KR102231993B1 - 다층 배선판의 제조 방법 - Google Patents

다층 배선판의 제조 방법 Download PDF

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Publication number
KR102231993B1
KR102231993B1 KR1020207021006A KR20207021006A KR102231993B1 KR 102231993 B1 KR102231993 B1 KR 102231993B1 KR 1020207021006 A KR1020207021006 A KR 1020207021006A KR 20207021006 A KR20207021006 A KR 20207021006A KR 102231993 B1 KR102231993 B1 KR 102231993B1
Authority
KR
South Korea
Prior art keywords
metal foil
wiring layer
layer
insulating layer
laminate
Prior art date
Application number
KR1020207021006A
Other languages
English (en)
Korean (ko)
Other versions
KR20200091934A (ko
Inventor
미사토 미조구치
가즈히로 요시카와
Original Assignee
미쓰이금속광업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이금속광업주식회사 filed Critical 미쓰이금속광업주식회사
Publication of KR20200091934A publication Critical patent/KR20200091934A/ko
Application granted granted Critical
Publication of KR102231993B1 publication Critical patent/KR102231993B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020207021006A 2018-03-28 2019-03-22 다층 배선판의 제조 방법 KR102231993B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2018-063193 2018-03-28
JP2018063193 2018-03-28
JP2018183881 2018-09-28
JPJP-P-2018-183881 2018-09-28
PCT/JP2019/012233 WO2019188836A1 (ja) 2018-03-28 2019-03-22 多層配線板の製造方法

Publications (2)

Publication Number Publication Date
KR20200091934A KR20200091934A (ko) 2020-07-31
KR102231993B1 true KR102231993B1 (ko) 2021-03-25

Family

ID=68058980

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207021006A KR102231993B1 (ko) 2018-03-28 2019-03-22 다층 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP6622444B1 (ja)
KR (1) KR102231993B1 (ja)
CN (1) CN111684869B (ja)
TW (1) TWI703909B (ja)
WO (1) WO2019188836A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165047A (ja) 1998-11-26 2000-06-16 Nippon Carbide Ind Co Inc プリント配線板の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3512624B2 (ja) * 1998-03-13 2004-03-31 三菱電機株式会社 配線基板加工用レーザ加工装置およびその方法
JP2003060352A (ja) * 2001-08-08 2003-02-28 Asahi Kasei Corp 多層プリント配線板
JP4694349B2 (ja) * 2005-11-07 2011-06-08 日立ビアメカニクス株式会社 レーザ加工を用いたプリント配線板及びその製造方法
KR100797719B1 (ko) * 2006-05-10 2008-01-23 삼성전기주식회사 빌드업 인쇄회로기판의 제조공정
JP2008218489A (ja) * 2007-02-28 2008-09-18 Sharp Corp 多層プリント配線板の製造方法
JP4460013B2 (ja) 2008-08-22 2010-05-12 新光電気工業株式会社 配線基板の製造方法
TWI434638B (zh) * 2010-07-29 2014-04-11 Advanced Semiconductor Eng 線路基板製程
CN103327741B (zh) * 2013-07-04 2016-03-02 江俊逢 一种基于3d打印的封装基板及其制造方法
JP6305001B2 (ja) * 2013-10-15 2018-04-04 Ｊｘ金属株式会社 銅箔、銅張積層板及びフレキシブルプリント配線板
JP5901848B2 (ja) * 2014-01-27 2016-04-13 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
CN106232350B (zh) * 2014-06-03 2017-09-22 三井金属矿业株式会社 带剥离树脂层的金属箔和印刷电路板
JP6945523B2 (ja) * 2016-04-14 2021-10-06 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165047A (ja) 1998-11-26 2000-06-16 Nippon Carbide Ind Co Inc プリント配線板の製造方法

Also Published As

Publication number Publication date
TW201943324A (zh) 2019-11-01
JP6622444B1 (ja) 2019-12-18
CN111684869A (zh) 2020-09-18
CN111684869B (zh) 2021-03-19
JPWO2019188836A1 (ja) 2020-04-30
WO2019188836A1 (ja) 2019-10-03
TWI703909B (zh) 2020-09-01
KR20200091934A (ko) 2020-07-31

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