various modifications, changes and alternatives. In step 536 the dispense arm assembly is moved to the home position. In certain embodiments, the time the substrate is rotated after fluid dispensing is less than the travel time the dispensing arm assembly moves from the dispensing position to the central fluid dispensing reservoir region. Thus, in this particular embodiment, the dispensing arm assembly exits the second processing chamber after the dispensing step and the second dispensing arm entry shutter is blocked before the rotating step is completed (step 538). In certain embodiments, at step 540, the selected dispense nozzle is separated from the dispense arm assembly.

The series of steps provide a method of distributing fluid on a plurality of semiconductor substrates in accordance with one embodiment of the present invention. As described, the method utilizes a combination of steps, including the use of a central fluid distribution reservoir shared by two process chambers in which the environment is controlled in accordance with one embodiment of the present invention. Further alternatives may be provided, in which steps are added, one or more steps are deleted, or one or more steps are provided in a different order, without departing from the scope of the claims of this specification. Further details of the method will be described throughout this specification.

In another embodiment, the dispense arm entry shutter is open, partially blocked and reopened during each coating treatment. In this particular embodiment, the dispensing arm entry shutter is partially blocked after the dispensing arm enters the processing chamber and the dispensing arm moves to the side of the processing chamber adjacent to the central fluid dispensing reservoir after the fluid has been dispensed. In this embodiment, while the dispensing arm waits for the coating treatment to be completed on the side of the treatment chamber, the dispensing arm inlet shutter remains partially blocked during the coating treatment. After the coating process is complete, the dispensing arm inlet shutter is opened and the dispensing arm returns to the central fluid dispensing reservoir region, in which the first dispensing nozzle is returned to the central fluid dispensing reservoir. The distribution arm entry shutter is again blocked. In this particular embodiment, the dispense arm entry shutter is opened to minimize the time the process chamber is exposed to the environment of the central fluid distribution reservoir region, thereby reducing cross contamination from the central fluid distribution reservoir or other process chamber.

The above examples use one selected dispensing nozzle for the first and second dispensing steps, but this is not essential to the present invention. In other embodiments, steps are added between steps 528-530 such that a first dispensing nozzle is selected for the first dispensing step and a second dispensing nozzle is selected for the second dispensing step. Furthermore, in still other embodiments, the method of dispensing fluid on the substrate is not stopped after the second dispensing step and continues for two or more dispensing. The dispensing step may be alternated between process chambers, or may use a plurality of consecutive dispensing steps in one process chamber using the same or different coating fluids. Possible variations using a plurality of dispensing nozzles, a plurality of processing chambers and a home position for the dispensing arm assembly in the central fluid dispensing reservoir region will be apparent to those of ordinary skill in the art.

8 is a simplified timing diagram illustrating the operation of a fluid distribution device, in accordance with an embodiment of the present invention. The diagrams are merely examples of process flows and should not limit the scope of the claims herein. Furthermore, the diagram shown in FIG. 8 is not drawn to scale, but merely represents a series of events over time. FIG. 8A shows the operation of the distribution arm assembly along the guide rail 119 shown in FIG. 2. 2 and 8B, the operation to the left of the distribution arm assembly (to support the processing chamber 110) and the operation to the right (to support the processing chamber 111) are directed to the left and right directions of the distribution arm assembly. The velocity in is shown by plotting on the coordinates as a function of time, which is the positive velocity and the negative velocity, respectively.

In the embodiment shown in FIG. 8A, at time t ₀ , the dispensing arm assembly is moved from the home position to the left for a predetermined time, and stopped. It is apparent to those of ordinary skill in the art that, depending on the distance from the home position in the processing chamber 110 to the distribution point, the predetermined time and speed of operation are correlated. Operation in the vertical direction of the dispensing arm assembly and the dispensing nozzle (see FIG. 2) and in the direction orthogonal to the guide rail in the plane of the figure, although not shown in FIG. 8A for clarity, Those skilled in the art will recognize that such operations are also included as described above.

As shown in FIG. 8B, the rotation rate of the spin chuck in _process chamber 110 (PC ₁ ) is shown as a function of time. In one embodiment, the rotation of the chuck in process chamber 110 begins only after the dispensing arm assembly is positioned and stopped in the required position. In other embodiments, the rotation process is started while the dispense arm assembly is still in motion. Further, as noted above, the dispensing arm assembly, in certain embodiments, moves from a first position, where the solvent for pre-wetting treatment is dispensed, to a second position, where the resist or other fluid is dispensed. . In the embodiment shown in FIG. 8B, the rotational process for the spin chuck in the process chamber 110 begins at time t ₁ before the dispensing arm assembly is stopped. The spin chuck is accelerated and maintained at a constant rotational speed R ₁ for a first predetermined time during the dispensing process and accelerated to a second, larger rotational speed R ₂ for a second predetermined time. Of course, the rotational speed and time interval depend on the particular application.

8C shows the amount of fluid dispensed from the dispense nozzle as a function of time. 8A and 8C, it can be seen that the dispensing arm assembly is located in the process chamber 110 (PC ₁ ) during this dispensing step. As shown in FIG. 8C, the fluid dispensing step is performed while the spin chuck of the process chamber 110 is rotating at a _first rotation rate R ₁ . For clarity, additional dispensing steps, such as solvent prewetting, were omitted from this figure. Furthermore, although the amount of fluid dispensed is constantly shown as a function of time during the fluid dispensing step, one of ordinary skill in the art will recognize that this is not essential to the present invention. In other embodiments, the amount distributed as a function of time may increase and / or decrease depending on other functional relationships, eg, the amount distributed as a function of time suitable for a particular process.

8D and 8E show the rotation rate of the spin chuck in process chamber 111 (PC ₂ ) and the amount of fluid dispensed from the dispensing nozzle as a function of time. 2 and 8A, at time t ₃ , the dispensing arm assembly moves from the left processing chamber 110 to the right, moving the dispensing nozzle to the required position in the processing chamber 111. As shown in the figure, the time taken to move the distribution arm assembly from the processing chamber 110 to the processing chamber 111 is longer than the time originally required to move the distribution arm assembly from the home position to the processing chamber 111. In certain embodiments, this increase in time is due to the operation of the dispensing arm assembly traveling at the same speed but at a greater distance throughout. Of course, in other embodiments, speed, distance and time are related to each other, as will be apparent to one of ordinary skill in the art. Furthermore, the movement of the dispensing arm assembly at time t _{3 shown} in FIG. 8A is shown to be at a constant speed. In other embodiments, the dispensing arm assembly is stopped in the home position, the dispensing nozzle is replaced as described above, and the operation continues in the left direction. Those skilled in the art will recognize various modifications, changes and alternatives.

At time t ₄ the spin chuck of process chamber 111 is rotated to reach a first rotational speed R ₃ , which further increases to speed R ₄ after the fluid is dispensed at time t ₅ . As shown in the figures, the rotation processes in the two process chambers overlap in time. Thus, in certain embodiments of the present invention, the use of a shared distribution structure may, among other advantages, improve system throughput. The distribution arm assembly is moved to the home position at time t ₆ .

The examples and embodiments described herein are for technical purposes only. Those skilled in the art will recognize various modifications or changes therefrom and they should be included within the spirit and scope of the application and the scope of the appended claims. Except as indicated by the appended claims, the scope of the present invention is in no way limited.

Claims (45)

An apparatus for distributing a fluid during a processing operation of a semiconductor substrate, A central fluid dispensing reservoir comprising a plurality of dispensing nozzles connected to the plurality of fluid sources; A first processing chamber located on a first side of said central fluid distribution reservoir; A second processing chamber located on a second side of said central fluid distribution reservoir; And A dispensing arm moving between said central fluid dispensing reservoir, said first processing chamber and said second processing chamber. The method of claim 1, And the first processing chamber includes a first spin chuck for holding and rotating a first substrate, and the second processing chamber includes a second spin chuck for holding and rotating a second substrate. The method of claim 2, And a support surface of the first spin chuck and a support surface of the second spin chuck are substantially coplanar. The method of claim 1, And the first processing chamber and the second processing chamber are located at both sides of the central fluid distribution reservoir. The method of claim 1, And a plurality of dispensing nozzles arranged in a two-dimensional pattern. The method of claim 5, And the two-dimensional pattern comprises a first row of dispensing nozzles included in a first nozzle retainer assembly and a second row of dispensing nozzles included in a second nozzle retainer assembly. The method of claim 6, And the first nozzle retainer assembly and the second nozzle retainer assembly are aligned substantially parallel to a line connecting the center of the first process chamber and the center of the second process chamber. The method of claim 6, And the first nozzle retainer assembly and the second nozzle retainer assembly are aligned to be substantially orthogonal to a line connecting the center of the first process chamber and the center of the second process chamber. The method of claim 1, The dispensing arm having at least one nozzle selected from the plurality of dispensing nozzles. The method of claim 1, And said central fluid distribution reservoir reduces a redundant portion of the system by sharing a common tubing component. The method of claim 10, And said common tubular component comprises at least one fluid pump. The method of claim 1, And the fluid is delivered in the form of vapor, mist or droplets. A method of dispensing fluid to a semiconductor substrate using a device comprising a central fluid dispensing reservoir comprising a plurality of dispensing nozzles, first and second processing chambers, and dispensing arms, the method comprising: Selecting a first dispense nozzle from the plurality of dispense nozzles; Moving the distribution arm to a first position in the first processing chamber; Dispensing a first fluid from the first dispensing nozzle; And Returning the dispensing arm to a second position above the central fluid dispensing reservoir. The method of claim 13, The selecting step includes positioning the dispensing arm over the first dispensing nozzle, grasping the nozzle, and removing the first dispensing nozzle from the central fluid dispensing reservoir. The method of claim 13, Returning the first dispensing nozzle to the central fluid dispensing reservoir. The method of claim 13, Moving the first dispensing nozzle to a third position of the second processing chamber; Dispensing the first fluid from the first dispensing nozzle; And Returning the dispensing arm to a second position above the central fluid dispensing reservoir. The method of claim 16, Returning the first dispensing nozzle to the central fluid dispensing reservoir. An apparatus for dispensing fluid during semiconductor processing operations, the apparatus comprising: A central fluid dispensing reservoir comprising a plurality of dispensing nozzles connected to the plurality of fluid sources; A first processing chamber located on a first side of said central fluid distribution reservoir; A first dispensing arm moving between the central fluid dispensing reservoir and the first processing chamber; A second processing chamber located on a second side of said central fluid distribution reservoir; And And a second dispensing arm moving between the central fluid dispensing reservoir and the second processing chamber. The method of claim 18, And the first processing chamber includes a first spin chuck for holding and rotating a first substrate, and the second processing chamber includes a second spin chuck for holding and rotating a second substrate. The method of claim 18, And the first processing chamber and the second processing chamber are located at both sides of the central fluid distribution reservoir. The method of claim 18, The dispensing arm having at least one nozzle selected from the plurality of dispensing nozzles. The method of claim 18, And the plurality of dispensing nozzles are arranged in a two-dimensional pattern. The method of claim 18, The central fluid distribution reservoir is coupled to a fluid source assembly including at least one pump, the fluid source assembly providing fluid to both the first and second process chambers. In the track lithography tool, A front end module receiving a FOUP containing a plurality of substrates; A central module including a plurality of processing tools; A rear module connected to the scanner; And At least one robot receiving a substrate from the front end module and delivering the substrate to either or both of the processing tool and the rear module, One of the plurality of processing tools is an apparatus for distributing fluid during a processing operation of a semiconductor substrate, the apparatus comprising: A central fluid dispensing reservoir comprising a plurality of dispensing nozzles connected to the plurality of fluid sources; A first processing chamber located on a first side of said central fluid distribution reservoir; A second processing chamber located on a second side of said central fluid distribution reservoir; And A track lithography tool comprising a dispensing arm moving between said central fluid dispensing reservoir, said first processing chamber and said second processing chamber. An apparatus for distributing a fluid during a processing operation of a semiconductor substrate, First processing chamber; Second processing chamber; Distribution arm assembly; And A dispensing arm entry shutter positioned between the first and second processing chambers and movable between the open and shut off positions, And the dispensing arm assembly is capable of traveling from the first processing chamber to the second processing chamber when the dispensing arm entry shutter is in the open position. The method of claim 25, And a central fluid dispensing reservoir located between the first process chamber and the second process chamber. The method of claim 26, And the central fluid dispensing reservoir comprises a plurality of dispensing nozzles connected to a plurality of fluid sources. The method of claim 27, Further comprising a second distribution arm entrance shutter located between the first and second processing chamber, The dispensing arm entry shutter is located between the first processing chamber and the central fluid dispensing reservoir, and the second dispensing arm entry shutter is located between the central fluid dispensing reservoir and the second processing chamber. The method of claim 27, And the plurality of fluid sources comprises a fluid selected from the group comprising organic, inorganic, hybrid and aqueous. The method of claim 26, And the dispense arm assembly retains at least one nozzle selected from the plurality of dispense nozzles. The method of claim 30, The dispensing arm assembly includes a plurality of zones, each zone being driven by a motor, and the at least one nozzle is movable in three dimensions. The method of claim 25, The treatment carried out in either or both of the first and second treatment chambers may comprise photoresist, developer, BARC, TARC, shrink coating, spin-on material and poly-isoindolo-quinazolindione ( A fluid distribution device which is a treatment selected from the group comprising poly-isoindolo-quinazolinedione). The method of claim 25, And the first processing chamber includes a first spin chuck for holding and rotating a first substrate, and the second processing chamber includes a second spin chuck for holding and rotating a second substrate. A method of distributing fluid to a semiconductor substrate using a device comprising a dispensing nozzle, a first processing chamber, a second processing chamber, and a distribution arm entry shutter located between the first and second processing chambers, the method comprising: Opening the dispense arm entry shutter; Moving the dispensing nozzle to a first position in the first processing chamber; Dispensing fluid from the dispensing nozzle; Moving the dispensing nozzle to a second position between the first and second processing chambers; And Blocking the dispense arm entry shutter. The method of claim 34, wherein The selecting step includes positioning the dispensing arm over the first dispensing nozzle, grasping the nozzle, and removing the first dispensing nozzle from the central fluid dispensing reservoir. The method of claim 34, wherein Providing a second distribution arm entry shutter disposed between the first processing chamber and the second processing chamber; Opening the second distribution arm entry shutter; Moving the dispensing nozzle to a third position of the second processing chamber; Dispensing the fluid from the dispensing nozzle; Moving the dispensing nozzle to a fourth position between the first and second processing chambers; And Blocking the second dispensing arm inlet shutter. An environmental control device for distributing a fluid during a processing operation of a semiconductor substrate, First processing chamber; Second processing chamber; A distribution arm assembly having a home position; A first distribution arm entry shutter positioned between the home position and the first processing chamber; And A second distribution arm entry shutter positioned between the home position and the first processing chamber, And a first temperature of the first processing chamber and a second temperature of the second processing chamber are independently controlled. The method of claim 37, A first set of supply ports to provide temperature controlled air to the first processing chamber, and a second set of supply ports to independently provide temperature controlled air to the second processing chamber. The method of claim 37, And a first humidity of the first processing chamber and a second humidity of the second processing chamber are independently controlled. The method of claim 37, Wherein the first processing chamber comprises a first exhaust system, the second processing chamber comprises a second exhaust system, and the first and second exhaust systems are independently controlled. The method of claim 37, And a central fluid dispensing reservoir located between the first dispensing arm entry shutter and the second dispensing arm entry shutter. The method of claim 41, wherein And wherein said central fluid dispensing reservoir comprises a plurality of dispensing nozzles connected to a plurality of fluid sources. The method of claim 37, And the first processing chamber and the second processing chamber are located at both sides of the central fluid distribution storage unit. The method of claim 37, And the first processing chamber includes a first spin chuck for holding and rotating a first substrate, and the second processing chamber includes a second spin chuck for holding and rotating a second substrate. In the track lithography tool, A front end module receiving a FOUP containing a plurality of substrates; A central module including a plurality of processing tools; A rear module connected to the scanner; And At least one robot receiving a substrate from the front end module and delivering the substrate to either or both of the processing tool and the rear module, One of the plurality of processing tools is an apparatus for distributing fluid during a processing operation of a semiconductor substrate, the apparatus comprising: First processing chamber; Second processing chamber; Distribution arm assembly; And A dispensing arm inlet shutter positioned between the first and second processing chambers and movable between the open and shut off positions, And the dispense arm assembly is capable of traveling from the first process chamber to the second process chamber when the dispense arm assembly is in the open position.

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