KR102170534B1 - 점착제 조성물 및 그것을 이용한 점착 시트 - Google Patents

점착제 조성물 및 그것을 이용한 점착 시트 Download PDF

Info

Publication number
KR102170534B1
KR102170534B1 KR1020157032816A KR20157032816A KR102170534B1 KR 102170534 B1 KR102170534 B1 KR 102170534B1 KR 1020157032816 A KR1020157032816 A KR 1020157032816A KR 20157032816 A KR20157032816 A KR 20157032816A KR 102170534 B1 KR102170534 B1 KR 102170534B1
Authority
KR
South Korea
Prior art keywords
pressure
sensitive adhesive
epoxy
adhesive composition
mass
Prior art date
Application number
KR1020157032816A
Other languages
English (en)
Korean (ko)
Other versions
KR20160022298A (ko
Inventor
다카히사 다니구치
히로유키 이토
히로아키 우치다
유카 무라카미
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20160022298A publication Critical patent/KR20160022298A/ko
Application granted granted Critical
Publication of KR102170534B1 publication Critical patent/KR102170534B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020157032816A 2013-06-19 2014-05-26 점착제 조성물 및 그것을 이용한 점착 시트 KR102170534B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013128843 2013-06-19
JPJP-P-2013-128843 2013-06-19
JP2014103671A JP6429103B2 (ja) 2013-06-19 2014-05-19 粘着剤組成物およびそれを用いた粘着フィルム
JPJP-P-2014-103671 2014-05-19
PCT/JP2014/063885 WO2014203688A1 (ja) 2013-06-19 2014-05-26 粘着剤組成物およびそれを用いた粘着シート

Publications (2)

Publication Number Publication Date
KR20160022298A KR20160022298A (ko) 2016-02-29
KR102170534B1 true KR102170534B1 (ko) 2020-10-27

Family

ID=52104430

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157032816A KR102170534B1 (ko) 2013-06-19 2014-05-26 점착제 조성물 및 그것을 이용한 점착 시트

Country Status (4)

Country Link
JP (1) JP6429103B2 (ja)
KR (1) KR102170534B1 (ja)
CN (1) CN105102570B (ja)
WO (1) WO2014203688A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6182174B2 (ja) 2015-03-31 2017-08-16 日東電工株式会社 粘着剤組成物、粘着剤層、粘着剤層付偏光フィルム、及び画像表示装置
JP6536152B2 (ja) * 2015-04-24 2019-07-03 大日本印刷株式会社 樹脂封止部品の製造方法
CN108587502B (zh) * 2018-05-02 2019-09-03 广东硕成科技有限公司 一种半导体晶圆加工用胶带及其制备方法
WO2020137934A1 (ja) * 2018-12-28 2020-07-02 リンテック株式会社 フィルム状接着剤、積層シート、複合シート、及び積層体の製造方法
KR102224440B1 (ko) * 2019-01-29 2021-03-09 율촌화학 주식회사 플렉서블 디스플레이용 보호필름

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002520441A (ja) * 1998-07-10 2002-07-09 スリーエム イノベイティブ プロパティズ カンパニー 粘着付与された熱可塑性エポキシ感圧接着剤
JP5632695B2 (ja) * 2009-11-26 2014-11-26 日東電工株式会社 ダイシングフィルム付き接着フィルム、及び、該ダイシングフィルム付き接着フィルムを用いた半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04189884A (ja) * 1990-04-26 1992-07-08 Nippon Carbide Ind Co Inc 熱硬化型感圧接着性組成物及び熱硬化型感圧接着性シート
JP5008999B2 (ja) 2007-02-06 2012-08-22 リンテック株式会社 ダイシングテープおよび半導体装置の製造方法
JP5728804B2 (ja) * 2009-10-07 2015-06-03 デクセリアルズ株式会社 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板
CN102812066B (zh) * 2010-03-19 2014-08-06 积水化学工业株式会社 固化性组合物、切割和芯片接合带、连接结构体及带有粘合剂层的半导体芯片的制造方法
JP2012007012A (ja) 2010-06-22 2012-01-12 Nitto Denko Corp マスキングテープおよびその製造方法
KR101176957B1 (ko) * 2010-09-30 2012-09-07 주식회사 케이씨씨 반도체 패키지 제작용 접착제 조성물 및 접착시트
JP5955579B2 (ja) 2011-07-21 2016-07-20 日東電工株式会社 ガラスエッチング用保護シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002520441A (ja) * 1998-07-10 2002-07-09 スリーエム イノベイティブ プロパティズ カンパニー 粘着付与された熱可塑性エポキシ感圧接着剤
JP5632695B2 (ja) * 2009-11-26 2014-11-26 日東電工株式会社 ダイシングフィルム付き接着フィルム、及び、該ダイシングフィルム付き接着フィルムを用いた半導体装置の製造方法

Also Published As

Publication number Publication date
CN105102570A (zh) 2015-11-25
JP2015025118A (ja) 2015-02-05
KR20160022298A (ko) 2016-02-29
JP6429103B2 (ja) 2018-11-28
CN105102570B (zh) 2018-04-03
WO2014203688A1 (ja) 2014-12-24

Similar Documents

Publication Publication Date Title
JP6230730B2 (ja) 半導体加工用テープ
KR102170534B1 (ko) 점착제 조성물 및 그것을 이용한 점착 시트
JP5473262B2 (ja) 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
US20080242058A1 (en) Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
US20080124839A1 (en) Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
TWI699415B (zh) 熱硬化性接著組成物
JP5660443B2 (ja) 粘接着シートおよびそれを用いた接着方法
US20150371916A1 (en) Pre-applied underfill
CN110461973B (zh) 膜状粘合剂复合片及半导体装置的制造方法
KR102346224B1 (ko) 접착제 조성물, 접착 시트 및 반도체 장치의 제조 방법
US8247503B2 (en) Adhesive composition and adhesive sheet
CN107353837B (zh) 非导电性粘结膜用组合物及包含其的非导电性粘结膜
JP2014133823A (ja) 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
US20210139745A1 (en) Thermosetting sheet and dicing die bonding film
JP6960276B2 (ja) 樹脂シート、半導体装置、および樹脂シートの使用方法
KR102402235B1 (ko) 접착 필름, 다이싱·다이 본드 필름, 반도체 장치의 제조 방법 및 반도체 장치
JP5560746B2 (ja) 粘接着シート
JP5303326B2 (ja) 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法
CN113544229A (zh) 胶黏剂组合物、膜状胶黏剂、胶黏剂片及半导体装置的制造方法
JP5879675B2 (ja) 半導体用接着フィルム、半導体搭載用配線基板、半導体装置、および接着剤組成物
JP5513734B2 (ja) 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2019218452A (ja) 部品内蔵基板用熱硬化性接着シートおよび部品内蔵基板の製造方法
JP5540815B2 (ja) フレキシブルプリント基板、及び補強フレキシブルプリント基板
JP2017137453A (ja) 接着フィルム
TW201919873A (zh) 樹脂薄片、半導體裝置及樹脂薄片的使用方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant