KR102134212B1 - 임프린트 장치, 임프린트 방법 및 물품 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 물품 제조 방법 Download PDF

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Publication number
KR102134212B1
KR102134212B1 KR1020187026955A KR20187026955A KR102134212B1 KR 102134212 B1 KR102134212 B1 KR 102134212B1 KR 1020187026955 A KR1020187026955 A KR 1020187026955A KR 20187026955 A KR20187026955 A KR 20187026955A KR 102134212 B1 KR102134212 B1 KR 102134212B1
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South Korea
Prior art keywords
substrate
mold
peripheral member
imprint
voltage
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English (en)
Korean (ko)
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KR20180118684A (ko
Inventor
마사미 요네카와
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캐논 가부시끼가이샤
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Priority claimed from PCT/JP2017/002097 external-priority patent/WO2017149992A1/ja
Publication of KR20180118684A publication Critical patent/KR20180118684A/ko
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Publication of KR102134212B1 publication Critical patent/KR102134212B1/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H01L21/0274—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020187026955A 2016-02-29 2017-01-23 임프린트 장치, 임프린트 방법 및 물품 제조 방법 Active KR102134212B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2016037999 2016-02-29
JPJP-P-2016-037999 2016-02-29
JPJP-P-2016-223348 2016-11-16
JP2016223348A JP6789772B2 (ja) 2016-02-29 2016-11-16 インプリント装置、インプリント方法および物品製造方法
PCT/JP2017/002097 WO2017149992A1 (ja) 2016-02-29 2017-01-23 インプリント装置、インプリント方法および物品製造方法

Publications (2)

Publication Number Publication Date
KR20180118684A KR20180118684A (ko) 2018-10-31
KR102134212B1 true KR102134212B1 (ko) 2020-07-15

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KR1020187026955A Active KR102134212B1 (ko) 2016-02-29 2017-01-23 임프린트 장치, 임프린트 방법 및 물품 제조 방법

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JP (1) JP6789772B2 (https=)
KR (1) KR102134212B1 (https=)
TW (1) TWI632595B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6802691B2 (ja) * 2016-11-18 2020-12-16 キヤノン株式会社 インプリント装置および物品製造方法
JP7495814B2 (ja) * 2020-05-13 2024-06-05 キヤノン株式会社 インプリント装置、および物品の製造方法
KR102542639B1 (ko) * 2021-02-10 2023-06-12 성균관대학교산학협력단 미세 패턴 형성 장치 및 방법
KR102528880B1 (ko) * 2021-02-16 2023-05-03 성균관대학교산학협력단 전기수력학 불안정성을 이용한 패턴제작기술의 미세 구조체 사이의 2차 간섭효과에 의한 초미세구조체 제작 및 초소수성표면 형성방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088369A (ja) 2007-10-02 2009-04-23 Nippon Telegr & Teleph Corp <Ntt> インプリント方法およびそのような方法で作製されたモールド部材
JP2011040464A (ja) * 2009-08-07 2011-02-24 Canon Inc 異物除去装置、露光装置及びデバイス製造方法
JP2014175340A (ja) 2013-03-06 2014-09-22 Dainippon Printing Co Ltd インプリント方法、インプリント用のモールドおよびインプリント装置
JP2015122373A (ja) * 2013-12-20 2015-07-02 キヤノン株式会社 インプリント装置、異物除去方法及び物品の製造方法
JP2015149390A (ja) * 2014-02-06 2015-08-20 キヤノン株式会社 インプリント装置、型、および物品の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002069634A (ja) * 2000-08-29 2002-03-08 Canon Inc 薄膜作製方法および薄膜作製装置
JP2008258490A (ja) * 2007-04-06 2008-10-23 Canon Inc 露光装置及び原版
JP6139434B2 (ja) * 2013-12-13 2017-05-31 株式会社東芝 インプリント方法
JP6399839B2 (ja) * 2014-07-15 2018-10-03 キヤノン株式会社 インプリント装置、および物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009088369A (ja) 2007-10-02 2009-04-23 Nippon Telegr & Teleph Corp <Ntt> インプリント方法およびそのような方法で作製されたモールド部材
JP2011040464A (ja) * 2009-08-07 2011-02-24 Canon Inc 異物除去装置、露光装置及びデバイス製造方法
JP2014175340A (ja) 2013-03-06 2014-09-22 Dainippon Printing Co Ltd インプリント方法、インプリント用のモールドおよびインプリント装置
JP2015122373A (ja) * 2013-12-20 2015-07-02 キヤノン株式会社 インプリント装置、異物除去方法及び物品の製造方法
JP2015149390A (ja) * 2014-02-06 2015-08-20 キヤノン株式会社 インプリント装置、型、および物品の製造方法

Also Published As

Publication number Publication date
JP6789772B2 (ja) 2020-11-25
KR20180118684A (ko) 2018-10-31
TWI632595B (zh) 2018-08-11
JP2017157821A (ja) 2017-09-07
TW201732881A (zh) 2017-09-16

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