FR3006219B1 - Tampon de polissage chimique mecanique a fenetre, souple et conditionnable - Google Patents

Tampon de polissage chimique mecanique a fenetre, souple et conditionnable

Info

Publication number
FR3006219B1
FR3006219B1 FR1454943A FR1454943A FR3006219B1 FR 3006219 B1 FR3006219 B1 FR 3006219B1 FR 1454943 A FR1454943 A FR 1454943A FR 1454943 A FR1454943 A FR 1454943A FR 3006219 B1 FR3006219 B1 FR 3006219B1
Authority
FR
France
Prior art keywords
conditionable
window
flexible
polishing pad
chemical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1454943A
Other languages
English (en)
French (fr)
Other versions
FR3006219A1 (fr
Inventor
Bainian Qian
Michelle K Jensen
Marty W Degroot
Angus Repper
James Murnane
Jeffrey James Hendron
John G Nowland
David B James
Fengji Yeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DDP Specialty Electronic Materials US LLC
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR3006219A1 publication Critical patent/FR3006219A1/fr
Application granted granted Critical
Publication of FR3006219B1 publication Critical patent/FR3006219B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3271—Hydroxyamines
    • C08G18/3278—Hydroxyamines containing at least three hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6637—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/664—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C08G18/6644—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203 having at least three hydroxy groups

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR1454943A 2013-05-31 2014-05-30 Tampon de polissage chimique mecanique a fenetre, souple et conditionnable Active FR3006219B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/906,765 US9238295B2 (en) 2013-05-31 2013-05-31 Soft and conditionable chemical mechanical window polishing pad

Publications (2)

Publication Number Publication Date
FR3006219A1 FR3006219A1 (fr) 2014-12-05
FR3006219B1 true FR3006219B1 (fr) 2016-02-19

Family

ID=51168261

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1454943A Active FR3006219B1 (fr) 2013-05-31 2014-05-30 Tampon de polissage chimique mecanique a fenetre, souple et conditionnable

Country Status (7)

Country Link
US (1) US9238295B2 (enExample)
JP (1) JP6290004B2 (enExample)
KR (1) KR102195526B1 (enExample)
CN (1) CN104209853B (enExample)
DE (1) DE102014007027A1 (enExample)
FR (1) FR3006219B1 (enExample)
TW (1) TWI574784B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
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US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) * 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
TW201629467A (zh) * 2014-12-29 2016-08-16 陶氏全球科技責任有限公司 化學機械拋光墊、拋光層分析器及方法
US9630293B2 (en) * 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
US10144115B2 (en) * 2015-06-26 2018-12-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making polishing layer for chemical mechanical polishing pad
JP2017064887A (ja) * 2015-10-02 2017-04-06 富士紡ホールディングス株式会社 研磨パッド
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
TWI593511B (zh) * 2016-06-08 2017-08-01 智勝科技股份有限公司 研磨墊及研磨方法
US20180281149A1 (en) * 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
KR101945874B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드
CN107553313B (zh) * 2017-08-31 2019-12-31 湖北鼎龙控股股份有限公司 一种抛光垫、聚氨酯抛光层及其制备方法
US11179822B2 (en) * 2017-08-31 2021-11-23 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
US10465097B2 (en) * 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
TW202225286A (zh) * 2020-09-30 2022-07-01 日商富士紡控股股份有限公司 研磨墊及研磨墊之製造方法
US20230059394A1 (en) * 2021-07-02 2023-02-23 Skc Solmics Co., Ltd. Polishing pad and method for manufacturing semiconductor device using the same
KR102623920B1 (ko) * 2021-07-27 2024-01-10 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
KR20240132321A (ko) * 2021-12-31 2024-09-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 플루오르화 중합체 윈도우를 포함하는 미세복제된 폴리싱 패드
KR20230112387A (ko) * 2022-01-20 2023-07-27 케이피엑스케미칼 주식회사 연마패드용 윈도우의 제조방법 및 이 방법으로 제조된 연마패드용 윈도우
US20230390970A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
CN117020936B (zh) * 2023-10-10 2023-12-29 青禾晶元(天津)半导体材料有限公司 一种光催化复合抛光垫及其制备方法与抛光方法

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Also Published As

Publication number Publication date
TW201515770A (zh) 2015-05-01
TWI574784B (zh) 2017-03-21
CN104209853A (zh) 2014-12-17
US9238295B2 (en) 2016-01-19
US20140357170A1 (en) 2014-12-04
JP2014233834A (ja) 2014-12-15
FR3006219A1 (fr) 2014-12-05
KR20140141491A (ko) 2014-12-10
KR102195526B1 (ko) 2020-12-28
DE102014007027A1 (de) 2014-12-04
CN104209853B (zh) 2017-01-18
JP6290004B2 (ja) 2018-03-07

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