CN110276470B - 探索装置、探索方法以及等离子处理装置 - Google Patents

探索装置、探索方法以及等离子处理装置 Download PDF

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CN110276470B
CN110276470B CN201811578970.4A CN201811578970A CN110276470B CN 110276470 B CN110276470 B CN 110276470B CN 201811578970 A CN201811578970 A CN 201811578970A CN 110276470 B CN110276470 B CN 110276470B
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CN110276470A (zh
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奥山裕
大森健史
栗原优
中田百科
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Hitachi High Tech Corp
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    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
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    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
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    • G06COMPUTING OR CALCULATING; COUNTING
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    • H01J37/32082Radio frequency generated discharge
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CN201811578970.4A 2018-03-14 2018-12-21 探索装置、探索方法以及等离子处理装置 Active CN110276470B (zh)

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