KR102113096B1 - 탐색 장치, 탐색 방법 및 플라스마 처리 장치 - Google Patents

탐색 장치, 탐색 방법 및 플라스마 처리 장치 Download PDF

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KR102113096B1
KR102113096B1 KR1020180150325A KR20180150325A KR102113096B1 KR 102113096 B1 KR102113096 B1 KR 102113096B1 KR 1020180150325 A KR1020180150325 A KR 1020180150325A KR 20180150325 A KR20180150325 A KR 20180150325A KR 102113096 B1 KR102113096 B1 KR 102113096B1
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유타카 오쿠야마
다케시 오모리
마사루 구리하라
햣카 나카다
?카 나카다
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주식회사 히타치하이테크
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
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    • G06F16/20—Information retrieval; Database structures therefor; File system structures therefor of structured data, e.g. relational data
    • G06F16/24—Querying
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    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • H—ELECTRICITY
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    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
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    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/327—Arrangements for generating the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

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KR1020180150325A 2018-03-14 2018-11-29 탐색 장치, 탐색 방법 및 플라스마 처리 장치 Active KR102113096B1 (ko)

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JPJP-P-2018-046238 2018-03-14
JP2018046238A JP7121506B2 (ja) 2018-03-14 2018-03-14 探索装置、探索方法及びプラズマ処理装置

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Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7121506B2 (ja) 2018-03-14 2022-08-18 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置
JP7137943B2 (ja) 2018-03-20 2022-09-15 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置
US20220309198A1 (en) * 2019-09-05 2022-09-29 Tokyo Institute Of Technology Sample Preparation Evaluation System, Sample Preparation Evaluation Method and Computer Readable Medium
CN114730698A (zh) 2019-11-15 2022-07-08 株式会社半导体能源研究所 半导体元件的特性预测系统
WO2021111511A1 (ja) * 2019-12-03 2021-06-10 株式会社日立ハイテク 探索装置、探索プログラム及びプラズマ処理装置
JP7429116B2 (ja) * 2019-12-20 2024-02-07 旭化成株式会社 装置、方法およびプログラム
CN110969255B (zh) * 2019-12-26 2023-08-25 王超 一种基于量子原理的人工智能自主学习系统及方法
JP7542417B2 (ja) 2019-12-27 2024-08-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、基板処理システム、及び学習用データの生成方法
JP7376405B2 (ja) * 2020-03-26 2023-11-08 株式会社日立製作所 最適化処理装置、最適化処理方法及び最適化処理プログラム
JP7413131B2 (ja) * 2020-04-08 2024-01-15 株式会社日立製作所 材料特性予測方法、材料特性予測装置
JP7613760B2 (ja) * 2020-04-10 2025-01-15 国立大学法人 筑波大学 計測信号処理装置、計測信号処理方法およびプログラム
US11449026B2 (en) * 2020-05-27 2022-09-20 Applied Materials, Inc. Variable loop control feature
CN112309918B (zh) * 2020-10-30 2023-09-22 上海华力微电子有限公司 Vt-bs模型的先进工艺控制方法、系统及半导体设备
JP7485302B2 (ja) * 2020-12-02 2024-05-16 三菱電機株式会社 信頼性評価装置
US20240045388A1 (en) * 2020-12-28 2024-02-08 Tokyo Electron Limited Management apparatus, prediction method, and prediction program
JP7632968B2 (ja) * 2021-02-04 2025-02-19 東京エレクトロン株式会社 情報処理装置、プログラム及びプロセス条件探索方法
KR20220125208A (ko) * 2021-03-01 2022-09-14 주식회사 히타치하이테크 실험 포인트 추천 장치, 실험 포인트 추천 방법 및 반도체 장치 제조 시스템
TW202242958A (zh) * 2021-03-02 2022-11-01 日商東京威力科創股份有限公司 資料收集系統、資料收集裝置、資料收集方法及資料收集程式
CN112986275A (zh) * 2021-03-17 2021-06-18 哈尔滨工程大学 一种胚芽米胚芽完整度在线检测系统
JP7661763B2 (ja) * 2021-04-20 2025-04-15 株式会社大林組 学習データ作成システム、学習データ作成方法及び学習データ作成プログラム
WO2023281681A1 (ja) * 2021-07-08 2023-01-12 三菱電機株式会社 加工条件探索装置および加工条件探索方法
US12222690B2 (en) * 2021-07-08 2025-02-11 Hitachi High-Tech Corporation Process recipe search apparatus, etching recipe search method and semiconductor device manufacturing system
JP7698502B2 (ja) * 2021-07-29 2025-06-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
US12300464B2 (en) * 2021-10-25 2025-05-13 Advanced Energy Industries, Inc. Robust tensorized shaped setpoint waveform streaming control
JP7632978B2 (ja) * 2022-05-11 2025-02-19 東京エレクトロン株式会社 エッチング処理装置、エッチング処理システム、解析装置、エッチング処理方法及び解析プログラム
US20240070349A1 (en) * 2022-08-30 2024-02-29 Dassault Systèmes Americas Corp. System and Method for Energy Storage Device Generative Design
CN116224792A (zh) * 2023-02-27 2023-06-06 苏州汉霄等离子体科技有限公司 提高等离子体制粉系统控制精度的方法、装置及设备
JP2024136166A (ja) * 2023-03-23 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 情報処理装置、基板処理装置および処理条件決定方法
KR20250164285A (ko) * 2023-03-24 2025-11-24 가부시키가이샤 스크린 홀딩스 학습 장치, 정보 처리 장치, 기판 처리 장치, 학습 방법 및 처리 조건 결정 방법
CN116646231A (zh) * 2023-06-06 2023-08-25 北京屹唐半导体科技股份有限公司 反应腔室及氧化设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080306890A1 (en) 2007-06-07 2008-12-11 Hitachi, Ltd. Plant Control Apparatus
US20090099667A1 (en) 2006-03-08 2009-04-16 Takaaki Sekiai Plant controlling device and method, thermal power plant, and its control method
KR101755746B1 (ko) 2010-01-29 2017-07-07 도쿄엘렉트론가부시키가이샤 반도체 제조 툴을 자기-학습 및 자기-개선하는 방법 및 시스템

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920002268A (ko) 1990-07-17 1992-02-28 유끼노리 가까즈 인텔리젠트가공장치
JPH1074188A (ja) * 1996-05-23 1998-03-17 Hitachi Ltd データ学習装置およびプラント制御装置
JPH10301979A (ja) 1997-04-30 1998-11-13 Oki Electric Ind Co Ltd モデルパラメータ抽出方法およびモデルパラメータ抽出装置
JP3086794B2 (ja) 1997-09-19 2000-09-11 豊田工機株式会社 数値制御研削盤
SE9801175D0 (sv) * 1998-04-03 1998-04-03 Innotek Ab Metod och apparat för optimering av mekanisk ventilation med utgångspunkt från simulering av ventilatonsprocessen efter studium av andningsorganens fysiologi
JP4215454B2 (ja) 2001-07-12 2009-01-28 株式会社日立製作所 試料の凹凸判定方法、及び荷電粒子線装置
JP3404532B2 (ja) * 2001-07-27 2003-05-12 独立行政法人産業技術総合研究所 最適フィッティングパラメータ決定方法および装置、並びに最適フィッティングパラメータ決定プログラム
US6941301B2 (en) 2002-01-18 2005-09-06 Pavilion Technologies, Inc. Pre-processing input data with outlier values for a support vector machine
AU2003290932A1 (en) * 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
JP2004326200A (ja) * 2003-04-21 2004-11-18 Mitsubishi Heavy Ind Ltd 自動機械、機械の自動運転システム、及び、機械の自動運転方法
US20080279434A1 (en) 2007-05-11 2008-11-13 William Cassill Method and system for automated modeling
US8190543B2 (en) 2008-03-08 2012-05-29 Tokyo Electron Limited Autonomous biologically based learning tool
JP5751045B2 (ja) 2010-08-31 2015-07-22 富士電機株式会社 プラントの運転条件最適化システム、プラントの運転条件最適化方法、プラントの運転条件最適化プログラム
US9342793B2 (en) * 2010-08-31 2016-05-17 Red Hat, Inc. Training a self-learning network using interpolated input sets based on a target output
US8828259B2 (en) * 2011-07-07 2014-09-09 Lam Research Corporation Methods for automatically determining capacitor values and systems thereof
US9509977B2 (en) * 2012-03-28 2016-11-29 Olympus Corporation Image processing system and microscope system including the same
TWI549007B (zh) 2013-02-07 2016-09-11 先知科技股份有限公司 製程參數的搜尋與分析方法及其電腦程式產品
US9396443B2 (en) 2013-12-05 2016-07-19 Tokyo Electron Limited System and method for learning and/or optimizing manufacturing processes
JP6101650B2 (ja) 2014-02-27 2017-03-22 日本電信電話株式会社 システムパラメタ学習装置、情報処理装置、方法、及びプログラム
CN105321120A (zh) * 2014-06-30 2016-02-10 中国农业科学院农业资源与农业区划研究所 同化蒸散发和叶面积指数的区域土壤水分监测方法
US9679743B2 (en) * 2015-02-23 2017-06-13 Hitachi High-Tech Science Corporation Sample processing evaluation apparatus
CN104657777B (zh) * 2015-03-16 2017-06-16 长春工业大学 基于混沌小波神经网络的车用电线挤塑工艺参数优化方法
US9711327B2 (en) * 2015-07-16 2017-07-18 Applied Materials Israel, Ltd. Method and system for optimizing configurable parameters of inspection tools
JP2017102619A (ja) 2015-11-30 2017-06-08 オムロン株式会社 制御パラメータ調整装置、制御パラメータ調整方法、制御パラメータ調整プログラム
JP6650786B2 (ja) 2016-03-03 2020-02-19 三菱日立パワーシステムズ株式会社 制御パラメータ自動調整装置、制御パラメータ自動調整方法、及び制御パラメータ自動調整装置ネットワーク
JP6778666B2 (ja) 2017-08-24 2020-11-04 株式会社日立製作所 探索装置及び探索方法
JP6883787B2 (ja) 2017-09-06 2021-06-09 パナソニックＩｐマネジメント株式会社 学習装置、学習方法、学習プログラム、推定装置、推定方法、及び推定プログラム
JP6974712B2 (ja) 2017-10-24 2021-12-01 富士通株式会社 探索方法、探索装置および探索プログラム
JP7121506B2 (ja) 2018-03-14 2022-08-18 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置
JP7137943B2 (ja) 2018-03-20 2022-09-15 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090099667A1 (en) 2006-03-08 2009-04-16 Takaaki Sekiai Plant controlling device and method, thermal power plant, and its control method
US20080306890A1 (en) 2007-06-07 2008-12-11 Hitachi, Ltd. Plant Control Apparatus
JP2008305194A (ja) 2007-06-07 2008-12-18 Hitachi Ltd プラントの制御装置
KR101755746B1 (ko) 2010-01-29 2017-07-07 도쿄엘렉트론가부시키가이샤 반도체 제조 툴을 자기-학습 및 자기-개선하는 방법 및 시스템

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