KR102241655B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents

임프린트 장치 및 물품 제조 방법 Download PDF

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Publication number
KR102241655B1
KR102241655B1 KR1020197002514A KR20197002514A KR102241655B1 KR 102241655 B1 KR102241655 B1 KR 102241655B1 KR 1020197002514 A KR1020197002514 A KR 1020197002514A KR 20197002514 A KR20197002514 A KR 20197002514A KR 102241655 B1 KR102241655 B1 KR 102241655B1
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South Korea
Prior art keywords
mold
unit
imaging unit
imprint
imprint material
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KR1020197002514A
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English (en)
Korean (ko)
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KR20190022763A (ko
Inventor
히로시 사토
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캐논 가부시끼가이샤
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Publication of KR20190022763A publication Critical patent/KR20190022763A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H01L21/027—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5891—Measuring, controlling or regulating using imaging devices, e.g. cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020197002514A 2015-08-10 2017-01-26 임프린트 장치 및 물품 제조 방법 Active KR102241655B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015158495 2015-08-10
JPJP-P-2016-132779 2016-07-04
JP2016132779A JP6799397B2 (ja) 2015-08-10 2016-07-04 インプリント装置、および物品の製造方法
PCT/JP2017/002625 WO2018008174A1 (ja) 2015-08-10 2017-01-26 インプリント装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20190022763A KR20190022763A (ko) 2019-03-06
KR102241655B1 true KR102241655B1 (ko) 2021-04-19

Family

ID=57994655

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197002514A Active KR102241655B1 (ko) 2015-08-10 2017-01-26 임프린트 장치 및 물품 제조 방법

Country Status (5)

Country Link
US (1) US10011057B2 (https=)
JP (1) JP6799397B2 (https=)
KR (1) KR102241655B1 (https=)
TW (1) TWI737675B (https=)
WO (1) WO2018008174A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6188382B2 (ja) * 2013-04-03 2017-08-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP5960198B2 (ja) * 2013-07-02 2016-08-02 キヤノン株式会社 パターン形成方法、リソグラフィ装置、リソグラフィシステムおよび物品製造方法
US10353299B2 (en) * 2016-06-01 2019-07-16 Canon Kabushiki Kaisha Lithography method, determination method, information processing apparatus, storage medium, and method of manufacturing article
JP7222623B2 (ja) * 2018-07-23 2023-02-15 キヤノン株式会社 パターン形成方法および物品製造方法
US11107678B2 (en) * 2019-11-26 2021-08-31 Canon Kabushiki Kaisha Wafer process, apparatus and method of manufacturing an article
KR102227885B1 (ko) * 2020-06-02 2021-03-15 주식회사 기가레인 패턴 정렬 가능한 전사 장치
JP7494037B2 (ja) * 2020-07-15 2024-06-03 キヤノン株式会社 情報処理装置、判定方法、検査装置、成形装置、および物品の製造方法
KR102520642B1 (ko) * 2020-12-29 2023-04-11 주식회사 기가레인 패턴 정렬 가능한 전사 장치
JP7407465B2 (ja) * 2022-03-04 2024-01-04 株式会社菊水製作所 成形品処理システム

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070246850A1 (en) 2006-04-21 2007-10-25 Molecular Imprints, Inc. Method for Detecting a Particle in a Nanoimprint Lithography System
US20090214761A1 (en) 2008-02-26 2009-08-27 Molecular Imprints, Inc. Real time imprint process diagnostics for defects
US20110290136A1 (en) 2010-05-31 2011-12-01 Canon Kabushiki Kaisha Lithographic apparatus and manufacturing method of commodities
US20120286443A1 (en) 2011-05-10 2012-11-15 Canon Kabushiki Kaisha Detection apparatus, detection method, and imprint apparatus
US20140083454A1 (en) 2011-03-25 2014-03-27 Fujifilm Corporation Method for removing foreign particles adhered to molds
US20140153003A1 (en) 2012-11-30 2014-06-05 Canon Kabushiki Kaisha Measuring apparatus, imprint system, measuring method, and device manufacturing method
JP2015018997A (ja) 2013-07-12 2015-01-29 大日本印刷株式会社 インプリント装置及びインプリント方法
JP2015056589A (ja) 2013-09-13 2015-03-23 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP2015233071A (ja) 2014-06-09 2015-12-24 キヤノン株式会社 インプリント装置及び物品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2432029A (en) * 2005-11-02 2007-05-09 Crime Scene Invest Equipment L Imprint identification system using image scanner calibration
US8345242B2 (en) * 2008-10-28 2013-01-01 Molecular Imprints, Inc. Optical system for use in stage control
JP5173944B2 (ja) 2009-06-16 2013-04-03 キヤノン株式会社 インプリント装置及び物品の製造方法
JP5455583B2 (ja) 2009-11-30 2014-03-26 キヤノン株式会社 インプリント装置
JP5539011B2 (ja) * 2010-05-14 2014-07-02 キヤノン株式会社 インプリント装置、検出装置、位置合わせ装置、及び物品の製造方法
JP6071221B2 (ja) * 2012-03-14 2017-02-01 キヤノン株式会社 インプリント装置、モールド、インプリント方法及び物品の製造方法
JP6083340B2 (ja) * 2013-07-12 2017-02-22 富士通株式会社 化合物半導体装置及びその製造方法
JP6403627B2 (ja) * 2015-04-14 2018-10-10 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070246850A1 (en) 2006-04-21 2007-10-25 Molecular Imprints, Inc. Method for Detecting a Particle in a Nanoimprint Lithography System
US20090214761A1 (en) 2008-02-26 2009-08-27 Molecular Imprints, Inc. Real time imprint process diagnostics for defects
US20110290136A1 (en) 2010-05-31 2011-12-01 Canon Kabushiki Kaisha Lithographic apparatus and manufacturing method of commodities
US20140083454A1 (en) 2011-03-25 2014-03-27 Fujifilm Corporation Method for removing foreign particles adhered to molds
US20120286443A1 (en) 2011-05-10 2012-11-15 Canon Kabushiki Kaisha Detection apparatus, detection method, and imprint apparatus
US20140153003A1 (en) 2012-11-30 2014-06-05 Canon Kabushiki Kaisha Measuring apparatus, imprint system, measuring method, and device manufacturing method
JP2015018997A (ja) 2013-07-12 2015-01-29 大日本印刷株式会社 インプリント装置及びインプリント方法
JP2015056589A (ja) 2013-09-13 2015-03-23 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP2015233071A (ja) 2014-06-09 2015-12-24 キヤノン株式会社 インプリント装置及び物品の製造方法

Also Published As

Publication number Publication date
KR20190022763A (ko) 2019-03-06
TW201802873A (zh) 2018-01-16
US10011057B2 (en) 2018-07-03
TWI737675B (zh) 2021-09-01
US20170043511A1 (en) 2017-02-16
JP2017038042A (ja) 2017-02-16
WO2018008174A1 (ja) 2018-01-11
JP6799397B2 (ja) 2020-12-16

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