KR102158024B1 - 절단 장치, 반도체 패키지의 부착 방법 및 전자 부품의 제조 방법 - Google Patents

절단 장치, 반도체 패키지의 부착 방법 및 전자 부품의 제조 방법 Download PDF

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KR102158024B1
KR102158024B1 KR1020180023364A KR20180023364A KR102158024B1 KR 102158024 B1 KR102158024 B1 KR 102158024B1 KR 1020180023364 A KR1020180023364 A KR 1020180023364A KR 20180023364 A KR20180023364 A KR 20180023364A KR 102158024 B1 KR102158024 B1 KR 102158024B1
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semiconductor package
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semiconductor
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KR20180111513A (ko
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모토키 후카이
칸지 이시바시
쇼이치 카타오카
이치로 이마이
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토와 가부시기가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/30—Halving devices, e.g. for halving buns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
KR1020180023364A 2017-03-31 2018-02-27 절단 장치, 반도체 패키지의 부착 방법 및 전자 부품의 제조 방법 KR102158024B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017070313A JP6640142B2 (ja) 2017-03-31 2017-03-31 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法
JPJP-P-2017-070313 2017-03-31

Publications (2)

Publication Number Publication Date
KR20180111513A KR20180111513A (ko) 2018-10-11
KR102158024B1 true KR102158024B1 (ko) 2020-09-21

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KR1020180023364A KR102158024B1 (ko) 2017-03-31 2018-02-27 절단 장치, 반도체 패키지의 부착 방법 및 전자 부품의 제조 방법

Country Status (4)

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JP (1) JP6640142B2 (ja)
KR (1) KR102158024B1 (ja)
CN (1) CN108695198B (ja)
TW (1) TWI660414B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7377092B2 (ja) * 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム
JP7496252B2 (ja) 2020-07-03 2024-06-06 リンテック株式会社 シート貼付装置およびシート貼付方法
JP2022083115A (ja) * 2020-11-24 2022-06-03 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
JP2022083106A (ja) * 2020-11-24 2022-06-03 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
KR102560434B1 (ko) * 2022-10-14 2023-07-27 주식회사 옵티멀이노베이션 모듈형 pcb 기판

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243762A (ja) 1999-02-17 2000-09-08 Hitachi Ltd 光半導体装置の製造方法およびそれに使用するペレットボンディング装置
JP2007281503A (ja) * 2007-06-01 2007-10-25 Renesas Technology Corp チップ移載装置、およびチップ移載方法
JP2010135574A (ja) * 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
JP2011106907A (ja) * 2009-11-16 2011-06-02 Nitto Denko Corp 検査装置および配線回路基板の検査方法
WO2011128982A1 (ja) * 2010-04-13 2011-10-20 パイオニア株式会社 部品移送装置及び方法
WO2012133760A1 (ja) 2011-03-30 2012-10-04 ボンドテック株式会社 電子部品実装方法、電子部品実装システムおよび基板
JP2015026789A (ja) 2013-07-29 2015-02-05 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
KR101590593B1 (ko) * 2015-12-03 2016-02-02 제너셈(주) 반도체패키지의 스퍼터링 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2770817B2 (ja) * 1996-06-19 1998-07-02 日本電気株式会社 チップマウント装置及び方法
JP6000902B2 (ja) * 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置
TWI544571B (zh) * 2014-02-20 2016-08-01 聯詠科技股份有限公司 可重複使用的晶片承載盤及晶片承載與挑揀系統
JP6355717B2 (ja) * 2014-03-24 2018-07-11 株式会社Ｆｕｊｉ ダイ実装システム及びダイ実装方法
JP6333648B2 (ja) 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置
JP6382133B2 (ja) * 2015-03-04 2018-08-29 Ｔｏｗａ株式会社 切断装置、搬送方法、搬送プログラム、および搬送プログラムを格納した記録媒体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243762A (ja) 1999-02-17 2000-09-08 Hitachi Ltd 光半導体装置の製造方法およびそれに使用するペレットボンディング装置
JP2007281503A (ja) * 2007-06-01 2007-10-25 Renesas Technology Corp チップ移載装置、およびチップ移載方法
JP2010135574A (ja) * 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
JP2011106907A (ja) * 2009-11-16 2011-06-02 Nitto Denko Corp 検査装置および配線回路基板の検査方法
WO2011128982A1 (ja) * 2010-04-13 2011-10-20 パイオニア株式会社 部品移送装置及び方法
WO2012133760A1 (ja) 2011-03-30 2012-10-04 ボンドテック株式会社 電子部品実装方法、電子部品実装システムおよび基板
JP2015026789A (ja) 2013-07-29 2015-02-05 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
KR101590593B1 (ko) * 2015-12-03 2016-02-02 제너셈(주) 반도체패키지의 스퍼터링 방법

Also Published As

Publication number Publication date
KR20180111513A (ko) 2018-10-11
TW201838006A (zh) 2018-10-16
TWI660414B (zh) 2019-05-21
CN108695198B (zh) 2022-03-08
JP6640142B2 (ja) 2020-02-05
JP2018174191A (ja) 2018-11-08
CN108695198A (zh) 2018-10-23

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