KR102182426B1 - 레이저 가공 장치 및, 패턴이 있는 기판의 가공 조건 설정 방법 - Google Patents

레이저 가공 장치 및, 패턴이 있는 기판의 가공 조건 설정 방법 Download PDF

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Publication number
KR102182426B1
KR102182426B1 KR1020140058770A KR20140058770A KR102182426B1 KR 102182426 B1 KR102182426 B1 KR 102182426B1 KR 1020140058770 A KR1020140058770 A KR 1020140058770A KR 20140058770 A KR20140058770 A KR 20140058770A KR 102182426 B1 KR102182426 B1 KR 102182426B1
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KR
South Korea
Prior art keywords
processing
substrate
offset
pattern
patterned substrate
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KR1020140058770A
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English (en)
Korean (ko)
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KR20150034075A (ko
Inventor
나오야 기야마
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20150034075A publication Critical patent/KR20150034075A/ko
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Publication of KR102182426B1 publication Critical patent/KR102182426B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020140058770A 2013-09-25 2014-05-16 레이저 가공 장치 및, 패턴이 있는 기판의 가공 조건 설정 방법 KR102182426B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-198398 2013-09-25
JP2013198398A JP6241174B2 (ja) 2013-09-25 2013-09-25 レーザー加工装置、および、パターン付き基板の加工条件設定方法

Publications (2)

Publication Number Publication Date
KR20150034075A KR20150034075A (ko) 2015-04-02
KR102182426B1 true KR102182426B1 (ko) 2020-11-24

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KR1020140058770A KR102182426B1 (ko) 2013-09-25 2014-05-16 레이저 가공 장치 및, 패턴이 있는 기판의 가공 조건 설정 방법

Country Status (4)

Country Link
JP (1) JP6241174B2 (zh)
KR (1) KR102182426B1 (zh)
CN (1) CN104439696B (zh)
TW (1) TWI630052B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107995996B (zh) * 2015-08-18 2021-10-15 浜松光子学株式会社 激光加工装置及激光加工方法
JP6594699B2 (ja) * 2015-08-18 2019-10-23 浜松ホトニクス株式会社 加工対象物切断方法及び加工対象物切断装置
JP6510933B2 (ja) * 2015-08-21 2019-05-08 株式会社ディスコ 光デバイスウエーハの加工方法
JP7285067B2 (ja) * 2018-10-30 2023-06-01 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
US11897056B2 (en) 2018-10-30 2024-02-13 Hamamatsu Photonics K.K. Laser processing device and laser processing method
CN111177862B (zh) * 2019-12-13 2021-11-16 燕山大学 一种基于关联规则的板形曲线系数设定方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006218482A (ja) 2005-02-08 2006-08-24 Laser Solutions Co Ltd レーザ加工装置におけるレーザ光の調整方法、レーザ加工装置、およびレーザ光調整プログラム
JP2012086226A (ja) 2010-10-15 2012-05-10 Mitsuboshi Diamond Industrial Co Ltd レーザー加工装置、被加工物の加工方法および被加工物の分割方法

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JP3751121B2 (ja) * 1997-06-25 2006-03-01 長崎県 割断加工方法
KR101119387B1 (ko) * 2003-07-18 2012-03-07 하마마츠 포토닉스 가부시키가이샤 절단방법
EP3065186B1 (en) * 2007-08-03 2020-01-01 Nichia Corporation Method for manufacturing a gallium nitride compound semiconductor light emitting element
US9035216B2 (en) * 2009-04-07 2015-05-19 Hamamatsu Photonics K.K. Method and device for controlling interior fractures by controlling the laser pulse width
JP5056839B2 (ja) 2009-12-25 2012-10-24 三星ダイヤモンド工業株式会社 被加工物の加工方法および被加工物の分割方法
JP5770436B2 (ja) * 2010-07-08 2015-08-26 株式会社ディスコ レーザー加工装置およびレーザー加工方法
JP5641835B2 (ja) * 2010-09-10 2014-12-17 株式会社ディスコ 分割方法
JP5670765B2 (ja) * 2011-01-13 2015-02-18 浜松ホトニクス株式会社 レーザ加工方法
JP5548143B2 (ja) * 2011-01-25 2014-07-16 三星ダイヤモンド工業株式会社 Ｌｅｄチップの製造方法
JP5940783B2 (ja) * 2011-09-07 2016-06-29 株式会社ディスコ 板状物の加工方法
JP2013149932A (ja) * 2011-12-20 2013-08-01 Nitto Denko Corp 基板小片化方法およびこれを用いた基板小片化装置
JP5910075B2 (ja) * 2011-12-27 2016-04-27 三星ダイヤモンド工業株式会社 被加工物の加工方法
JP6127526B2 (ja) * 2012-10-29 2017-05-17 三星ダイヤモンド工業株式会社 レーザー加工装置、および、パターン付き基板の加工条件設定方法
JP6064519B2 (ja) * 2012-10-29 2017-01-25 三星ダイヤモンド工業株式会社 レーザー加工装置、および、パターン付き基板の加工条件設定方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006218482A (ja) 2005-02-08 2006-08-24 Laser Solutions Co Ltd レーザ加工装置におけるレーザ光の調整方法、レーザ加工装置、およびレーザ光調整プログラム
JP2012086226A (ja) 2010-10-15 2012-05-10 Mitsuboshi Diamond Industrial Co Ltd レーザー加工装置、被加工物の加工方法および被加工物の分割方法

Also Published As

Publication number Publication date
CN104439696A (zh) 2015-03-25
JP6241174B2 (ja) 2017-12-06
TW201511874A (zh) 2015-04-01
TWI630052B (zh) 2018-07-21
JP2015062923A (ja) 2015-04-09
KR20150034075A (ko) 2015-04-02
CN104439696B (zh) 2017-09-22

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