KR102184809B1 - 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents

수지 성형 장치 및 수지 성형품의 제조 방법 Download PDF

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Publication number
KR102184809B1
KR102184809B1 KR1020180127649A KR20180127649A KR102184809B1 KR 102184809 B1 KR102184809 B1 KR 102184809B1 KR 1020180127649 A KR1020180127649 A KR 1020180127649A KR 20180127649 A KR20180127649 A KR 20180127649A KR 102184809 B1 KR102184809 B1 KR 102184809B1
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KR
South Korea
Prior art keywords
die
die cavity
cavity block
wedge
resin
Prior art date
Application number
KR1020180127649A
Other languages
English (en)
Korean (ko)
Other versions
KR20190049485A (ko
Inventor
코스케 아라키
코하루 하야시
후유히코 오가와
요시토 오쿠니시
Original Assignee
토와 가부시기가이샤
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Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20190049485A publication Critical patent/KR20190049485A/ko
Application granted granted Critical
Publication of KR102184809B1 publication Critical patent/KR102184809B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020180127649A 2017-10-30 2018-10-24 수지 성형 장치 및 수지 성형품의 제조 방법 KR102184809B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-209713 2017-10-30
JP2017209713A JP6541746B2 (ja) 2017-10-30 2017-10-30 樹脂成形装置及び樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
KR20190049485A KR20190049485A (ko) 2019-05-09
KR102184809B1 true KR102184809B1 (ko) 2020-11-30

Family

ID=66295394

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180127649A KR102184809B1 (ko) 2017-10-30 2018-10-24 수지 성형 장치 및 수지 성형품의 제조 방법

Country Status (4)

Country Link
JP (1) JP6541746B2 (zh)
KR (1) KR102184809B1 (zh)
CN (1) CN109727878B (zh)
TW (1) TWI688055B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7084349B2 (ja) * 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
TWI704652B (zh) * 2019-10-31 2020-09-11 邱昱維 在佈局有電路的陶瓷基板上成形環繞壁的方法及該基板
JP6704159B1 (ja) * 2019-12-02 2020-06-03 アサヒ・エンジニアリング株式会社 樹脂封止装置
KR102240866B1 (ko) * 2021-03-23 2021-04-16 코리아플랜트(주) 내부식성이 강화된 스텐레스 연도용 배기관 및 그 제조 방법
KR102446919B1 (ko) * 2021-06-02 2022-09-23 한화솔루션 주식회사 언더커버 성형장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004152994A (ja) * 2002-10-30 2004-05-27 Renesas Technology Corp 半導体装置の樹脂封止装置及び半導体装置の製造方法
JP2006319226A (ja) 2005-05-16 2006-11-24 Matsushita Electric Ind Co Ltd 樹脂封止成形用金型装置および樹脂封止成形用金型装置の検査方法
JP2009190400A (ja) 2008-01-19 2009-08-27 Apic Yamada Corp トランスファ成形方法及びトランスファ成形装置
JP2012248780A (ja) 2011-05-31 2012-12-13 Apic Yamada Corp 樹脂封止方法

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Publication number Priority date Publication date Assignee Title
JPH03264321A (ja) * 1990-03-15 1991-11-25 Mitsubishi Electric Corp 成形装置
JP2003291147A (ja) * 2002-04-03 2003-10-14 Apic Yamada Corp 成型金型および樹脂封止装置
JP4503391B2 (ja) * 2004-08-06 2010-07-14 株式会社ルネサステクノロジ 半導体装置の製造方法
JP5560479B2 (ja) * 2009-07-01 2014-07-30 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置、並びに樹脂モールド方法
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
US20130277816A1 (en) * 2012-04-18 2013-10-24 Texas Instruments Incorporated Plastic-packaged semiconductor device having wires with polymerized insulator skin
JP6062810B2 (ja) * 2013-06-14 2017-01-18 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
JP2015076547A (ja) 2013-10-10 2015-04-20 株式会社デンソー 電子装置およびその製造方法
JP6506680B2 (ja) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6598642B2 (ja) * 2015-11-09 2019-10-30 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6236486B2 (ja) * 2016-03-07 2017-11-22 Ｔｏｗａ株式会社 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。
JP6079925B1 (ja) * 2016-03-30 2017-02-15 第一精工株式会社 樹脂封止装置及び樹脂封止装置の異常検知方法
JP6273340B2 (ja) * 2016-12-15 2018-01-31 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004152994A (ja) * 2002-10-30 2004-05-27 Renesas Technology Corp 半導体装置の樹脂封止装置及び半導体装置の製造方法
JP2006319226A (ja) 2005-05-16 2006-11-24 Matsushita Electric Ind Co Ltd 樹脂封止成形用金型装置および樹脂封止成形用金型装置の検査方法
JP2009190400A (ja) 2008-01-19 2009-08-27 Apic Yamada Corp トランスファ成形方法及びトランスファ成形装置
JP2012248780A (ja) 2011-05-31 2012-12-13 Apic Yamada Corp 樹脂封止方法

Also Published As

Publication number Publication date
TW201923991A (zh) 2019-06-16
CN109727878A (zh) 2019-05-07
TWI688055B (zh) 2020-03-11
CN109727878B (zh) 2022-10-18
JP2019081293A (ja) 2019-05-30
KR20190049485A (ko) 2019-05-09
JP6541746B2 (ja) 2019-07-10

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