KR102131747B1 - 세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led - Google Patents

세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led Download PDF

Info

Publication number
KR102131747B1
KR102131747B1 KR1020157004248A KR20157004248A KR102131747B1 KR 102131747 B1 KR102131747 B1 KR 102131747B1 KR 1020157004248 A KR1020157004248 A KR 1020157004248A KR 20157004248 A KR20157004248 A KR 20157004248A KR 102131747 B1 KR102131747 B1 KR 102131747B1
Authority
KR
South Korea
Prior art keywords
layer
converter
red
light emitting
material layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157004248A
Other languages
English (en)
Korean (ko)
Other versions
KR20150038136A (ko
Inventor
에이프릴 다운 쉬리커
킴 케빈 마이
그리고리 바신
우베 맥켄스
주스트 피터 안드레 보겔스
알데곤다 루시아 베이저스
칼 아드리안 지즈트벨드
Original Assignee
루미리즈 홀딩 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 루미리즈 홀딩 비.브이. filed Critical 루미리즈 홀딩 비.브이.
Publication of KR20150038136A publication Critical patent/KR20150038136A/ko
Application granted granted Critical
Publication of KR102131747B1 publication Critical patent/KR102131747B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L33/504
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • H10H20/8513Wavelength conversion materials having two or more wavelength conversion materials
    • H01L33/0041
    • H01L33/508
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/062Light-emitting semiconductor devices having field effect type light-emitting regions, e.g. light-emitting High-Electron Mobility Transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8516Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8582Means for heat extraction or cooling characterised by their shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0363Manufacture or treatment of packages of optical field-shaping means

Landscapes

  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
KR1020157004248A 2012-07-20 2013-07-12 세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led Active KR102131747B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261673810P 2012-07-20 2012-07-20
US61/673,810 2012-07-20
PCT/IB2013/055752 WO2014013406A1 (en) 2012-07-20 2013-07-12 Led with ceramic green phosphor and protected red phosphor layer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207019153A Division KR20200085912A (ko) 2012-07-20 2013-07-12 세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led

Publications (2)

Publication Number Publication Date
KR20150038136A KR20150038136A (ko) 2015-04-08
KR102131747B1 true KR102131747B1 (ko) 2020-07-09

Family

ID=49226224

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157004248A Active KR102131747B1 (ko) 2012-07-20 2013-07-12 세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led
KR1020207019153A Withdrawn KR20200085912A (ko) 2012-07-20 2013-07-12 세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207019153A Withdrawn KR20200085912A (ko) 2012-07-20 2013-07-12 세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led

Country Status (6)

Country Link
US (3) US9379293B2 (enExample)
EP (1) EP2875532B1 (enExample)
JP (1) JP6348491B2 (enExample)
KR (2) KR102131747B1 (enExample)
CN (1) CN104471730B (enExample)
WO (1) WO2014013406A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102204220B1 (ko) * 2012-11-07 2021-01-19 루미리즈 홀딩 비.브이. 필터 및 보호층을 포함하는 발광 디바이스
DE102014100771A1 (de) * 2014-01-23 2015-07-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines keramischen Konversionselements und Licht emittierendes Bauelement
DE102014107472A1 (de) * 2014-05-27 2015-12-03 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Beleuchtungsvorrichtung
CN106575693B (zh) 2014-06-19 2020-07-31 亮锐控股有限公司 具有小源尺寸的波长转换发光设备
US20160023242A1 (en) * 2014-07-28 2016-01-28 Osram Sylvania Inc. Method of making wavelength converters for solid state lighting applications
JP6940784B2 (ja) * 2014-09-26 2021-09-29 日亜化学工業株式会社 発光装置の製造方法
DE102014117448A1 (de) * 2014-11-27 2016-06-02 Osram Gmbh Optoelektronischer Halbleiterchip, Verfahren zur Herstellung eines optoelektronischen Halbleiterchips, Konversionselement und Leuchtstoff für ein Konversionselement
DE102015102842A1 (de) 2015-02-27 2016-09-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Leuchtstoffkompositkeramik sowie Verfahren zu deren Herstellung
FR3033939B1 (fr) * 2015-03-20 2018-04-27 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoelectronique a diode electroluminescente
EP3709374B1 (en) * 2015-05-29 2022-08-03 Nichia Corporation Light emitting device
JP6183486B2 (ja) * 2015-05-29 2017-08-23 日亜化学工業株式会社 発光装置、被覆部材の製造方法及び発光装置の製造方法
JP6217705B2 (ja) 2015-07-28 2017-10-25 日亜化学工業株式会社 発光装置及びその製造方法
CN106486585A (zh) * 2015-08-25 2017-03-08 比亚迪股份有限公司 Led荧光膜、led组件、制备方法以及电子器件
US9859477B2 (en) 2016-01-15 2018-01-02 Corning Incorporated Method of forming light emitting diode with high-silica substrate
JP2017174908A (ja) * 2016-03-22 2017-09-28 豊田合成株式会社 発光装置の製造方法
KR102674066B1 (ko) 2016-11-11 2024-06-13 삼성전자주식회사 발광 소자 패키지
DE102016224090B4 (de) * 2016-12-05 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, Modul mit mindestens zwei optoelektronischen Bauelementen und Verfahren zum Herstellen eines optoelektronischen Bauelements
DE102017101729A1 (de) * 2017-01-30 2018-08-02 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
CN110556464A (zh) * 2018-06-01 2019-12-10 深圳市绎立锐光科技开发有限公司 发光二极管封装结构及封装方法
JP6760350B2 (ja) * 2018-10-25 2020-09-23 日亜化学工業株式会社 発光装置
CN111640844B (zh) * 2020-06-17 2021-11-30 鸿利智汇集团股份有限公司 一种复合荧光膜及led封装工艺
US12199230B2 (en) 2021-05-06 2025-01-14 Samsung Electronics Co., Ltd. Light emitting device package
US20230178690A1 (en) * 2021-12-06 2023-06-08 Lumileds Llc Monolithic LED Array And Method Of Manufacturing Thereof
CN119968946A (zh) * 2022-09-29 2025-05-09 艾迈斯-欧司朗国际有限责任公司 转换元件、用于制造转换元件的方法以及发光部件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273998A (ja) 2006-03-17 2007-10-18 Philips Lumileds Lightng Co Llc 蛍光体プレートを有するバックライト用白色led
JP2010519757A (ja) * 2007-02-26 2010-06-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ レンズ内にオーバーモールドされた蛍光体及び蛍光体タイルを持つled
US20110227476A1 (en) 2010-03-19 2011-09-22 Nitto Denko Corporation Light emitting device using orange-red phosphor with co-dopants
DE102010053362A1 (de) 2010-12-03 2012-06-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips, strahlungsemittierender Halbleiterchip und strahlungsemittierendes Bauelement

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291901A (ja) * 2000-04-07 2001-10-19 Yamada Shomei Kk 照明器具及びその製造方法
JP4292794B2 (ja) * 2002-12-04 2009-07-08 日亜化学工業株式会社 発光装置、発光装置の製造方法および発光装置の色度調整方法
US7256483B2 (en) 2004-10-28 2007-08-14 Philips Lumileds Lighting Company, Llc Package-integrated thin film LED
US7344902B2 (en) 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
US7344952B2 (en) 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
JP2007266246A (ja) * 2006-03-28 2007-10-11 Mitsubishi Electric Corp Ledモジュール
JP2008270144A (ja) * 2007-03-22 2008-11-06 Furukawa Electric Co Ltd:The ライトボックス
JP2009054801A (ja) * 2007-08-27 2009-03-12 Sanyo Electric Co Ltd 放熱部材及びそれを備えた発光モジュール
JP2009070869A (ja) * 2007-09-11 2009-04-02 Panasonic Corp 半導体発光装置
WO2009105581A1 (en) * 2008-02-21 2009-08-27 Nitto Denko Corporation Light emitting device with translucent ceramic plate
JP5025625B2 (ja) * 2008-03-25 2012-09-12 株式会社東芝 発光装置の製造方法
KR101226777B1 (ko) 2008-03-25 2013-01-25 가부시끼가이샤 도시바 발광 장치와, 그 제조 방법 및 장치
EP2297278A1 (en) * 2008-06-02 2011-03-23 Panasonic Corporation Semiconductor light emitting apparatus and light source apparatus using the same
US7973327B2 (en) * 2008-09-02 2011-07-05 Bridgelux, Inc. Phosphor-converted LED
WO2010032179A1 (en) * 2008-09-16 2010-03-25 Koninklijke Philips Electronics N.V. Polymeric wavelength converting elements
WO2010035206A1 (en) * 2008-09-25 2010-04-01 Koninklijke Philips Electronics N.V. Coated light emitting device and method for coating thereof
JP2010100743A (ja) * 2008-10-24 2010-05-06 Mitsubishi Chemicals Corp 蛍光体含有組成物の製造方法
US20100181582A1 (en) * 2009-01-22 2010-07-22 Intematix Corporation Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof
EP2412038B1 (en) * 2009-03-19 2019-01-02 Philips Lighting Holding B.V. Illumination device with remote luminescent material
US8227276B2 (en) * 2009-05-19 2012-07-24 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
US8803171B2 (en) * 2009-07-22 2014-08-12 Koninklijke Philips N.V. Reduced color over angle variation LEDs
US20110031516A1 (en) 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
US20110049545A1 (en) * 2009-09-02 2011-03-03 Koninklijke Philips Electronics N.V. Led package with phosphor plate and reflective substrate
WO2011028033A2 (ko) * 2009-09-02 2011-03-10 엘지이노텍주식회사 형광체, 형광체 제조방법 및 백색 발광 소자
US8203161B2 (en) * 2009-11-23 2012-06-19 Koninklijke Philips Electronics N.V. Wavelength converted semiconductor light emitting device
TW201208143A (en) * 2010-08-06 2012-02-16 Semileds Optoelectronics Co White LED device and manufacturing method thereof
JP5622494B2 (ja) * 2010-09-09 2014-11-12 スタンレー電気株式会社 発光装置およびその製造方法
JP5566263B2 (ja) * 2010-11-08 2014-08-06 株式会社小糸製作所 発光モジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273998A (ja) 2006-03-17 2007-10-18 Philips Lumileds Lightng Co Llc 蛍光体プレートを有するバックライト用白色led
JP2010519757A (ja) * 2007-02-26 2010-06-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ レンズ内にオーバーモールドされた蛍光体及び蛍光体タイルを持つled
US20110227476A1 (en) 2010-03-19 2011-09-22 Nitto Denko Corporation Light emitting device using orange-red phosphor with co-dopants
DE102010053362A1 (de) 2010-12-03 2012-06-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips, strahlungsemittierender Halbleiterchip und strahlungsemittierendes Bauelement

Also Published As

Publication number Publication date
CN104471730B (zh) 2018-04-17
EP2875532A1 (en) 2015-05-27
US20190172983A1 (en) 2019-06-06
CN104471730A (zh) 2015-03-25
JP6348491B2 (ja) 2018-06-27
KR20200085912A (ko) 2020-07-15
US20150188001A1 (en) 2015-07-02
JP2015522954A (ja) 2015-08-06
US9379293B2 (en) 2016-06-28
EP2875532B1 (en) 2019-02-27
KR20150038136A (ko) 2015-04-08
US20160276551A1 (en) 2016-09-22
US10205067B2 (en) 2019-02-12
WO2014013406A1 (en) 2014-01-23

Similar Documents

Publication Publication Date Title
KR102131747B1 (ko) 세라믹 녹색 인광체 및 보호된 적색 인광체 층을 갖는 led
US10680149B2 (en) Method for manufacturing light-emitting device
JP7168615B2 (ja) 光電子部品の製造方法、および光電子部品
US9006007B2 (en) Method for producing an optoelectronic assembly and optoelectronic assembly
CN103650179A (zh) 发光装置及该发光装置的制造方法
KR20130081321A (ko) 복사를 방출하는 반도체 칩의 제조 방법, 복사를 방출하는 반도체 칩 및 복사를 방출하는 소자
US20160155891A1 (en) Optoelectronic component and method for the production thereof
WO2015195820A1 (en) Method of making a ceramic wavelength converter assembly
JP2013232484A (ja) 発光装置およびその製造方法
JP6790478B2 (ja) 発光装置の製造方法
TWI546988B (zh) 製造發光二極體之方法
CN114762134B (zh) 光电子半导体器件及运行光电子半导体器件的方法
CN101290958A (zh) 发光二极管封装结构
JP2017076673A (ja) 発光装置の製造方法
US10304996B2 (en) Semiconductor light-emitting apparatus having wavelength-converting structure with uneven top surface and its manufacturing method
CN102376858A (zh) 发光二极管
CN104934516A (zh) 具有透明隔热胶层的led封装
JP6045779B2 (ja) 波長変換構造及びその製造方法並びに該波長変換構造を含む発光装置
CN105190918B (zh) 用于制造波长转换元件的方法、波长转换元件和具有波长转换元件的器件
US20230049186A1 (en) Optical Component, Optoelectronic Semiconductor Component and Method for Producing an Optical Component
WO2015011929A1 (ja) 発光装置
TWI407600B (zh) 發光二極體封裝結構的製造方法
KR101549827B1 (ko) Led 봉지구조 및 그 제작방법
KR101142015B1 (ko) 내열, 내습성이 강화된 구조를 채용한 발광다이오드 패키지 및 그 제조방법
CN111542931A (zh) 用于制造光电子部件的方法

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20150217

Patent event code: PA01051R01D

Comment text: International Patent Application

AMND Amendment
PG1501 Laying open of application
PN2301 Change of applicant

Patent event date: 20180214

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

A201 Request for examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20180711

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190806

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20200210

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20190806

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

X091 Application refused [patent]
AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20200210

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20190926

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20180711

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20150225

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20200401

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20200319

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20200210

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20190926

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20180711

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20150225

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20200702

PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200702

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200703

End annual number: 3

Start annual number: 1

PG1601 Publication of registration