KR102205383B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR102205383B1
KR102205383B1 KR1020170176017A KR20170176017A KR102205383B1 KR 102205383 B1 KR102205383 B1 KR 102205383B1 KR 1020170176017 A KR1020170176017 A KR 1020170176017A KR 20170176017 A KR20170176017 A KR 20170176017A KR 102205383 B1 KR102205383 B1 KR 102205383B1
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KR
South Korea
Prior art keywords
duct
intake
wafer
port
substrate
Prior art date
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KR1020170176017A
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English (en)
Korean (ko)
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KR20180072572A (ko
Inventor
도모아키 아베
고유 하세가와
마사토 가도베
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20180072572A publication Critical patent/KR20180072572A/ko
Application granted granted Critical
Publication of KR102205383B1 publication Critical patent/KR102205383B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
KR1020170176017A 2016-12-21 2017-12-20 기판 처리 장치 및 기판 처리 방법 KR102205383B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016248277A JP6710154B2 (ja) 2016-12-21 2016-12-21 基板処理装置及び基板処理方法
JPJP-P-2016-248277 2016-12-21

Publications (2)

Publication Number Publication Date
KR20180072572A KR20180072572A (ko) 2018-06-29
KR102205383B1 true KR102205383B1 (ko) 2021-01-19

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ID=62650041

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170176017A KR102205383B1 (ko) 2016-12-21 2017-12-20 기판 처리 장치 및 기판 처리 방법

Country Status (3)

Country Link
JP (1) JP6710154B2 (ja)
KR (1) KR102205383B1 (ja)
CN (1) CN108231625B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111604324A (zh) * 2020-05-15 2020-09-01 北京北方华创微电子装备有限公司 晶片清洗机的控制方法及晶片清洗机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250802A (ja) 2006-03-15 2007-09-27 Hitachi Kokusai Electric Inc 基板処理装置
JP2012169367A (ja) 2011-02-10 2012-09-06 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP2015167240A (ja) 2015-04-17 2015-09-24 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP2016157712A (ja) * 2015-02-23 2016-09-01 東京エレクトロン株式会社 冷却装置及びこれを用いた熱処理装置、並びに冷却方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4374133B2 (ja) * 2000-12-05 2009-12-02 株式会社日立国際電気 基板処理装置および基板処理方法
JP5953951B2 (ja) * 2012-06-05 2016-07-20 東京エレクトロン株式会社 縦型熱処理装置及び縦型熱処理装置の運転方法
JP6106501B2 (ja) * 2013-04-12 2017-04-05 東京エレクトロン株式会社 収納容器内の雰囲気管理方法
JP2015050341A (ja) * 2013-09-02 2015-03-16 東京エレクトロン株式会社 基板処理装置及びメンテナンス方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250802A (ja) 2006-03-15 2007-09-27 Hitachi Kokusai Electric Inc 基板処理装置
JP2012169367A (ja) 2011-02-10 2012-09-06 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP2016157712A (ja) * 2015-02-23 2016-09-01 東京エレクトロン株式会社 冷却装置及びこれを用いた熱処理装置、並びに冷却方法
JP2015167240A (ja) 2015-04-17 2015-09-24 株式会社日立国際電気 基板処理装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JP2018101741A (ja) 2018-06-28
CN108231625B (zh) 2023-04-07
CN108231625A (zh) 2018-06-29
KR20180072572A (ko) 2018-06-29
JP6710154B2 (ja) 2020-06-17

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