KR102216330B1 - 수지 조성물, 프리프레그, 적층판, 및 금속박-피복 적층판 - Google Patents

수지 조성물, 프리프레그, 적층판, 및 금속박-피복 적층판 Download PDF

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Publication number
KR102216330B1
KR102216330B1 KR1020190094198A KR20190094198A KR102216330B1 KR 102216330 B1 KR102216330 B1 KR 102216330B1 KR 1020190094198 A KR1020190094198 A KR 1020190094198A KR 20190094198 A KR20190094198 A KR 20190094198A KR 102216330 B1 KR102216330 B1 KR 102216330B1
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KR
South Korea
Prior art keywords
formula
epoxy resin
molecular weight
resin
resin composition
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KR1020190094198A
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English (en)
Korean (ko)
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KR20200083897A (ko
Inventor
쥔치 탕
쯔광 리
Original Assignee
셍기 테크놀로지 코포레이션 리미티드
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Publication of KR20200083897A publication Critical patent/KR20200083897A/ko
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Publication of KR102216330B1 publication Critical patent/KR102216330B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
    • C08L39/02—Homopolymers or copolymers of vinylamine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020190094198A 2018-12-29 2019-08-02 수지 조성물, 프리프레그, 적층판, 및 금속박-피복 적층판 KR102216330B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811646466.3A CN111378098B (zh) 2018-12-29 2018-12-29 树脂组合物、预浸料、层压板以及覆金属箔层压板
CN201811646466.3 2018-12-29

Publications (2)

Publication Number Publication Date
KR20200083897A KR20200083897A (ko) 2020-07-09
KR102216330B1 true KR102216330B1 (ko) 2021-02-17

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KR (1) KR102216330B1 (zh)
CN (1) CN111378098B (zh)
TW (1) TWI776065B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114698223B (zh) * 2020-12-29 2024-06-14 广东生益科技股份有限公司 一种覆不对称金属箔的层压板和包含其的印刷线路板

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2001207020A (ja) * 2000-01-28 2001-07-31 Hitachi Chem Co Ltd 配線板用エポキシ樹脂組成物、配線板用プリプレグ及びそれを用いた金属箔張積層板
JP2012017451A (ja) 2010-07-08 2012-01-26 Chi Mei Corp 相溶化剤を含むブレンドポリマー組成物
JP2014070156A (ja) 2012-09-28 2014-04-21 Panasonic Corp プリプレグ、金属張積層板、プリント配線板
JP2016069389A (ja) 2014-09-26 2016-05-09 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板

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TW200417295A (en) * 2003-01-31 2004-09-01 Sumitomo Chemical Co Resin film and multilayer printed wiring board using thereof
KR101023841B1 (ko) * 2006-12-08 2011-03-22 주식회사 엘지화학 접착제 수지 조성물 및 이를 이용한 다이싱 다이 본딩 필름
KR101266543B1 (ko) * 2009-12-14 2013-05-23 제일모직주식회사 상용성이 향상된 이방도전성 필름용 조성물 및 이로부터 형성된 필름
CN103476845B (zh) * 2011-03-29 2016-03-02 三菱瓦斯化学株式会社 预浸料和覆金属箔层压板以及印刷电路板
CN103304949B (zh) * 2013-06-08 2016-03-23 苏州生益科技有限公司 一种热固性树脂组合物及使用其制作的半固化片及层压板
JP2015172144A (ja) * 2014-03-12 2015-10-01 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板
US9894761B2 (en) * 2015-06-12 2018-02-13 Panasonic Intellectual Property Management Co., Ltd. Prepreg, metal-clad laminated plate and printed wiring board
WO2018021113A1 (ja) * 2016-07-29 2018-02-01 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板
WO2018105691A1 (ja) * 2016-12-09 2018-06-14 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板
JP6977499B2 (ja) * 2017-03-09 2021-12-08 Ｍｃｐｐイノベーション合同会社 樹脂組成物及び積層体
CN108239372B (zh) * 2017-12-29 2020-06-16 广东生益科技股份有限公司 树脂组合物、预浸料、层压板以及覆金属箔层压板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001207020A (ja) * 2000-01-28 2001-07-31 Hitachi Chem Co Ltd 配線板用エポキシ樹脂組成物、配線板用プリプレグ及びそれを用いた金属箔張積層板
JP2012017451A (ja) 2010-07-08 2012-01-26 Chi Mei Corp 相溶化剤を含むブレンドポリマー組成物
JP2014070156A (ja) 2012-09-28 2014-04-21 Panasonic Corp プリプレグ、金属張積層板、プリント配線板
JP2016069389A (ja) 2014-09-26 2016-05-09 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板

Non-Patent Citations (1)

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Title
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Also Published As

Publication number Publication date
TWI776065B (zh) 2022-09-01
TW202026356A (zh) 2020-07-16
KR20200083897A (ko) 2020-07-09
CN111378098A (zh) 2020-07-07
CN111378098B (zh) 2023-04-07

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