WO2006069348A3 - Coat/develop module with shared dispense - Google Patents

Coat/develop module with shared dispense Download PDF

Info

Publication number
WO2006069348A3
WO2006069348A3 PCT/US2005/046906 US2005046906W WO2006069348A3 WO 2006069348 A3 WO2006069348 A3 WO 2006069348A3 US 2005046906 W US2005046906 W US 2005046906W WO 2006069348 A3 WO2006069348 A3 WO 2006069348A3
Authority
WO
WIPO (PCT)
Prior art keywords
dispense
processing chamber
coat
bank
central fluid
Prior art date
Application number
PCT/US2005/046906
Other languages
French (fr)
Other versions
WO2006069348A2 (en
Inventor
Tetsuya Ishikawa
Rick J Roberts
Original Assignee
Applied Materials Inc
Tetsuya Ishikawa
Rick J Roberts
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/111,353 external-priority patent/US7396412B2/en
Application filed by Applied Materials Inc, Tetsuya Ishikawa, Rick J Roberts filed Critical Applied Materials Inc
Priority to JP2007548557A priority Critical patent/JP4842280B2/en
Publication of WO2006069348A2 publication Critical patent/WO2006069348A2/en
Publication of WO2006069348A3 publication Critical patent/WO2006069348A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

Abstract

An apparatus for dispensing fluid during semiconductor substrate process operations, wherein the apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles (114) coupled to a plurality of fluid sources and a first processing chamber (110) positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber (111) positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber and the second processing chamber.
PCT/US2005/046906 2004-12-22 2005-12-21 Coat/develop module with shared dispense WO2006069348A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007548557A JP4842280B2 (en) 2004-12-22 2005-12-21 Coat / development module with shared distribution

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US63910904P 2004-12-22 2004-12-22
US60/639,109 2004-12-22
US11/111,154 2005-04-20
US11/111,353 US7396412B2 (en) 2004-12-22 2005-04-20 Coat/develop module with shared dispense
US11/111,154 US7255747B2 (en) 2004-12-22 2005-04-20 Coat/develop module with independent stations
US11/111,353 2005-04-20

Publications (2)

Publication Number Publication Date
WO2006069348A2 WO2006069348A2 (en) 2006-06-29
WO2006069348A3 true WO2006069348A3 (en) 2006-09-28

Family

ID=36602361

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/046906 WO2006069348A2 (en) 2004-12-22 2005-12-21 Coat/develop module with shared dispense

Country Status (3)

Country Link
JP (2) JP4842280B2 (en)
KR (1) KR100925898B1 (en)
WO (1) WO2006069348A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8636458B2 (en) 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
JP5323775B2 (en) * 2010-07-12 2013-10-23 東京エレクトロン株式会社 Substrate processing equipment
ITRM20130126A1 (en) * 2013-03-01 2014-09-02 Sat S R L MODULAR WET CHEMICAL PROCESSING SYSTEM FOR THE PROCESSING OF SEMICONDUCTOR PRODUCTS
JP6748524B2 (en) * 2015-09-30 2020-09-02 芝浦メカトロニクス株式会社 Substrate processing apparatus and substrate processing method
KR20210153298A (en) * 2020-06-10 2021-12-17 실이엔지 주식회사 Capsule type chemical solution supply apparatus and chemical solution supply method using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250114A (en) * 1990-09-07 1993-10-05 Tokyo Electron Limited Coating apparatus with nozzle moving means
US6258167B1 (en) * 1996-11-27 2001-07-10 Tokyo Electron Limited Process liquid film forming apparatus
US6616762B2 (en) * 2000-10-13 2003-09-09 Tokyo Electron Limited Treatment solution supply apparatus and treatment solution supply method
US6736556B2 (en) * 2001-12-10 2004-05-18 Tokyo Electron Limited Substrate processing apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053151A (en) * 1991-06-18 1993-01-08 Hitachi Ltd Resist removing device
JP3566475B2 (en) * 1996-12-03 2004-09-15 東京エレクトロン株式会社 Processing equipment
JP3910818B2 (en) * 2000-10-13 2007-04-25 東京エレクトロン株式会社 Treatment liquid supply apparatus and treatment liquid supply method
JP3878907B2 (en) * 2001-12-25 2007-02-07 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
KR20040013965A (en) * 2002-08-09 2004-02-14 삼성전자주식회사 Process chamber of multi-chamber type

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250114A (en) * 1990-09-07 1993-10-05 Tokyo Electron Limited Coating apparatus with nozzle moving means
US6258167B1 (en) * 1996-11-27 2001-07-10 Tokyo Electron Limited Process liquid film forming apparatus
US6616762B2 (en) * 2000-10-13 2003-09-09 Tokyo Electron Limited Treatment solution supply apparatus and treatment solution supply method
US6736556B2 (en) * 2001-12-10 2004-05-18 Tokyo Electron Limited Substrate processing apparatus

Also Published As

Publication number Publication date
KR100925898B1 (en) 2009-11-09
WO2006069348A2 (en) 2006-06-29
JP4842280B2 (en) 2011-12-21
JP2008526033A (en) 2008-07-17
JP4768084B2 (en) 2011-09-07
JP2011139076A (en) 2011-07-14
KR20070088805A (en) 2007-08-29

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