KR102195526B1 - 연성이고 컨디셔닝가능한 화학 기계적 창 연마 패드 - Google Patents

연성이고 컨디셔닝가능한 화학 기계적 창 연마 패드 Download PDF

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Publication number
KR102195526B1
KR102195526B1 KR1020140064223A KR20140064223A KR102195526B1 KR 102195526 B1 KR102195526 B1 KR 102195526B1 KR 1020140064223 A KR1020140064223 A KR 1020140064223A KR 20140064223 A KR20140064223 A KR 20140064223A KR 102195526 B1 KR102195526 B1 KR 102195526B1
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Prior art keywords
curing agent
polishing
average
layer
molecular weight
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Korean (ko)
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KR20140141491A (ko
Inventor
배이니언 콰이언
미쉘 케이 젠슨
마티 더블유 디그룻
앵거스 레퍼
제임스 머네인
제프리 제임스 헨드런
존 지 나울랜드
데이빗 비 제임스
펑지 예
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
다우 글로벌 테크놀로지스 엘엘씨
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Publication of KR20140141491A publication Critical patent/KR20140141491A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3271—Hydroxyamines
    • C08G18/3278—Hydroxyamines containing at least three hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6637—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/664—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C08G18/6644—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203 having at least three hydroxy groups

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020140064223A 2013-05-31 2014-05-28 연성이고 컨디셔닝가능한 화학 기계적 창 연마 패드 Active KR102195526B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/906,765 2013-05-31
US13/906,765 US9238295B2 (en) 2013-05-31 2013-05-31 Soft and conditionable chemical mechanical window polishing pad

Publications (2)

Publication Number Publication Date
KR20140141491A KR20140141491A (ko) 2014-12-10
KR102195526B1 true KR102195526B1 (ko) 2020-12-28

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KR1020140064223A Active KR102195526B1 (ko) 2013-05-31 2014-05-28 연성이고 컨디셔닝가능한 화학 기계적 창 연마 패드

Country Status (7)

Country Link
US (1) US9238295B2 (enExample)
JP (1) JP6290004B2 (enExample)
KR (1) KR102195526B1 (enExample)
CN (1) CN104209853B (enExample)
DE (1) DE102014007027A1 (enExample)
FR (1) FR3006219B1 (enExample)
TW (1) TWI574784B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9259820B2 (en) * 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
TW201629467A (zh) * 2014-12-29 2016-08-16 陶氏全球科技責任有限公司 化學機械拋光墊、拋光層分析器及方法
US10144115B2 (en) * 2015-06-26 2018-12-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
US9630293B2 (en) * 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
JP2017064887A (ja) * 2015-10-02 2017-04-06 富士紡ホールディングス株式会社 研磨パッド
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
TWI593511B (zh) * 2016-06-08 2017-08-01 智勝科技股份有限公司 研磨墊及研磨方法
US20180281149A1 (en) * 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
KR101945874B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드
US11179822B2 (en) * 2017-08-31 2021-11-23 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
CN107553313B (zh) * 2017-08-31 2019-12-31 湖北鼎龙控股股份有限公司 一种抛光垫、聚氨酯抛光层及其制备方法
US10465097B2 (en) * 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
TW202225286A (zh) * 2020-09-30 2022-07-01 日商富士紡控股股份有限公司 研磨墊及研磨墊之製造方法
CN115555986B (zh) * 2021-07-02 2025-12-19 恩普士有限公司 抛光垫及使用其的半导体器件的制备方法
KR102623920B1 (ko) * 2021-07-27 2024-01-10 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
KR20240132321A (ko) * 2021-12-31 2024-09-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 플루오르화 중합체 윈도우를 포함하는 미세복제된 폴리싱 패드
KR20230112387A (ko) * 2022-01-20 2023-07-27 케이피엑스케미칼 주식회사 연마패드용 윈도우의 제조방법 및 이 방법으로 제조된 연마패드용 윈도우
US20230390970A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
CN117020936B (zh) * 2023-10-10 2023-12-29 青禾晶元(天津)半导体材料有限公司 一种光催化复合抛光垫及其制备方法与抛光方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005167200A (ja) 2003-09-26 2005-06-23 Rohm & Haas Electronic Materials Cmp Holdings Inc ケミカルメカニカルポリッシングのための弾性研磨パッド
JP2007260827A (ja) * 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5212910A (en) 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5287663A (en) 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JPH08216033A (ja) * 1995-02-16 1996-08-27 Fuji Photo Film Co Ltd 研磨テープ
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
EP0779655A3 (en) 1995-12-14 1997-07-16 International Business Machines Corporation A method of chemically-mechanically polishing an electronic component
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
IT1302496B1 (it) * 1998-09-14 2000-09-05 Sixton Holding Sa Schiuma poliuretanica rigida.
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP3826702B2 (ja) 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
KR100877383B1 (ko) 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
CN1639848A (zh) * 2002-08-30 2005-07-13 东丽株式会社 研磨垫、平台孔盖及研磨装置和研磨方法及半导体器件的制造方法
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20040192178A1 (en) 2003-03-28 2004-09-30 Barak Yardeni Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
US8066552B2 (en) 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US7132033B2 (en) 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
JP4475404B2 (ja) 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
CN101724167B (zh) 2005-07-15 2013-06-26 东洋橡胶工业株式会社 层叠片及其制造方法
KR100709392B1 (ko) * 2005-07-20 2007-04-20 에스케이씨 주식회사 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드
WO2008029538A1 (en) 2006-09-08 2008-03-13 Toyo Tire & Rubber Co., Ltd. Polishing pad
MY157714A (en) * 2007-01-15 2016-07-15 Rohm & Haas Elect Mat Polishing pad and a method for manufacturing the same
JP4261586B2 (ja) * 2007-01-15 2009-04-30 東洋ゴム工業株式会社 研磨パッドの製造方法
JP4986129B2 (ja) * 2007-01-15 2012-07-25 東洋ゴム工業株式会社 研磨パッド
US20090062414A1 (en) 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
US8052507B2 (en) 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
JP4593643B2 (ja) 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
JP4897082B2 (ja) 2008-04-25 2012-03-14 トーヨーポリマー株式会社 ポリウレタン発泡体及び研磨パッド
DE602009001168D1 (de) * 2008-10-16 2011-06-09 Rohm & Haas Elect Mat Chemisch-mechanisches Polierpad mit Fenster mit integrierter Identifizierungsfunktion
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
JP5393434B2 (ja) 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
TWM367052U (en) 2009-04-24 2009-10-21 Bestac Advanced Material Co Ltd Polishing pad and polishing device
US8157614B2 (en) 2009-04-30 2012-04-17 Applied Materials, Inc. Method of making and apparatus having windowless polishing pad and protected fiber
US8662957B2 (en) 2009-06-30 2014-03-04 Applied Materials, Inc. Leak proof pad for CMP endpoint detection
US8697239B2 (en) * 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
US8551201B2 (en) 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JP5893479B2 (ja) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド
US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005167200A (ja) 2003-09-26 2005-06-23 Rohm & Haas Electronic Materials Cmp Holdings Inc ケミカルメカニカルポリッシングのための弾性研磨パッド
JP2007260827A (ja) * 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法

Also Published As

Publication number Publication date
CN104209853A (zh) 2014-12-17
JP6290004B2 (ja) 2018-03-07
US20140357170A1 (en) 2014-12-04
TW201515770A (zh) 2015-05-01
US9238295B2 (en) 2016-01-19
CN104209853B (zh) 2017-01-18
FR3006219A1 (fr) 2014-12-05
FR3006219B1 (fr) 2016-02-19
TWI574784B (zh) 2017-03-21
DE102014007027A1 (de) 2014-12-04
JP2014233834A (ja) 2014-12-15
KR20140141491A (ko) 2014-12-10

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