KR102154208B1 - Pressing Apparatus for manufacturing flexible printed circuit board and Method for manufacturing flexible printed circuit board using the same - Google Patents

Abstract

The present invention relates to a pressing device for manufacturing a flexible printed circuit board and a method for manufacturing a flexible printed circuit board using the same, wherein a flexible printed circuit board or antenna is manufactured in a roll-to-roll method, and a substrate and a cover having a circuit pattern on one surface thereof Flexible printed circuit board units including ray are hot-pressed by roll pressing or flat-plate pressing to stably manufacture flexible printed circuit boards or antennas in a roll-to-roll method to increase production efficiency, reduce manufacturing costs, and occur during manufacturing. It reduces the defective rate and increases the reliability of the product.

Description

Pressing Apparatus for manufacturing flexible printed circuit board and Method for manufacturing flexible printed circuit board using the same

The present invention relates to a flexible printed circuit board manufacturing, and more specifically, to a pressing device for manufacturing a flexible printed circuit board for applying a roll-to-roll process and a method for manufacturing a flexible printed circuit board using the same About.

As is well known, a flexible printed circuit board applied to an NFC antenna mounted on a mobile terminal such as a smart phone, etc., forms a predetermined circuit pattern by etching the metal foil laminated on the flexible substrate, attaching the coverlay, and pressing It is manufactured in the process of touching.

Such a conventional flexible printed circuit board is manufactured in a manner in which a substrate is cut to fit the length, and then a circuit pattern is individually formed on each substrate and processed.

The flexible circuit board is manufactured by forming a circuit pattern on a flexible substrate, and is manufactured by forming a copper foil and attaching a coverlay for protecting the circuit pattern to one surface of the substrate, followed by pressing.

The flexible circuit board is generally manufactured by cutting a base material to fit the length and then individually forming a circuit pattern on each base material and processing it.

However, the method of manufacturing the flexible circuit board by pre-cutting the substrate in this way is a cause of increasing manufacturing cost due to low production efficiency.

In addition, in the press process of bringing the coverlay to protect the circuit pattern on one side of the substrate, heat is applied to the substrate and the coverlay while pressing the upper and lower press portions in full contact. In this process, air bubbles are introduced between the coverlay and the substrate. A defect in which adhesion is lowered occurs, and the coverlay or the substrate is frequently attached to the upper and lower press parts due to the adhesive that attaches the coverlay and the substrate to the upper and lower press parts.

Korean Patent Publication No. 2006-0005142 (2006.01.17) "Flexible printed circuit board and its manufacturing method"

The present invention was conceived in consideration of the above points, and reduced manufacturing cost by stably manufacturing a flexible printed circuit board in a roll-to-roll process, and stably attaching a coverlay to one side of the substrate on which the circuit pattern was formed. An object of the present invention is to provide a pressing device for manufacturing a flexible printed circuit board, a method for manufacturing a flexible printed circuit board, and a method for manufacturing an antenna.

A pressing apparatus for manufacturing a flexible printed circuit board according to an embodiment of the present invention for achieving the above object includes upper and lower rolls for pressing a flexible printed circuit board unit having a substrate with a circuit pattern and a coverlay. A pressurized roll part; And a preheating unit disposed on the inlet side of the pressure roll unit to heat the flexible printed circuit board unit.

In the present invention, the upper and lower rolls may include heaters for heating upper and lower surfaces of the flexible printed circuit board unit.

In addition, the present invention may include a release paper supply unit for supplying release paper to the upper and lower surfaces of the flexible printed circuit board unit at the entrance side of the preheating unit.

In addition, the present invention may further include an auxiliary heating unit disposed between the pressing rolls and heating the flexible printed circuit board unit passing through the pressing rolls.

In addition, the present invention may further include a chamber accommodating the pressure roll unit.

In addition, the auxiliary heating unit may include a first heating block disposed to be spaced apart from an upper side of the flexible printed circuit board unit, and a second heating block disposed to be spaced apart from a lower side of the flexible printed circuit board unit.

According to another embodiment of the present invention, a pressing apparatus for manufacturing a flexible printed circuit board includes: upper and lower pressing units for pressing a flexible printed circuit board unit having a substrate having a circuit pattern and a coverlay; And a release paper disposed between the upper pressing part and the flexible printed circuit board unit and between the lower pressing part and the flexible printed circuit board unit, respectively.

Here, the upper pressing part and the lower pressing part may include heaters for heating upper and lower surfaces of the flexible printed circuit board unit.

In addition, the release paper may include a film member disposed on the upper and lower surfaces of the flexible printed circuit board unit; A cushion sheet member disposed on at least one of an upper portion of the upper film member and a lower portion of the lower film member; And a cushion protective paper disposed between the cushion sheet member and the upper pressing part or between the cushion sheet member and the lower pressing part.

Alternatively, the release paper may include a protective sheet member disposed above and below the flexible printed circuit board unit, and an embossed sheet member disposed between the protective sheet member and the flexible printed circuit board unit.

A method of manufacturing a flexible printed circuit board for achieving the object of the present invention comprises: forming a circuit pattern on one surface of a substrate; Forming a flexible printed circuit board unit by attaching a coverlay to one surface of the substrate; And disposing release papers on the upper and lower surfaces of the flexible printed circuit board unit, and hot pressing the flexible printed circuit board unit.

In addition, the present invention is a roll in which the step of forming the circuit pattern, forming the flexible printed circuit board unit, and hot pressing the flexible printed circuit board unit sequentially while transferring the substrate from roll to roll- A two-roll method can be applied.

In addition, the hot pressing of the flexible printed circuit board unit may be a roll pressing step of heating and pressing while passing the flexible printed circuit board unit through a plurality of pressing rolls including upper and lower rolls, and preferably the It may further include preheating the flexible printed circuit board unit before the roll pressing step.

The present invention has an effect of stably manufacturing a flexible printed circuit board or an antenna in a roll-to-roll method to increase production efficiency and reduce manufacturing cost.

The present invention has the effect of reducing a defect rate generated during manufacturing by firmly attaching a coverlay without defects when manufacturing a flexible circuit board or an antenna, and increasing product reliability.

1 to 6 are views schematically showing different embodiments of a pressing apparatus for manufacturing a flexible printed circuit board according to the present invention;
7 is a schematic process diagram of a method for manufacturing a flexible printed circuit board according to the present invention,
8 is an example of a method of manufacturing a flexible printed circuit board according to the present invention, a process diagram schematically showing a method of manufacturing an NFC antenna, and,
9 is a perspective view schematically illustrating a pressing process of an NFC antenna as an example of a method for manufacturing a flexible printed circuit board according to the present invention.

The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, a pressing device for manufacturing a flexible printed circuit board according to an embodiment of the present invention includes a pressure roll unit having upper and lower rolls 410 and 420 that pressurize while transferring the flexible printed circuit board unit 100. Includes 400.

Each of the upper and lower rolls 410 and 420 receives heat from a heating element to generate heat on an outer circumferential surface that presses the flexible printed circuit board unit 100 to heat and pressurize the flexible printed circuit board unit 100. It is desirable to do it. To this end, each of the upper and lower rolls 410 and 420 may have heaters therein.

In addition, the pressing roll unit 400 is disposed in a plurality of positions at a predetermined interval in the direction in which the flexible printed circuit board unit 100 is transported to form a press section, and pressurizes the flexible printed circuit board unit 100 several times. The substrate 110 and the coverlay 200 are firmly attached.

A preheating unit 510 for heating the flexible printed circuit board unit 100 is provided at the entrance side of the press section. The preheating unit 510 has an inner space in which the inlet side and the outlet side are open so that the flexible printed circuit board unit 100 passes, and a tunnel for heating the flexible printed circuit board unit 100 in the inner space An example would be an oven.

The preheating unit 510 is preheated before hot pressing the flexible printed circuit board unit 100 in the pressure roll unit 400 so that the substrate 110 and the coverlay 200 are more firmly attached and fixed. Make it possible.

In addition, the pressing device for manufacturing a flexible printed circuit board according to the present invention is provided at the inlet of the preheating unit 510 and the outlet side of the press section, respectively, and a transfer guide roll unit for guiding the transfer of the flexible printed circuit board unit 100 Includes 430.

As an example, the pressing apparatus for manufacturing a flexible printed circuit board according to the present invention is included in a roll-to-roll manufacturing line for manufacturing a flexible printed circuit board while transferring the substrate 110 from roll to roll.

That is, the flexible printed circuit board unit 100 is transferred to the substrate 110 wound on one side of the winding roll (not shown) by the transfer guide roll unit 430, and the circuit pattern 120 on one side of the substrate 110 ) Is formed, and after passing through the preheating unit 510 and the pressure roll unit 400 by the transfer guide roll unit 430 and being in contact with each other, it is wound on a winding roll (not shown) on the other side.

Meanwhile, it is preferable that the flexible printed circuit board unit 100 has release paper 300 disposed on its upper and lower surfaces to pass through the preheating unit 510 and the pressure roll unit 400.

The release paper 300 covers the upper and lower surfaces of the flexible printed circuit board unit 100 so that the adhesive that contacts the base material 110 and the coverlay 200 is applied to the upper and lower rolls 410 and 420 ) Is prevented, and the upper and lower surfaces of the flexible printed circuit board unit 100 are evenly pressed by the plurality of upper and lower rolls 410 and 420.

In the pressing apparatus for manufacturing a flexible printed circuit board according to the present invention, release paper 300 is supplied to the upper and lower surfaces of the flexible printed circuit board unit 100 from the entrance side of the preheating unit 510, respectively, and the press section And a release paper supply unit 440 for separating the release paper 300 from the upper and lower surfaces of the flexible printed circuit board unit 100 at the outlet side of the flexible printed circuit board unit 100.

The release paper supply unit 440 includes a release paper supply roll 441 disposed at the inlet side of the preheating unit 510 and a release paper collection roll 442 disposed at the outlet side of the press section.

The release paper supply unit 440 is disposed on the upper and lower rolls 410 and 420, respectively, between the upper roll 410 and the flexible printed circuit board unit 100, the lower roll 420 and the flexible printing Each release paper 300 is supplied between the circuit board units 100, and the release paper 300 is separated and removed from the upper and lower surfaces of the flexible printed circuit board unit 100.

Referring to FIG. 2, a pressing device for manufacturing a flexible printed circuit board according to another embodiment of the present invention includes the flexible printed circuit board unit disposed between the pressing roll parts 400 and passing through the pressing roll part 400 ( It is preferable to further include an auxiliary heating unit 530 for heating 100).

The auxiliary heating unit 530 is disposed between the plurality of press roll units 400, passes through one press roll unit 400, and passes through the next press roll unit 400, the flexible printed circuit board unit 100 ) To heat.

The auxiliary heating unit 530 includes a first heating block 531 spaced apart from the upper side of the flexible printed circuit board unit 100, and spaced apart from the lower side of the flexible printed circuit board unit 100. It includes a second heating block (532). Heat is radiated from the lower surface of the first heating block 531, and heat is radiated from the upper surface of the second heating block 532 to heat the upper and lower surfaces of the flexible printed circuit board unit 100, respectively. do.

The auxiliary heating unit 530 prevents heat loss of the flexible printed circuit board unit 100 between the pressing roll unit 400 so that the substrate 110 and the coverlay 200 are provided with a plurality of the pressing roll units. As it passes through (400), it makes it more reliably adhered to, so that it has a stronger adhesion in the final main dish.

Referring to FIG. 3, the pressing apparatus for manufacturing a flexible printed circuit board according to another embodiment of the present invention preferably further includes a chamber 520 accommodating the pressing roll unit 400.

The chamber 520 has a plurality of the pressure roll parts 400 disposed therein, and the pressure roll part 400 includes upper and lower rolls 410 and 420. The chamber 520 allows the flexible printed circuit board unit 100 to be heated and pressurized while passing through the plurality of press roll units 400 at a constant temperature.

Referring to FIG. 4, a pressing apparatus for manufacturing a flexible printed circuit board according to another embodiment of the present invention includes: a chamber 520 accommodating a plurality of the pressing roll units 400; And an auxiliary heating unit 530 disposed between the pressurizing roll units 400 to heat the flexible printed circuit board unit 100 passing through the pressurizing roll unit 400.

5 and 6, in the pressing apparatus for manufacturing a flexible printed circuit board according to another embodiment of the present invention, the flexible printed circuit board unit 100 is disposed therebetween, and the flexible printed circuit board unit 100 ) And includes an upper pressing portion 600 and a lower pressing portion 700 for pressing.

The lower surface of the upper pressing part 600 is formed in a plane, and the upper surface of the lower pressing part 700 is formed in a plane, and the upper and lower surfaces of the flexible printed circuit board unit 100 disposed therebetween To pressurize with even pressure.

The upper pressing part 600 and the lower pressing part 700 receive heat from a heating element to generate heat on a surface pressing the flexible printed circuit board unit 100 so that the flexible printed circuit board unit 100 ) Is preferably heated and pressurized. To this end, the upper pressing part 600 and the lower pressing part 700 each have a heater therein.

In addition, the pressing apparatus for manufacturing a flexible printed circuit board according to another embodiment of the present invention includes an elevating device 800 for moving one of the upper pressing unit 600 and the lower pressing unit 700 up and down. Include more. The elevating device 800 moves the upper pressing part 600 up and down while the flexible printed circuit board unit 100 is mounted on the upper surface of the lower pressing part 700 to The substrate unit 100 is heated and pressurized.

A release paper 300 is disposed between the upper pressing part 600 and the flexible printed circuit board unit 100, and between the lower pressing part 700 and the flexible printed circuit board unit 100, respectively.

The release paper 300 covers the upper and lower surfaces of the flexible printed circuit board unit 100 so that the adhesive that contacts the base material 110 and the coverlay 200 is applied to the lower part of the upper pressing part 600. Prevents from being buried on the surface or the upper surface of the lower pressing part 700, and the upper and lower surfaces of the flexible printed circuit board unit 100 are pressed evenly by the plurality of upper and lower rolls 410 and 420. Make it possible.

Referring to FIG. 5, the release paper 300 includes an upper film member 310, a lower film member 320, and the upper film member 310 disposed on the upper and lower surfaces of the flexible printed circuit board unit 100. ) A cushion sheet member 330 disposed on at least one side of an upper portion and a lower portion of the lower film member 320, between the cushion sheet member 330 and the upper pressing portion 600, or the cushion sheet member It includes a cushion protective sheet member 340 disposed between 330 and the lower pressing part 700.

As an example, the upper film member 310 and the lower film member 320 are made of PET film, the cushion sheet member 330 is made of PVC, and the cushion protection sheet member 340 is made of paper. Take as an example.

The cushion sheet member 330 is formed of a material having elasticity, so that when the flexible printed circuit board unit 100 is pressed by the upper pressing unit 600 and the lower pressing unit 700, the substrate 110 and the The coverlay 200 is completely in close contact. In addition, the cushion protection sheet member 340 is disposed between the cushion seat member 330 and the upper pressing part 600, and between the cushion seat member 330 and the lower pressing part 700, respectively. An accident in which the cushion seat member 330 is deformed or pressed by heat generated from the upper pressing part 600 and the lower pressing part 700 is prevented.

That is, the flexible printed circuit board unit 100 is provided so that the circuit pattern 120 protrudes from one surface of the substrate 110.

Therefore, when attaching the coverlay 200 to one surface of the substrate 110 by pressing and heating, air remains between the substrate 110 and the coverlay 200 by the circuit pattern 120. In this case, the adhesion between the substrate 110 and the coverlay 200 may be lowered, and a defect may occur in which the coverlay 200 is peeled off during use.

The cushion seat member 330 heats and presses the substrate 110 and the coverlay 200 on which the circuit pattern 120 protrudes on one surface with the upper pressing part 600 and the lower pressing part 700 Thus, when the flexible printed circuit board unit 100 is elastically supported, the substrate 110 and the coverlay 200 are in close contact with each other regardless of the circuit pattern 120 so as to be in full contact.

Referring to FIG. 6, the release paper 300 includes a protective sheet member 350 disposed above and below the flexible printed circuit board unit 100, the protective sheet member 350, and the flexible printed circuit board unit. It includes an embossed sheet member 360 disposed between the.

The embossing sheet member 360 has an embossing formed on its surface, and is disposed on the upper surface of the flexible printed circuit board unit 100 so that the substrate 110 and the coverlay 200 are completely in close contact with each other, and a main contact process Prevents air from being inserted between the substrate 110 and the coverlay 200 at.

That is, the embossing sheet member 360 is the flexible printed circuit board unit 100 with a plurality of embossing protrusions having a cushion when the flexible printed circuit board unit 100 is pressed by the upper pressing part 600 and the lower pressing part 700. The substrate 110 and the coverlay 200 are completely in close contact with each other by pressing the circuit board unit 100, and the substrate 110 is formed by the circuit pattern 120 protruding from one surface of the substrate 110. It prevents air from being inserted between the and the coverlay 200. In addition, the cushion protection sheet member 340 is disposed between the cushion seat member 330 and the upper pressing part 600, and between the cushion seat member 330 and the lower pressing part 700, respectively. An accident in which the cushion seat member 330 is deformed or pressed by heat generated from the upper pressing part 600 and the lower pressing part 700 is prevented.

The protective sheet member 350 covers the upper and lower surfaces of the flexible printed circuit board unit 100 so that the adhesive that contacts the substrate 110 and the coverlay 200 is applied to the upper pressing part 600. It is prevented from being buried on the lower surface or the upper surface of the lower pressing part 700.

In addition, the protective sheet member 350 is disposed between the embossing sheet member 360 and the upper pressing part 600, and between the embossing sheet member 360 and the lower pressing part 700, respectively. An accident in which the embossing sheet member 360 is deformed or pressed by heat generated from the upper pressing part 600 and the lower pressing part 700 is prevented.

Meanwhile, FIG. 7 is a process diagram illustrating a method of manufacturing a flexible printed circuit board according to the present invention. Referring to FIG. 7, the method of manufacturing a flexible printed circuit board according to the present invention includes the steps of forming a circuit pattern 120 on one surface of a substrate 110 (S100), and a coverlay 200 on one surface of the substrate 110. ) Forming a flexible printed circuit board unit 100 (S110), and a release paper 300 is disposed on the upper and lower surfaces of the flexible printed circuit board unit 100, and the flexible printed circuit board unit ( It includes a step (S130) of hot pressing 100).

In the hot-pressing step (S130), release paper 300 is disposed on the upper and lower surfaces of the flexible printed circuit board unit 100, and heated while pressing the upper and lower surfaces, and the substrate 110 and the coverlay ( 200).

The method of manufacturing a flexible printed circuit board according to the present invention includes the steps of forming the circuit pattern 120 while transferring the substrate 110 from roll to roll (S100), forming the flexible printed circuit board unit 100 (S110), it is preferable that the step of hot pressing the flexible printed circuit board unit 100 (S130) is performed sequentially. That is, in the method of manufacturing a flexible printed circuit board according to the present invention, the substrate 110 wound on one side of the winding roll is transferred to a plurality of transfer guide roll units 430 spaced apart from each other to form the circuit pattern 120. Step (S100), the step of forming the flexible printed circuit board unit 100 (S110), the step of hot pressing the flexible printed circuit board unit 100 (S130) are sequentially performed, and then another winding roll on the other side It improves productivity and reduces manufacturing cost by manufacturing flexible printed circuit boards in a roll-to-roll method that is wound around.

The step of forming the circuit pattern 120 (S100) may include patterning the circuit pattern 120 by punching out the metal foil laminated on the transfer film; And transferring the circuit pattern 120 of the transfer film to the substrate 110, wherein the transfer step removes metal foil other than the circuit pattern 120 patterned from the transfer film to form a circuit pattern. After shaping 120, the circuit pattern 120 is transferred to the substrate 110 as an example.

In addition, in the step of forming the circuit pattern 120 (S100), the circuit pattern 120 may be printed and sintered with a conductive paste on one surface of the substrate 110.

In the step (S110) of forming the flexible printed circuit board unit 100, an adhesive is applied between the substrate 110 and the coverlay 200, and the substrate 110 and the coverlay 200 are used with the adhesive. Is to attach. As an example, the adhesive is a thermosetting adhesive.

The step of hot-pressing the flexible printed circuit board unit 100 (S130) is a roll pressing of heating and pressing while passing the flexible printed circuit board unit 100 with a plurality of pressing roll parts 400 including upper and lower rolls. It is preferably a step.

It is preferable that the method for manufacturing a flexible printed circuit board according to the present invention further includes a step (S120) of preheating the flexible printed circuit board unit 100 before the roll pressing step. That is, the flexible printed circuit board unit 100 is heated and pressurized while passing through the plurality of press roll units 400 after being preheated by the preheating unit 510 before passing through the plurality of press roll units 400, The substrate 110 and the coverlay 200 are more firmly attached and fixed.

The roll pressing step includes heating the flexible printed circuit board unit 100 between the plurality of pressure roll parts 400, and the flexible printed circuit board unit 100 applies the plurality of pressure roll parts 400 to each other. By preventing heat loss between the pressurizing roll unit 400 when passing through, the substrate 110 and the coverlay 200 can more reliably adhere while passing through the plurality of pressurizing roll units 400. It makes it more firmly attached to the final body.

In the roll pressing step, it is preferable to hot-press the flexible printed circuit board unit 100 in the chamber 520 in which the plurality of pressing roll parts 400 are disposed therein. In the roll pressing step, while the flexible printed circuit board unit 100 is transferred in the chamber 520, the plurality of pressure rolls 400 are passed at a constant temperature to pass through the substrate 110 and the coverlay 200. ) Is more firmly attached and more firmly attached.

In the roll pressing step, the flexible printed circuit board unit 100 is hot-pressed with the plurality of pressing rolls 400 to stably manufacture the flexible printed circuit board in a roll-to-roll method, thereby increasing production efficiency and reducing manufacturing cost. And, by firmly attaching the coverlay 200 without defects, the defect rate generated during manufacturing is reduced and the reliability of the product is increased.

Meanwhile, in the step of hot pressing the flexible printed circuit board unit 100 (S130), the flexible printed circuit board unit 100 is disposed between the upper pressing unit 600 and the lower pressing unit 700, An example is a flat-plate pressing step of hot pressing the flexible printed circuit board unit 100 by moving at least one side of the upper pressing part 600 and the lower pressing part 700 up and down.

The flat plate pressing step includes disposing an upper film member 310 and a lower film member 320 on the upper and lower surfaces of the flexible printed circuit board unit 100 with the release paper 300, and the upper film member 310 ) A cushion sheet member 330 is disposed on at least one of the upper portion and the lower portion of the lower film member 320, and between the cushion seat member 330 and the upper pressing portion 600 or the cushion sheet It is preferable to arrange a cushion protection sheet member 340 between the member 330 and the lower pressing part 700.

On the other hand, Figure 8 is an example of a method for manufacturing a flexible printed circuit board according to the present invention, a process diagram for a method of manufacturing an NFC antenna. Referring to this, the antenna manufacturing method according to the present invention, the step of forming an antenna pattern on one surface of the first substrate (S200),

Preparing a terminal unit having a second substrate and a terminal pattern, and temporarily contacting the terminal unit to the first substrate so that the end of the antenna pattern and the end of the terminal pattern are electrically connected (S210);

Forming an antenna unit by attaching a coverlay 200 to one surface of the first substrate (S220); And

A release paper 300 is disposed on the upper and lower surfaces of the antenna unit, and the first substrate is hot-pressed with the plurality of pressure rolls 400 to see the coverlay 200 and the terminal unit on the first substrate. It includes a roll pressing step (S240) in contact.

The antenna manufacturing method according to the present invention includes the steps of forming the antenna pattern (S200) while transferring the first base material from roll to roll (S200), the step of attaching the terminal unit to the first base material (S210), and the antenna unit It is preferable that the forming step (S220) and the roll pressing step (S240) are sequentially performed. That is, the step of forming the antenna pattern while the first base material wound on one side of the winding roll is transferred to the plurality of transfer guide roll units 430 spaced apart from each other (S200), and temporarily contacting the terminal unit with the first base material. After the step (S210), the step of forming the antenna unit (S220), and the roll pressing step (S240) are sequentially performed, an antenna is manufactured in a roll-to-roll method wound on another winding roll on the other side to improve productivity, Reduce manufacturing cost.

The first base material is a very thin and transparent insulating film provided to maintain the shape of the antenna pattern. For example, it may be one of a PI film and a PET film, and a PET film having a relatively inexpensive price is used. This is an example. The PI film is thin and flexible, has excellent heat resistance and curvature resistance, has few dimensional changes, and is strong against heat, so it is suitable as an insulating film when transferring punched metal foil using heat, and PET film is relatively cheaper than the PI film. It has an inexpensive advantage.

As an example, the second substrate is one of a PI film and a PET film.

The antenna manufacturing method according to the present invention includes the steps of attaching a ferrite sheet to the other surface of the roll-pressed first substrate and cutting the antenna unit (S250); Flat pressing step (S260) of hot pressing by placing the cut antenna unit between the upper press portion and the lower press portion; After the flat pressing step (S260), the antenna unit is punched into a finally designed antenna shape to form an antenna (S270).

It is preferable that the antenna manufacturing method according to the present invention further includes a step (S230) of preheating the antenna unit before the roll pressing step (S240). That is, the antenna unit is heated and pressurized while passing through the plurality of press roll units 400 after being preheated by the preheating unit 510 before passing through the plurality of press roll units 400, so that the substrate and the coverlay 200 is more firmly attached and fixed.

On the other hand, referring to FIG. 9, the step of forming the antenna pattern 20 (S200) is an NFC antenna pattern by forming the antenna pattern 20 to have a loop shape wound several times, and manufacturing the antenna according to the present invention As an example, the method is to manufacture an NFC antenna.

In the forming of the antenna pattern 20 (S200), an antenna pattern is formed by transferring the first base material 10 through the transfer guide roll unit 430 by roll-to-roll, and the terminal is exposed to the first base material 10. A hole 11 is formed.

In the forming of the antenna pattern 20 (S200), patterning the antenna pattern 20 by punching out the metal foil laminated on the transfer film, the antenna pattern 20 of the transfer film as the first base material It includes the step of transferring to (10).

In the transferring step, the antenna pattern 20 is formed by removing metal foil other than the patterned antenna pattern 20 from the transfer film, and then transferring the antenna pattern 20 to the first substrate 10. This is an example.

The step of transferring the antenna pattern 20 to the first substrate 10 includes an adhesive layer provided on one surface of the first substrate 10 or the surface of the antenna pattern 20 to be laminated to the transfer film. The antenna pattern 20 is transferred to one surface of the first substrate 10. The adhesive layer provided on the first substrate 10 is formed of an adhesive having stronger adhesive strength than the adhesive layer to which the metal foil is adhered in the transfer film, and the antenna pattern 20 is maintained in a state adhered to the transfer film. This makes it possible to smoothly transfer to the first substrate 10.

That is, in the transferring step, after removing the metal foil other than the antenna pattern 20 from the transfer film, forming an adhesive layer on one surface of the first substrate 10, one surface of the transfer film and the first As an example, the antenna pattern 20 is transferred to the first substrate 10 by arranging one surface of the first substrate 10 so as to be overlapped and thermally compressed. The transfer film is separated from the first substrate 10 after thermocompression.

In addition, the metal foil other than the antenna pattern 20 in the transfer film is removed from the transfer film while pressing the antenna pattern 20 with a jig capable of pressing part or all of the antenna pattern 20. It is desirable. This is to prevent a part of the antenna pattern 20 from being also removed when removing the metal foil other than the antenna pattern 20 from the transfer film. That is, the transferring step is to remove a portion (scrap) excluding the antenna pattern 20 from the transfer film while pressing part or all of the antenna pattern 20 using a jig.

In addition, in the transferring step, after forming an adhesive layer on one surface of the first substrate 10, one surface of the transfer film and one surface of the first substrate 10 are disposed to overlap each other, and the antenna pattern 20 And a process of compressing by applying heat to only the formed portion, and a process of separating the transfer film from the first substrate 10 to remove the metal foil except the transfer film and the antenna pattern 20. In this case, as an example, the adhesive layer is formed of a thermosetting adhesive.

That is, the first substrate 10 is adhered to one surface of the transfer film, and only the portion where the antenna pattern 20 is formed is pressed by applying heat to only the antenna pattern 20 to the first substrate 10. Let it be transferred. When the transfer film is separated while only the antenna pattern 20 is transferred to the first substrate 10, a portion of the metal foil other than the antenna pattern 20 is separated and removed together with the transfer film.

In the transferring step, portions other than the antenna pattern 20 are removed from the transfer film and the metal foil together. Accordingly, the working time is greatly shortened, and a defect in which the position of the antenna pattern 20 is displaced during the transfer operation is also prevented.

In the transferring step, the antenna pattern 20 may be separated from the transfer film and transferred to the first substrate 10.

The transferring step includes vacuum adsorption and separation of the antenna pattern 20 from the transfer film with a mold provided with a vacuum adsorption pattern corresponding to the shape of the antenna pattern 20, and the separated antenna pattern 20 ) Is transferred directly to one surface of the first substrate 10 as an example.

In more detail, after placing a vacuum adsorption pattern in the mold to correspond to the antenna pattern 20, the antenna pattern 20 is adsorbed with the vacuum adsorption pattern, so that the transfer film and the antenna pattern ( After separating and removing portions other than 20) at a time, the antenna pattern 20 is directly transferred to one surface of the first substrate 10. In this case, automation is possible and the work time is reduced.

As the metal foil, any one of aluminum foil, Cu foil, and silver foil is used.

It is preferable that the metal foil is an aluminum foil (AL foil). The aluminum foil can be directly used as the antenna pattern 20 by using a thickness of 9 ~ 40㎛. That is, in the present invention, it is easy to adjust the thickness of the antenna pattern 20 by adjusting the thickness of the aluminum foil. Aluminum has a high thermal conductivity compared to copper and has a low resistance, so it can be used as the antenna pattern 20 without an additional plating process with a thin thickness of 9 to 40 μm.

In contrast, in the case of a copper pattern, a pattern thickness of 20 μm should be secured through plating after etching, mainly Sn plating. This is to minimize heat generation and power consumption.

In the forming of the antenna pattern 20 (S200), the metal foil laminated on one surface of the first substrate 10 may be etched to form the antenna pattern 20.

In the step of forming the antenna pattern 20 (S200 ), the antenna pattern 20 may be printed on one surface of the first substrate 10 with a conductive paste and sintered to form the antenna pattern 20. As the conductive paste, any one of silver (Ag) paste, copper (Cu) paste, and aluminum (Al) paste is used, and silver paste is preferably used. The first substrate 10 is sintered between 250 and 400°C using PI.

In the forming of the antenna pattern 20 (S200), a conductive paste is printed on one surface of the first substrate 10 in the shape of the antenna pattern 20 and dried, and the surface of the dried conductive paste is plated to provide an antenna. The pattern 20 can be formed.

In addition, the step of forming the antenna pattern 20 (S200) is a process of attaching a reinforcing film (not shown) to the other surface of the first substrate 10 on which metal foil is laminated before forming the antenna pattern 20 It is preferable to include. The reinforcing film is separated from and removed from the first substrate 10 after the antenna pattern 20 is formed, and prevents deformation of the first substrate 10 while the antenna pattern 20 is formed.

When the antenna pattern 20 is formed by etching the metal foil laminated to the first substrate 10, the first substrate 10 may be deformed, and the reinforcing film may be applied to the first substrate 10 during the etching process. ) Can be prevented from being deformed.

In addition, in the step of forming the antenna pattern 20 (S200), a step compensation pattern 21 for compensating for a step difference due to the antenna pattern 20 on the first substrate 10 is applied to the antenna pattern 20. It is preferable to form together with. The step compensation pattern 21 is punched in the shape and size of a corresponding mounting surface on which the antenna according to the present invention is mounted, and is mounted on the mounting surface. When the size of the mounting surface is larger than the size of the antenna pattern 20, a step due to the thickness of the antenna pattern 20 is generated in the shape of the punched antenna except for the antenna pattern 20, resulting in a decrease in aesthetics after installation. In addition, when other parts are mounted on the antenna, the mounting is unstable due to a step by the antenna pattern 20 and the aesthetic is deteriorated, which causes a decrease in the product's marketability.

Accordingly, when the mounting surface on which the antenna is mounted is larger than the shape of the antenna pattern 20 by a predetermined size or more, the step compensation pattern 21 is used as the first base 10 to compensate for the step difference caused by the antenna pattern 20. It is preferable to form together with the antenna pattern 20 on one side of ).

In order to easily form the step compensation pattern 21 with the same thickness as the antenna pattern 20, it is preferable to form the metal foil or metal paste forming the antenna pattern 20 through the same process.

In the step 200 of attaching the terminal unit 2 to one surface of the first substrate 10, an end of the terminal pattern 30a is electrically connected to both ends of the antenna pattern 20, respectively. will be.

The second substrate 30 is a separate sheet from the first substrate 10, the antenna terminal portion 31 is disposed, and a terminal hole exposing a portion of the antenna terminal portion 31 is formed.

The second base material 30 exposes both sides of the sheet through the terminal hole so that the antenna terminal portion 31 can be freely selected in a connection direction with another terminal. The terminal unit 2 is a process of forming the antenna terminal portion 31 and the terminal connection portion 32 on one surface of the second substrate 30, plating the antenna terminal portion 31, and the plated antenna terminal portion It is manufactured including a process of attaching a part of 31 and a terminal cover sheet 33 covering a part of the terminal connection part 32. In addition, as an example, the second substrate 30 is a PI film. As an example, the antenna terminal part 31 and the terminal connection part 32 are formed by etching on one surface of the second base material 30. In the plating process, it is preferable to significantly increase the hardness and wear resistance of the antenna terminal portion 31 by tin plating the antenna terminal portion 31.

The terminal cover sheet 33 covers a portion of the antenna terminal portion 31 excluding a portion connected to another terminal and a portion excluding an end portion of the terminal connection portion 32 connected to the antenna pattern 20 to cover the antenna terminal portion. (31) and protect the terminal connection (32). A terminal connection hole is formed in the terminal cover sheet 33 to expose a portion of the antenna terminal portion 31 connected to another terminal.

As a comparative example, in order to form the antenna terminal part 31 on the first base material 10 on which the antenna pattern 20 of the antenna pattern 20 is wound several times, and connect it to both ends of the antenna pattern 20, the terminal connection part 32 At least one of them should be formed on the other surface of the first substrate 10, and a via hole is formed in the first substrate 10 to connect the terminal connection part 32 and the antenna pattern 20 to each other.

In addition, when the antenna terminal part 31 is integrally formed on the first base material 10 on which the antenna pattern 20 is formed, the first base material 10 is applied to the first base material 10 during the plating process to reinforce the rigidity of the antenna terminal part 31. Since the adhesion of the attached antenna pattern 20 is lowered, a defect in which a part of the antenna pattern 20 is separated from the first substrate 10 frequently occurs.

In the present invention, as described above, the antenna terminal portion 31 is not formed directly on the first substrate 10 on which the antenna pattern 20 is formed, but is formed on a separate second substrate 30, and the second substrate By attaching (30) to the first substrate 10, the manufacturing process can be simplified and the defect rate of the product can be reduced.

On the other hand, in the step 200 of attaching the terminal unit 2 to the first substrate 10, the connection hole 41 is located at a position corresponding to the end of the antenna pattern 20 and the end of the terminal pattern 30a. A step (S210) of temporarily contacting the terminal unit 2 to the first base material 10 using a bonding member 40 formed therein; And a connecting step of electrically connecting an end of the antenna pattern 20 and an end of the terminal pattern 30a.

The bonding member 40 includes the first base material 10 and the second base material so that the connection hole 41 matches any one of the end of the antenna pattern 20 and the end of the terminal pattern 30a. 30), the terminal unit (2) on the first base material (10) so as to coincide with one of the end of the antenna pattern 20 and the end of the terminal pattern 30a on the other side. Temporarily connect.

In the connecting step, when the terminal unit 2 is attached to the first substrate 10, the end of the antenna pattern 20 and the end of the terminal pattern 30a are electrically connected.

The bonding member 40 is attached to a position preventing contact between the antenna pattern 20 and the terminal connection part 32, and is formed at a portion of both end sides of the antenna pattern 20 or at the end side of the terminal pattern 30a. Connection holes 41 each exposing a portion are formed. The bonding member 40 is provided with an adhesive layer on both sides of each side so that one side is attached to the first substrate 10 and the second substrate 30 is attached to the other side.

The bonding member 40 is capable of double-sided adhesion, and is stored with release paper 300 attached to both sides thereof, and is used by removing the release paper 300 respectively when using.

In order for the antenna terminal part 31 of the second base material 30 to be located outside or inside the antenna pattern 20, at least one of the two terminal connection parts 32 is wound several times in a loop shape. ) Are placed across. At this time, the bonding member 40 is disposed between the antenna pattern 20 and the terminal pattern 30a to prevent the terminal connection part 32 from being in double contact with the antenna pattern 20.

That is, the terminal pattern 30a is connected only to the end of the antenna pattern 20 exposed by the connection hole 41.

The connecting step may include applying an anisotropic conductive paste 3 to the connection hole 41 of the bonding member 40 and thermocompression bonding.

In addition, the connecting step may include attaching the anisotropic conductive film 3 to the connection hole 41 of the bonding member 40 and thermocompression bonding.

In the connecting step, heat and pressure are applied within elastic deformation to the ends of the antenna patterns 20 and the ends of the terminal patterns 30a facing each other by the connection holes 41 of the bonding member 40 to remove the ends. It may be a diffusion bonding method of bonding.

In the connection step, the current and pressing force are concentrated at the ends of the antenna patterns 20 and the ends of the terminal patterns 30a facing each other by the connection holes 41 of the bonding member 40 to locally heat and It may be a spot welding method in which the ends are joined by simultaneously applying pressure.

After the connecting step, forming an antenna unit (1) by attaching a coverlay (200) to one surface of the first substrate (S220); And a release paper 300 disposed on the upper and lower surfaces of the antenna unit 1, and hot pressing the first base material 10 with a plurality of the pressure roll parts 400 to provide the coverlay 200 and the terminal unit. (2) The roll pressing step (S240) in contact with the first substrate 10 is performed through a roll-to-roll process, and subsequent steps are omitted for redundant description as described above.

The antenna manufacturing method according to the present invention increases production efficiency by stably manufacturing in a roll-to-roll method, reduces manufacturing cost, and reduces the defect rate generated during manufacturing by firmly attaching the coverlay 200 without defects when manufacturing the antenna, Increase product reliability.

It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention, which is included in the configuration of the present invention.

100: flexible printed circuit board unit 110: substrate
120: circuit pattern 200: coverlay
300: release paper 310: upper film member
320: lower film member 330: cushion seat member
340: cushion protective sheet member 350: protective sheet member
360: embossing sheet member 400: pressure roll portion
410: upper roll 420: lower roll
430: transfer guide roll unit 440: release paper supply unit
441: release paper supply roll 442: release paper collection roll
510: preheating unit 520: chamber
530: auxiliary heating unit 531: first heating block
532: second heating block 600: upper pressing part
700: lower pressing part 800: elevating device

Claims (16)

A plurality of pressing roll units having upper and lower rolls for pressing a flexible printed circuit board unit having a substrate with a circuit pattern and a coverlay; And
Includes; a preheating unit disposed on the inlet side of the pressure roll unit to heat the flexible printed circuit board unit,
Further comprising a release paper supply unit for supplying release paper to the upper and lower surfaces of the flexible printed circuit board unit at the entrance side of the preheating unit,
The release paper supply unit is disposed on the upper and lower surfaces of the flexible printed circuit board unit so that the flexible printed circuit board unit and the release paper pass through the preheating unit and the pressure roll unit, Pressing apparatus for manufacturing a flexible printed circuit board, characterized in that supplying a release paper to the lower surface. The method of claim 1,
The pressing apparatus for manufacturing a flexible printed circuit board, wherein the upper and lower rolls have heaters for heating the upper and lower surfaces of the flexible printed circuit board unit. delete The method of claim 1,
A pressing apparatus for manufacturing a flexible printed circuit board, further comprising an auxiliary heating unit disposed between the pressing roll units and heating the flexible printed circuit board unit passing through the pressing roll unit. The method of claim 1,
A pressing apparatus for manufacturing a flexible printed circuit board, further comprising: a chamber accommodating a plurality of the pressing rolls. The method of claim 1,
A chamber accommodating a plurality of the pressure rolls; And
A pressing apparatus for manufacturing a flexible printed circuit board, further comprising an auxiliary heating unit disposed between the pressing roll units and heating the flexible printed circuit board unit passing through the pressing roll unit. The method according to claim 4 or 6,
The auxiliary heating unit comprises a first heating block spaced apart from the upper side of the flexible printed circuit board unit, and a second heating block spaced apart from the lower side of the flexible printed circuit board unit. Pressing device for manufacturing substrates. delete delete delete The method of claim 1,
The release paper includes a protective sheet member disposed above and below the flexible printed circuit board unit, and an embossed sheet member disposed between the protective sheet member and the flexible printed circuit board unit. Pressing device for manufacturing. Forming a circuit pattern on one surface of the substrate;
Forming a flexible printed circuit board unit by attaching a coverlay to one surface of the substrate; And
Disposing release papers on the upper and lower surfaces of the flexible printed circuit board unit, and hot pressing the flexible printed circuit board unit,
Hot pressing the flexible printed circuit board unit,
It is a roll pressing step of heating and pressing while passing the flexible printed circuit board unit through a plurality of pressing rolls including upper and lower rolls,
In the roll pressing step, the release paper covers the upper and lower surfaces of the flexible printed circuit board unit, and the flexible printed circuit board unit and the release paper pass through a plurality of the pressing rolls. Way. The method of claim 12,
A roll-to-roll method in which the step of forming the circuit pattern, forming the flexible printed circuit board unit, and hot pressing the flexible printed circuit board unit are sequentially performed while transferring the substrate from roll to roll. Flexible printed circuit board manufacturing method, characterized in that to apply. delete The method of claim 12,
The method of manufacturing a flexible printed circuit board, further comprising preheating the flexible printed circuit board unit before the roll pressing step. The method according to any one of claims 12, 13 and 15,
The circuit pattern is a method of manufacturing a flexible printed circuit board, characterized in that the NFC antenna pattern.

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