KR102109667B1 - 플럭스 조성물, 솔더 페이스트 조성물, 및 납땜 이음 - Google Patents
플럭스 조성물, 솔더 페이스트 조성물, 및 납땜 이음 Download PDFInfo
- Publication number
- KR102109667B1 KR102109667B1 KR1020197033671A KR20197033671A KR102109667B1 KR 102109667 B1 KR102109667 B1 KR 102109667B1 KR 1020197033671 A KR1020197033671 A KR 1020197033671A KR 20197033671 A KR20197033671 A KR 20197033671A KR 102109667 B1 KR102109667 B1 KR 102109667B1
- Authority
- KR
- South Korea
- Prior art keywords
- flux
- composition
- solder paste
- scattering
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017081369A JP6531958B2 (ja) | 2017-04-17 | 2017-04-17 | フラックス組成物及びソルダペースト組成物 |
| JPJP-P-2017-081369 | 2017-04-17 | ||
| PCT/JP2018/015366 WO2018193960A1 (ja) | 2017-04-17 | 2018-04-12 | フラックス組成物、ソルダペースト組成物、及びはんだ継手 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200002914A KR20200002914A (ko) | 2020-01-08 |
| KR102109667B1 true KR102109667B1 (ko) | 2020-05-12 |
Family
ID=63856966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197033671A Active KR102109667B1 (ko) | 2017-04-17 | 2018-04-12 | 플럭스 조성물, 솔더 페이스트 조성물, 및 납땜 이음 |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US11370069B2 (https=) |
| EP (1) | EP3603879B1 (https=) |
| JP (1) | JP6531958B2 (https=) |
| KR (1) | KR102109667B1 (https=) |
| CN (1) | CN110536771B (https=) |
| BR (1) | BR112019020302B1 (https=) |
| CA (1) | CA3060036C (https=) |
| ES (1) | ES2844193T3 (https=) |
| HU (1) | HUE054047T2 (https=) |
| MX (1) | MX376330B (https=) |
| MY (1) | MY181237A (https=) |
| PH (1) | PH12019502350A1 (https=) |
| PL (1) | PL3603879T3 (https=) |
| PT (1) | PT3603879T (https=) |
| TW (1) | TWI704024B (https=) |
| WO (1) | WO2018193960A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6721850B1 (ja) * | 2019-05-27 | 2020-07-15 | 千住金属工業株式会社 | ソルダペースト |
| TWI733301B (zh) * | 2020-01-09 | 2021-07-11 | 廣化科技股份有限公司 | 焊料膏組成物及包含其之焊接方法 |
| JP6993594B2 (ja) | 2020-03-27 | 2022-02-04 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| JP6845452B1 (ja) * | 2020-03-30 | 2021-03-17 | 千住金属工業株式会社 | はんだ接合不良抑制剤、フラックスおよびソルダペースト |
| EP4144476A1 (de) | 2021-09-07 | 2023-03-08 | Heraeus Deutschland GmbH & Co. KG | Lotpaste |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007069260A (ja) | 2005-09-09 | 2007-03-22 | Uchihashi Estec Co Ltd | ヤニ入りはんだ用フラックス組成物及びヤニ入りはんだ |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4745037A (en) * | 1976-12-15 | 1988-05-17 | Allied Corporation | Homogeneous, ductile brazing foils |
| JP3066090B2 (ja) * | 1991-01-22 | 2000-07-17 | 山栄化学株式会社 | 液状プリフラックス組成物及びプリント配線板 |
| JP3061449B2 (ja) | 1991-06-19 | 2000-07-10 | 勝田化工株式会社 | はんだ付け用フラックス |
| JPH05185283A (ja) * | 1991-11-05 | 1993-07-27 | Metsuku Kk | はんだ付け用フラックス及びクリームはんだ |
| JPH0649272A (ja) * | 1992-07-31 | 1994-02-22 | Nippon Oil & Fats Co Ltd | 導電性組成物 |
| JPH1039453A (ja) * | 1996-07-18 | 1998-02-13 | Fuji Photo Film Co Ltd | 易開封性感光材料包装体及びその製造方法 |
| JP4447798B2 (ja) | 2001-03-23 | 2010-04-07 | タムラ化研株式会社 | ソルダペースト組成物及びリフローはんだ付方法 |
| JP4971601B2 (ja) * | 2005-07-05 | 2012-07-11 | 新日鐵化学株式会社 | ビニルベンジルエーテル化合物及び該化合物を必須成分とする樹脂組成物 |
| MY183002A (en) * | 2013-08-12 | 2021-02-05 | Senju Metal Industry Co | Flux, solder paste and solder joint |
| JP5490959B1 (ja) * | 2013-11-18 | 2014-05-14 | ハリマ化成株式会社 | はんだフラックス用ロジンおよびそれを用いたはんだフラックス |
| CN108655610A (zh) * | 2018-04-17 | 2018-10-16 | 苏州捷德瑞精密机械有限公司 | 一种水基免洗抗菌防霉助焊剂及其制备方法 |
-
2017
- 2017-04-17 JP JP2017081369A patent/JP6531958B2/ja active Active
-
2018
- 2018-04-12 PL PL18787557T patent/PL3603879T3/pl unknown
- 2018-04-12 CA CA3060036A patent/CA3060036C/en active Active
- 2018-04-12 KR KR1020197033671A patent/KR102109667B1/ko active Active
- 2018-04-12 MY MYPI2019006101A patent/MY181237A/en unknown
- 2018-04-12 BR BR112019020302-8A patent/BR112019020302B1/pt active IP Right Grant
- 2018-04-12 US US16/605,459 patent/US11370069B2/en active Active
- 2018-04-12 ES ES18787557T patent/ES2844193T3/es active Active
- 2018-04-12 MX MX2019012366A patent/MX376330B/es active IP Right Grant
- 2018-04-12 EP EP18787557.0A patent/EP3603879B1/en active Active
- 2018-04-12 WO PCT/JP2018/015366 patent/WO2018193960A1/ja not_active Ceased
- 2018-04-12 CN CN201880025625.XA patent/CN110536771B/zh active Active
- 2018-04-12 HU HUE18787557A patent/HUE054047T2/hu unknown
- 2018-04-12 PT PT187875570T patent/PT3603879T/pt unknown
- 2018-04-13 TW TW107112745A patent/TWI704024B/zh active
-
2019
- 2019-10-16 PH PH12019502350A patent/PH12019502350A1/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007069260A (ja) | 2005-09-09 | 2007-03-22 | Uchihashi Estec Co Ltd | ヤニ入りはんだ用フラックス組成物及びヤニ入りはんだ |
Also Published As
| Publication number | Publication date |
|---|---|
| CA3060036A1 (en) | 2018-10-25 |
| JP6531958B2 (ja) | 2019-06-19 |
| TW201843002A (zh) | 2018-12-16 |
| CN110536771B (zh) | 2020-12-29 |
| JP2018176238A (ja) | 2018-11-15 |
| ES2844193T3 (es) | 2021-07-21 |
| PH12019502350B1 (en) | 2020-12-07 |
| EP3603879A4 (en) | 2020-02-05 |
| PL3603879T3 (pl) | 2021-06-28 |
| EP3603879B1 (en) | 2021-01-06 |
| BR112019020302A2 (pt) | 2020-04-28 |
| EP3603879A1 (en) | 2020-02-05 |
| TWI704024B (zh) | 2020-09-11 |
| CN110536771A (zh) | 2019-12-03 |
| US20200353574A1 (en) | 2020-11-12 |
| PT3603879T (pt) | 2021-03-17 |
| HUE054047T2 (hu) | 2021-08-30 |
| MX2019012366A (es) | 2019-11-28 |
| MY181237A (en) | 2020-12-21 |
| PH12019502350A1 (en) | 2020-12-07 |
| WO2018193960A1 (ja) | 2018-10-25 |
| BR112019020302B1 (pt) | 2021-01-19 |
| US11370069B2 (en) | 2022-06-28 |
| KR20200002914A (ko) | 2020-01-08 |
| CA3060036C (en) | 2021-01-26 |
| MX376330B (es) | 2025-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102109667B1 (ko) | 플럭스 조성물, 솔더 페이스트 조성물, 및 납땜 이음 | |
| KR101436714B1 (ko) | 납프리 솔더 페이스트 | |
| JP6310894B2 (ja) | はんだ組成物および電子基板の製造方法 | |
| JP5756067B2 (ja) | はんだ組成物およびそれを用いたプリント配線基板 | |
| KR102184056B1 (ko) | 플럭스 및 땜납 재료 | |
| CN1211183C (zh) | 钎焊膏、使用该钎焊膏的软钎焊方法及所制备的焊接物 | |
| JP6899173B2 (ja) | フラックス及びソルダペースト | |
| CN112262013B (zh) | 焊膏用助焊剂和焊膏 | |
| JP6275311B1 (ja) | ソルダペースト及びはんだ接合部 | |
| JP7452834B2 (ja) | フラックス及びソルダペースト | |
| TW202035565A (zh) | 助焊劑及焊膏 | |
| JP5423688B2 (ja) | 鉛フリーはんだ用フラックス組成物、鉛フリーはんだ組成物およびやに入りはんだ | |
| KR102852273B1 (ko) | 땜납 조성물 및 전자 회로 실장 기판 | |
| JP4447798B2 (ja) | ソルダペースト組成物及びリフローはんだ付方法 | |
| EP3628438B1 (en) | Flux, resin-flux cored solder and solder paste | |
| JP7634044B2 (ja) | はんだ組成物、および電子基板 | |
| JP4347492B2 (ja) | ハンダ付けフラックス、ハンダペースト、ハンダ付け方法、接合物 | |
| JP2020049539A (ja) | 微小チップ部品用はんだ組成物 | |
| JP3815997B2 (ja) | はんだペースト | |
| JP2025052682A (ja) | フラックス組成物、はんだ組成物、および電子基板 | |
| JPWO1999001251A1 (ja) | ソルダペースト | |
| JPH08332592A (ja) | はんだボールの少ないクリームはんだ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| A302 | Request for accelerated examination | ||
| PA0105 | International application |
Patent event date: 20191114 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20191114 Comment text: Request for Examination of Application |
|
| PA0302 | Request for accelerated examination |
Patent event date: 20191114 Patent event code: PA03022R01D Comment text: Request for Accelerated Examination |
|
| PG1501 | Laying open of application | ||
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20200323 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20200506 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20200506 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |