CN110276470B - 探索装置、探索方法以及等离子处理装置 - Google Patents
探索装置、探索方法以及等离子处理装置 Download PDFInfo
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- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
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- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
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- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
- G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-046238 | 2018-03-14 | ||
| JP2018046238A JP7121506B2 (ja) | 2018-03-14 | 2018-03-14 | 探索装置、探索方法及びプラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110276470A CN110276470A (zh) | 2019-09-24 |
| CN110276470B true CN110276470B (zh) | 2023-04-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811578970.4A Active CN110276470B (zh) | 2018-03-14 | 2018-12-21 | 探索装置、探索方法以及等离子处理装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US11657059B2 (enExample) |
| JP (1) | JP7121506B2 (enExample) |
| KR (1) | KR102113096B1 (enExample) |
| CN (1) | CN110276470B (enExample) |
| TW (1) | TWI719398B (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7121506B2 (ja) | 2018-03-14 | 2022-08-18 | 株式会社日立ハイテク | 探索装置、探索方法及びプラズマ処理装置 |
| JP7137943B2 (ja) | 2018-03-20 | 2022-09-15 | 株式会社日立ハイテク | 探索装置、探索方法及びプラズマ処理装置 |
| US20220309198A1 (en) * | 2019-09-05 | 2022-09-29 | Tokyo Institute Of Technology | Sample Preparation Evaluation System, Sample Preparation Evaluation Method and Computer Readable Medium |
| JP7607576B2 (ja) * | 2019-11-15 | 2024-12-27 | 株式会社半導体エネルギー研究所 | 半導体素子の特性予測システム |
| CN113287123B (zh) * | 2019-12-03 | 2024-12-31 | 株式会社日立高新技术 | 搜索装置、搜索程序以及等离子处理装置 |
| JP7429116B2 (ja) * | 2019-12-20 | 2024-02-07 | 旭化成株式会社 | 装置、方法およびプログラム |
| CN110969255B (zh) * | 2019-12-26 | 2023-08-25 | 王超 | 一种基于量子原理的人工智能自主学习系统及方法 |
| JP7542417B2 (ja) * | 2019-12-27 | 2024-08-30 | 株式会社Screenホールディングス | 基板処理装置、基板処理方法、基板処理システム、及び学習用データの生成方法 |
| JP7376405B2 (ja) * | 2020-03-26 | 2023-11-08 | 株式会社日立製作所 | 最適化処理装置、最適化処理方法及び最適化処理プログラム |
| JP7413131B2 (ja) * | 2020-04-08 | 2024-01-15 | 株式会社日立製作所 | 材料特性予測方法、材料特性予測装置 |
| US12367548B2 (en) * | 2020-04-10 | 2025-07-22 | University Of Tsukuba | Measurement signal processing device, measurement signal processing method, and program |
| US11449026B2 (en) * | 2020-05-27 | 2022-09-20 | Applied Materials, Inc. | Variable loop control feature |
| CN112309918B (zh) * | 2020-10-30 | 2023-09-22 | 上海华力微电子有限公司 | Vt-bs模型的先进工艺控制方法、系统及半导体设备 |
| JP7485302B2 (ja) * | 2020-12-02 | 2024-05-16 | 三菱電機株式会社 | 信頼性評価装置 |
| WO2022145222A1 (ja) * | 2020-12-28 | 2022-07-07 | 東京エレクトロン株式会社 | 管理装置、予測方法及び予測プログラム |
| JP7632968B2 (ja) * | 2021-02-04 | 2025-02-19 | 東京エレクトロン株式会社 | 情報処理装置、プログラム及びプロセス条件探索方法 |
| WO2022172353A1 (ja) * | 2021-02-10 | 2022-08-18 | 株式会社日立ハイテク | 輪郭線解析装置、処理条件決定システム、形状推定システム、半導体装置製造システム、探索装置およびそれらに用いるデータ構造 |
| CN115280468B (zh) * | 2021-03-01 | 2025-10-14 | 株式会社日立高新技术 | 实验要点推荐装置、实验要点推荐方法及半导体装置制造系统 |
| TW202242958A (zh) * | 2021-03-02 | 2022-11-01 | 日商東京威力科創股份有限公司 | 資料收集系統、資料收集裝置、資料收集方法及資料收集程式 |
| CN112986275A (zh) * | 2021-03-17 | 2021-06-18 | 哈尔滨工程大学 | 一种胚芽米胚芽完整度在线检测系统 |
| JP7661763B2 (ja) * | 2021-04-20 | 2025-04-15 | 株式会社大林組 | 学習データ作成システム、学習データ作成方法及び学習データ作成プログラム |
| US12222690B2 (en) * | 2021-07-08 | 2025-02-11 | Hitachi High-Tech Corporation | Process recipe search apparatus, etching recipe search method and semiconductor device manufacturing system |
| DE112021007612B4 (de) * | 2021-07-08 | 2024-12-12 | Mitsubishi Electric Corporation | Bearbeitungsbedingungs-sucheinrichtung und bearbeitungsbedingungs-suchverfahren |
| JP7698502B2 (ja) * | 2021-07-29 | 2025-06-25 | 株式会社Screenホールディングス | 基板処理方法及び基板処理装置 |
| US12300464B2 (en) * | 2021-10-25 | 2025-05-13 | Advanced Energy Industries, Inc. | Robust tensorized shaped setpoint waveform streaming control |
| JP7632978B2 (ja) * | 2022-05-11 | 2025-02-19 | 東京エレクトロン株式会社 | エッチング処理装置、エッチング処理システム、解析装置、エッチング処理方法及び解析プログラム |
| US20240070349A1 (en) * | 2022-08-30 | 2024-02-29 | Dassault Systèmes Americas Corp. | System and Method for Energy Storage Device Generative Design |
| CN116224792A (zh) * | 2023-02-27 | 2023-06-06 | 苏州汉霄等离子体科技有限公司 | 提高等离子体制粉系统控制精度的方法、装置及设备 |
| JP2024136166A (ja) * | 2023-03-23 | 2024-10-04 | 株式会社Screenホールディングス | 情報処理装置、基板処理装置および処理条件決定方法 |
| WO2024203290A1 (ja) * | 2023-03-24 | 2024-10-03 | 株式会社Screenホールディングス | 学習装置、情報処理装置、基板処理装置、学習方法および処理条件決定方法 |
| CN116646231A (zh) * | 2023-06-06 | 2023-08-25 | 北京屹唐半导体科技股份有限公司 | 反应腔室及氧化设备 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6578575B1 (en) * | 1998-04-03 | 2003-06-17 | Siemens Elema Ab | Method and apparatus for optimization of mechanical ventilation |
| CN104657777A (zh) * | 2015-03-16 | 2015-05-27 | 长春工业大学 | 基于混沌小波神经网络的车用电线挤塑工艺参数优化方法 |
| CN105321120A (zh) * | 2014-06-30 | 2016-02-10 | 中国农业科学院农业资源与农业区划研究所 | 同化蒸散发和叶面积指数的区域土壤水分监测方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR920002268A (ko) | 1990-07-17 | 1992-02-28 | 유끼노리 가까즈 | 인텔리젠트가공장치 |
| JPH1074188A (ja) * | 1996-05-23 | 1998-03-17 | Hitachi Ltd | データ学習装置およびプラント制御装置 |
| JPH10301979A (ja) | 1997-04-30 | 1998-11-13 | Oki Electric Ind Co Ltd | モデルパラメータ抽出方法およびモデルパラメータ抽出装置 |
| JP3086794B2 (ja) | 1997-09-19 | 2000-09-11 | 豊田工機株式会社 | 数値制御研削盤 |
| JP4215454B2 (ja) | 2001-07-12 | 2009-01-28 | 株式会社日立製作所 | 試料の凹凸判定方法、及び荷電粒子線装置 |
| JP3404532B2 (ja) * | 2001-07-27 | 2003-05-12 | 独立行政法人産業技術総合研究所 | 最適フィッティングパラメータ決定方法および装置、並びに最適フィッティングパラメータ決定プログラム |
| US6941301B2 (en) | 2002-01-18 | 2005-09-06 | Pavilion Technologies, Inc. | Pre-processing input data with outlier values for a support vector machine |
| CN1720490B (zh) | 2002-11-15 | 2010-12-08 | 应用材料有限公司 | 用于控制具有多变量输入参数的制造工艺的方法和系统 |
| JP2004326200A (ja) | 2003-04-21 | 2004-11-18 | Mitsubishi Heavy Ind Ltd | 自動機械、機械の自動運転システム、及び、機械の自動運転方法 |
| JP4573783B2 (ja) * | 2006-03-08 | 2010-11-04 | 株式会社日立製作所 | プラントの制御装置と制御方法及び火力発電プラントとその制御方法 |
| US20080279434A1 (en) | 2007-05-11 | 2008-11-13 | William Cassill | Method and system for automated modeling |
| JP4427074B2 (ja) * | 2007-06-07 | 2010-03-03 | 株式会社日立製作所 | プラントの制御装置 |
| US8190543B2 (en) | 2008-03-08 | 2012-05-29 | Tokyo Electron Limited | Autonomous biologically based learning tool |
| US8396582B2 (en) * | 2008-03-08 | 2013-03-12 | Tokyo Electron Limited | Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool |
| JP5751045B2 (ja) | 2010-08-31 | 2015-07-22 | 富士電機株式会社 | プラントの運転条件最適化システム、プラントの運転条件最適化方法、プラントの運転条件最適化プログラム |
| US9342793B2 (en) * | 2010-08-31 | 2016-05-17 | Red Hat, Inc. | Training a self-learning network using interpolated input sets based on a target output |
| US8828259B2 (en) * | 2011-07-07 | 2014-09-09 | Lam Research Corporation | Methods for automatically determining capacitor values and systems thereof |
| US9509977B2 (en) * | 2012-03-28 | 2016-11-29 | Olympus Corporation | Image processing system and microscope system including the same |
| TWI549007B (zh) | 2013-02-07 | 2016-09-11 | 先知科技股份有限公司 | 製程參數的搜尋與分析方法及其電腦程式產品 |
| US9396443B2 (en) | 2013-12-05 | 2016-07-19 | Tokyo Electron Limited | System and method for learning and/or optimizing manufacturing processes |
| JP6101650B2 (ja) | 2014-02-27 | 2017-03-22 | 日本電信電話株式会社 | システムパラメタ学習装置、情報処理装置、方法、及びプログラム |
| US9679743B2 (en) * | 2015-02-23 | 2017-06-13 | Hitachi High-Tech Science Corporation | Sample processing evaluation apparatus |
| US9711327B2 (en) * | 2015-07-16 | 2017-07-18 | Applied Materials Israel, Ltd. | Method and system for optimizing configurable parameters of inspection tools |
| JP2017102619A (ja) | 2015-11-30 | 2017-06-08 | オムロン株式会社 | 制御パラメータ調整装置、制御パラメータ調整方法、制御パラメータ調整プログラム |
| JP6650786B2 (ja) | 2016-03-03 | 2020-02-19 | 三菱日立パワーシステムズ株式会社 | 制御パラメータ自動調整装置、制御パラメータ自動調整方法、及び制御パラメータ自動調整装置ネットワーク |
| JP6778666B2 (ja) | 2017-08-24 | 2020-11-04 | 株式会社日立製作所 | 探索装置及び探索方法 |
| JP6883787B2 (ja) | 2017-09-06 | 2021-06-09 | パナソニックIpマネジメント株式会社 | 学習装置、学習方法、学習プログラム、推定装置、推定方法、及び推定プログラム |
| JP6974712B2 (ja) | 2017-10-24 | 2021-12-01 | 富士通株式会社 | 探索方法、探索装置および探索プログラム |
| JP7121506B2 (ja) | 2018-03-14 | 2022-08-18 | 株式会社日立ハイテク | 探索装置、探索方法及びプラズマ処理装置 |
| JP7137943B2 (ja) | 2018-03-20 | 2022-09-15 | 株式会社日立ハイテク | 探索装置、探索方法及びプラズマ処理装置 |
-
2018
- 2018-03-14 JP JP2018046238A patent/JP7121506B2/ja active Active
- 2018-11-29 KR KR1020180150325A patent/KR102113096B1/ko active Active
- 2018-12-21 CN CN201811578970.4A patent/CN110276470B/zh active Active
-
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- 2019-01-30 TW TW108103411A patent/TWI719398B/zh active
- 2019-02-25 US US16/284,879 patent/US11657059B2/en active Active
-
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- 2021-04-27 US US17/241,826 patent/US11907235B2/en active Active
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- 2023-03-21 US US18/124,112 patent/US20230222131A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6578575B1 (en) * | 1998-04-03 | 2003-06-17 | Siemens Elema Ab | Method and apparatus for optimization of mechanical ventilation |
| CN105321120A (zh) * | 2014-06-30 | 2016-02-10 | 中国农业科学院农业资源与农业区划研究所 | 同化蒸散发和叶面积指数的区域土壤水分监测方法 |
| CN104657777A (zh) * | 2015-03-16 | 2015-05-27 | 长春工业大学 | 基于混沌小波神经网络的车用电线挤塑工艺参数优化方法 |
Non-Patent Citations (1)
| Title |
|---|
| 一种寻找Heston期权定价模型参数的新方法;李斌 等;《数量经济技术经济研究》;20151231;第129-146页 * |
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| KR102113096B1 (ko) | 2020-05-20 |
| CN110276470A (zh) | 2019-09-24 |
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