KR102197189B1 - 기판 지지 장치 - Google Patents

기판 지지 장치 Download PDF

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Publication number
KR102197189B1
KR102197189B1 KR1020130060676A KR20130060676A KR102197189B1 KR 102197189 B1 KR102197189 B1 KR 102197189B1 KR 1020130060676 A KR1020130060676 A KR 1020130060676A KR 20130060676 A KR20130060676 A KR 20130060676A KR 102197189 B1 KR102197189 B1 KR 102197189B1
Authority
KR
South Korea
Prior art keywords
bushing
susceptor
substrate
pin
lift pin
Prior art date
Application number
KR1020130060676A
Other languages
English (en)
Korean (ko)
Other versions
KR20140139935A (ko
Inventor
최종성
권봉성
유지환
이명진
정석철
Original Assignee
주성엔지니어링(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주성엔지니어링(주) filed Critical 주성엔지니어링(주)
Priority to KR1020130060676A priority Critical patent/KR102197189B1/ko
Priority to PCT/KR2014/004707 priority patent/WO2014193138A1/ko
Priority to TW103118680A priority patent/TWI639482B/zh
Publication of KR20140139935A publication Critical patent/KR20140139935A/ko
Application granted granted Critical
Publication of KR102197189B1 publication Critical patent/KR102197189B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/02—Sliding-contact bearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130060676A 2013-05-28 2013-05-28 기판 지지 장치 KR102197189B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020130060676A KR102197189B1 (ko) 2013-05-28 2013-05-28 기판 지지 장치
PCT/KR2014/004707 WO2014193138A1 (ko) 2013-05-28 2014-05-27 기판 지지 장치 및 이를 포함하는 기판 처리 장치
TW103118680A TWI639482B (zh) 2013-05-28 2014-05-28 基板支撐設備與包含該基板支撐設備的基板處理設備

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130060676A KR102197189B1 (ko) 2013-05-28 2013-05-28 기판 지지 장치

Publications (2)

Publication Number Publication Date
KR20140139935A KR20140139935A (ko) 2014-12-08
KR102197189B1 true KR102197189B1 (ko) 2020-12-31

Family

ID=51989098

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130060676A KR102197189B1 (ko) 2013-05-28 2013-05-28 기판 지지 장치

Country Status (3)

Country Link
KR (1) KR102197189B1 (zh)
TW (1) TWI639482B (zh)
WO (1) WO2014193138A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160348233A1 (en) * 2015-05-29 2016-12-01 Applied Materials, Inc. Grounding of conductive mask for deposition processes
US11387135B2 (en) * 2016-01-28 2022-07-12 Applied Materials, Inc. Conductive wafer lift pin o-ring gripper with resistor
DE102016212780A1 (de) 2016-07-13 2018-01-18 Siltronic Ag Vorrichtung zur Handhabung einer Halbleiterscheibe in einem Epitaxie-Reaktor und Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht
KR101996051B1 (ko) * 2017-07-05 2019-07-03 심경식 기판지지용 롤러 부싱
KR102659428B1 (ko) * 2018-11-29 2024-04-23 삼성디스플레이 주식회사 부싱부 및 그것을 포함하는 기판 처리 장치
KR20210054112A (ko) * 2019-11-04 2021-05-13 삼성디스플레이 주식회사 증착장치 및 이를 이용한 기판 처리방법
KR20210076345A (ko) 2019-12-16 2021-06-24 삼성전자주식회사 리프트 핀 모듈
CN111739837A (zh) * 2020-07-27 2020-10-02 盛吉盛(宁波)半导体科技有限公司 一种半导体设备的铝制加热器盖板的陶瓷提升销及其制备方法
KR20230082405A (ko) * 2021-12-01 2023-06-08 주식회사 유진테크 리프트핀 프로텍션 어셈블리 및 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100840971B1 (ko) 2007-02-28 2008-06-24 세메스 주식회사 기판 서포트 및 이를 갖는 기판 코팅 장치
US20110164955A1 (en) * 2009-07-15 2011-07-07 Applied Materials,Inc. Processing chamber with translating wear plate for lift pin
WO2013162641A1 (en) 2012-04-26 2013-10-31 Applied Materials, Inc. Methods and apparatus toward preventing esc bonding adhesive erosion

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5848670A (en) * 1996-12-04 1998-12-15 Applied Materials, Inc. Lift pin guidance apparatus
KR100459788B1 (ko) * 2002-01-14 2004-12-04 주성엔지니어링(주) 2단 웨이퍼 리프트 핀
JP4373980B2 (ja) * 2003-09-24 2009-11-25 三星ダイヤモンド工業株式会社 基板分断システムおよび基板分断方法
KR20060076941A (ko) * 2004-12-29 2006-07-05 주식회사 평강산업 힌지장치
KR101240391B1 (ko) * 2005-05-24 2013-03-08 주성엔지니어링(주) 리프트핀 어셈블리
KR101207771B1 (ko) * 2006-02-09 2012-12-05 주성엔지니어링(주) 마찰력을 감소시킨 리프트 핀 홀더
TWI363212B (en) * 2006-05-26 2012-05-01 Advanced Display Proc Eng Co Adhesive chuck, and apparatus and method for assembling substrates using the same
JP5352329B2 (ja) * 2009-04-13 2013-11-27 株式会社日立ハイテクノロジーズ 実装処理作業装置及び実装処理作業方法並びに表示基板モジュール組立ライン
WO2011009007A2 (en) * 2009-07-15 2011-01-20 Applied Materials, Inc. Improved lift pin guides
KR101053564B1 (ko) * 2010-10-29 2011-08-03 (주) 에스디시 승강 핀 가이드

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100840971B1 (ko) 2007-02-28 2008-06-24 세메스 주식회사 기판 서포트 및 이를 갖는 기판 코팅 장치
US20110164955A1 (en) * 2009-07-15 2011-07-07 Applied Materials,Inc. Processing chamber with translating wear plate for lift pin
WO2013162641A1 (en) 2012-04-26 2013-10-31 Applied Materials, Inc. Methods and apparatus toward preventing esc bonding adhesive erosion

Also Published As

Publication number Publication date
TW201507799A (zh) 2015-03-01
TWI639482B (zh) 2018-11-01
KR20140139935A (ko) 2014-12-08
WO2014193138A1 (ko) 2014-12-04

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