KR102098746B1 - Apparatus for removing carrier substrate, system for manufacturing display, and the method of manufacturing display - Google Patents

Abstract

According to an aspect of the present invention, a carrier substrate gripping portion for gripping a carrier substrate separated from a flexible substrate; An inclined separating portion separating the flexible substrate and the carrier substrate together with the substrate gripping portion while transferring the flexible substrate at a predetermined angle; And a transmittance measuring unit for measuring transmittance of the separated carrier substrate.

Description

{Apparatus for removing carrier substrate, system for manufacturing display, and the method of manufacturing display}

The present invention relates to a carrier substrate removal device, a display device manufacturing system, and a display device manufacturing method.

A display device such as an organic light emitting display device can be thinned and flexible due to driving characteristics, and thus many studies have been conducted on this. Recently, a flexible display device using a so-called flexible substrate having a thickness of only 50 to 100 μm to form a display unit thereon is in the spotlight.

However, since such a flexible substrate is too thin to handle during the manufacturing process, a carrier substrate of the same glass material, which is relatively thick, is usually prepared, and the flexible substrate is attached thereon, followed by a process of forming a display unit, etc. Proceeding, the manufacturing process is performed by separating the flexible substrate and the carrier substrate again later.

In order to separate the flexible substrate and the carrier substrate, a laser irradiation device irradiates a laser on the carrier substrate, and a carrier substrate removal device separates the bonded flexible substrate and the carrier substrate from each other. However, during the laser irradiation process, a defect may occur in the flexible substrate, and the flexible substrate separated from the carrier substrate removal apparatus takes a subsequent process regardless of whether it is defective, which takes unnecessary process cost and process time.

Therefore, in the process of separating the flexible substrate from the carrier substrate, there is a need for a method capable of determining whether the flexible substrate is defective due to laser over-irradiation.

An object of the present invention is to provide a carrier substrate removing apparatus, a display device manufacturing system, and a method for manufacturing a display device, which improves process cost and process time by promptly determining whether a flexible substrate is defective.

According to an aspect of the present invention, a carrier substrate gripping portion for gripping a carrier substrate separated from a flexible substrate; An inclined separating portion separating the flexible substrate and the carrier substrate together with the substrate gripping portion while transferring the flexible substrate at a predetermined angle; And a transmittance measuring unit for measuring transmittance of the separated carrier substrate.

According to another aspect of the present invention, the transmittance measurement unit may include an under vision camera or a digital sensor for color discrimination.

According to another aspect of the invention, by comparing the range of the transmittance measured by the transmittance measurement unit and a predetermined transmittance, the control unit for determining whether the carrier substrate is normal and outputs the result; may further include a.

According to another aspect of the present invention, the control unit uses the wired or wireless communication of the result to a laser irradiation apparatus that irradiates a laser on the carrier substrate to separate the carrier substrate and the flexible substrate bonded to each other. Can transmit.

According to another feature of the present invention, in conjunction with the laser irradiation device, it is possible to control the laser energy density of the laser irradiation device.

According to another feature of the invention, it may further include a; carrier substrate loading unit for loading the separated carrier substrate.

According to another aspect of the invention, the carrier substrate gripping portion, the carrier substrate gripping member for adsorbing and gripping the carrier substrate; And a transfer member connected to the carrier substrate gripping member and moving the carrier substrate gripping member.

According to another aspect of the invention, the transfer, the x-axis transfer to move the carrier substrate holding member in the x-axis; A y-axis transfer moving the carrier substrate gripping member in a y-axis; And a z-axis transfer that moves the carrier substrate gripping member in the z-axis.

According to another feature of the invention, it is disposed on both sides of the inclined separation unit 116 may further include; an ionizer for spraying the static electricity generation preventing fluid to both of the carrier substrate and the flexible substrate.

According to another aspect of the invention, the laser irradiation apparatus for irradiating the laser on the carrier substrate from the flexible substrate and the carrier substrate bonded to each other; A substrate separation unit separating the carrier substrate from the flexible substrate; Transmittance measuring unit for measuring the transmittance of the separated carrier substrate; And a control unit for determining whether the laser is over-irradiated using the measured transmittance and outputting it to the laser irradiation apparatus.

According to another aspect of the present invention, the transmittance measurement unit may include an under vision camera or a digital sensor for color discrimination.

According to another aspect of the invention, the substrate separation portion, the carrier substrate gripping portion for holding the carrier substrate separated from the flexible substrate; And an inclined separation unit separating the flexible substrate and the carrier substrate together with the substrate gripping portion while transferring the flexible substrate.

According to another feature of the present invention, when the transmittance of the separated carrier substrate is less than a preset value, the controller may output the energy to the laser irradiation device to reduce the energy density of the laser.

According to another aspect of the invention, the laser irradiation apparatus comprising: irradiating a laser on a carrier substrate to which a flexible substrate is bonded; Separating the carrier substrate from the flexible substrate in a carrier substrate removal apparatus; Measuring a transmittance of the separated carrier substrate through a transmittance measurement unit; And controlling the energy density of the irradiated laser according to the measurement result.

According to another aspect of the present invention, the step of controlling the energy density of the laser may reduce the laser energy density when the transmittance measured by the transmittance measurement unit is smaller than a predetermined value.

According to another feature of the invention, the carrier substrate comprises a glass, the flexible substrate is a kapton (kapton), polyethersulfone (polyethersulphone, PES), polycarbonate (polycarbonate: PC), polyimide (polyimide: PI) , Polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyacrylate (polyacrylate, PAR) and fiber reinforced plastic (fiber reinforced plastic: FRP) may include a material selected from the group consisting of .

The carrier substrate removing device, the display device manufacturing system, and the display device manufacturing method according to the present invention as described above provide the following effects.

First, since it is possible to determine whether the flexible substrate is defective by measuring the transmittance of the separated carrier substrate, it is possible to improve process cost and process time by omitting the subsequent process for the damaged flexible substrate.

Second, since a subsequent process is performed on a normal flexible substrate, reliability of the display device can be improved.

Third, whether the laser is over-irradiated according to the transmittance of the carrier substrate is checked in real time, and the energy density of the laser can be adjusted, thereby reducing the defect rate of the process.

1 is a cross-sectional view schematically showing a flexible electronic device using a carrier substrate.
2 is a view showing that the laser is irradiated on the carrier substrate to separate the flexible substrate from the carrier substrate.
3 is a view schematically showing that the flexible substrate and the carrier substrate are separated using a carrier substrate removal apparatus.
4 is a plan view schematically showing an apparatus for removing a carrier substrate according to an embodiment of the present invention.
5 is a side view schematically showing the side of FIG. 4, and FIG. 6 is a partially enlarged perspective view of FIG. 4.
7 to 10 are views showing the operation of the carrier substrate removal apparatus according to an embodiment of the present invention step by step.
11 is a block diagram illustrating a display device manufacturing system according to an embodiment of the present invention.
12 is a flowchart illustrating a method of manufacturing a display device using a laser irradiation device and a carrier substrate removal device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention shown in the accompanying drawings will be described in detail.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the contents described in the accompanying drawings, which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. The same reference numerals in each drawing denote the same members.

1 is a cross-sectional view schematically showing a flexible electronic device using a carrier substrate.

Referring to FIG. 1, the flexible electronic device 10 includes a carrier substrate 200, a flexible substrate 210, a thin film transistor array 212, a display layer 214, and an encapsulation layer 216.

In addition, while filling between the carrier substrate 200 and the flexible substrate 210, further comprising an adhesive layer (not shown) bonding the carrier substrate 200 and the flexible substrate 210 to each other. As the adhesive layer (not shown), various materials known to those skilled in the art may be used.

The carrier substrate 200 may include glass.

The flexible substrate 210 is a kapton, polyethersulphone (PES), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PET) It may include a material selected from the group consisting of polyethylenenaphthalate (PEN), polyacrylate (PAR) and fiber reinforced plastic (FRP).

The display layer 214 may include a liquid crystal layer, an electrophoretic layer, or an organic light emitting layer.

2 is a view showing that the laser is irradiated on the carrier substrate to separate the flexible substrate from the carrier substrate, and FIG. 3 is a view schematically showing that the flexible substrate and the carrier substrate are separated from each other using a carrier substrate removal apparatus. .

2 and 3 together, after the laser is irradiated onto the carrier substrate 200, the carrier substrate 200 bonded to each other using a carrier substrate removal apparatus (not shown, 20 of FIG. 4) to be described later. ) And the flexible substrate 210 may be separated.

That is, before separating the carrier substrate 200 and the flexible substrate 210 adhered to each other in the carrier substrate removal device, the laser irradiation device 30 irradiates a laser on the carrier, so that the carrier substrate 200 And the separation of the flexible substrate 210.

The energy density and wavelength of the laser irradiated from the laser irradiation device 30 may vary depending on the type and thickness of the adhesive layer (not shown). When the laser is over-irradiated on the carrier substrate 200, damage may be generated on the flexible substrate 210 to cause defects. In addition, when pre-delamination occurs before the carrier substrate 200 and the flexible substrate 210 are separated due to laser over-irradiation, the flexible substrate 210 is crumpled on the conveyor of the carrier substrate removal device, etc. It causes a defect in the carrier substrate removal device.

The flexible substrate 210 separated from the carrier substrate removal apparatus is subjected to a subsequent process of forming a lamination on the flexible substrate 210, and the carrier substrate 200 is disposed of by inspecting whether it is not peeled or not.

However, when inspecting whether the carrier substrate 200 is not peeled off and discarding the carrier substrate 200, it is not only impossible to determine whether the flexible substrate 210 is damaged due to laser over-irradiation, The subsequent process for the damaged flexible substrate 210 is performed, which causes unnecessary process cost and process time.

Accordingly, the present invention measures the transmittance of the carrier substrate 200 separated from the carrier substrate removal device, thereby promptly determining whether or not the laser irradiation device 30 is over-irradiated to improve process cost and process time. You can. Hereinafter, a carrier substrate removal apparatus according to an embodiment of the present invention will be described.

4 is a plan view schematically showing a carrier substrate removing apparatus according to an embodiment of the present invention, FIG. 5 is a side view schematically showing the side of FIG. 4, and FIG. 6 is a partially enlarged perspective view of FIG. 4.

4 to 6 together, the carrier substrate removal apparatus 20 includes a carrier substrate gripping portion 102, an inclined separation portion 116, a carrier substrate loading portion 112, and a transmittance measuring portion 114. .

In addition, the carrier substrate removing device 20 may further include an ionizer 118 disposed adjacent to the inclined separation unit 116 to spray an antistatic generating fluid toward the carrier substrate 200. The ionizer 118 may be disposed on both sides of the inclined separator 116 to spray static electricity prevention fluid to both the carrier substrate 200 and the flexible substrate 210.

The carrier substrate gripping part 102 serves to grip the carrier substrate 200 forming an upper layer on a work line where the carrier substrate 200 and the flexible substrate 210 are bonded and transferred to each other. The carrier substrate gripping part 102 may grip the carrier substrate 200 by a vacuum adsorption method. The carrier substrate 200 may be, for example, glass. However, it is not limited thereto.

The carrier substrate gripping part 102 is connected to the carrier substrate gripping member 120 for adsorbing and gripping the carrier substrate 200, and the carrier substrate gripping member 120, and the carrier substrate gripping member 120 is x, and transfers 104, 106, and 108 that move in the y and z directions.

The carrier substrate gripping member 120 may grip the carrier substrate 200 by vacuum, and as shown in an enlarged view of FIG. 5, a body portion 122 and a plurality of bodies connected to the body portion 122 And a plurality of adsorption nozzles 126 coupled to the plurality of nozzle brackets 124 and the plurality of nozzle brackets 124 and adsorbing the carrier substrate 200 by vacuum pressure.

The body portion 122 may have an area equal to or greater than the area of the carrier substrate 200 to be gripped. For example, when the size of the carrier substrate 200 is horizontal / vertical 2 meters, the body part 122 may be manufactured in a size corresponding to this.

The plurality of adsorption nozzles 126 is a component that substantially adsorbs the carrier substrate 200 in a vacuum, and one adsorption nozzle 113 may be disposed in one of the nozzle brackets 124. However, the present invention is not limited thereto, and two adsorption nozzles 113 may be disposed on one of the nozzle brackets 124 in order to more stably hold the carrier substrate 200.

The transfer (104, 106, 108) is an X-axis transfer 104 for moving the carrier substrate gripping member 120 in the X-axis (see FIG. 4) which is the transfer direction of the inclined separation unit 116, the X-axis transfer ( The Y-axis transfer 106 for moving the carrier substrate gripping member 120 in the Y-axis (see FIG. 4), which is the direction intersecting 104, and the carrier substrate gripping member 120 to the inclined separator 116 It includes a Z-axis transfer 108 to move in the vertical direction relative to the Z-axis (see Fig. 5). The transfers 104, 106, and 108 may be implemented using cylinders or linear motors. However, it is not limited thereto.

The inclined separator 116 may include a straight section 116a and an inclined section 116b, and may transfer the flexible substrate 210 to the carrier substrate 200 at a predetermined angle.

The straight section 116a and the inclined section 116b may be formed integrally or may be formed by combining separate components. In addition, the inclined section 116b may be formed at a rear end portion where the carrier substrate 200 and the flexible substrate 210 are separated.

In conjunction with the carrier substrate gripping portion 102 being moved by adsorbing the carrier substrate 200, the inclined separation unit 116 moves the adsorbed flexible substrate 210 in an inclined direction, thereby bonding the The flexible substrate 210 and the carrier substrate 200 can be easily separated.

When the carrier substrate gripping portion 102 and the inclined separation portion 116 have different speeds, since the removal of the carrier substrate 200 cannot proceed properly, the carrier substrate gripping portion 102 and the inclined separation portion ( The driving speed of 116) may be synchronized with each other by a driving control unit (not shown). This means that the drive control unit (not shown) sets the moving speed of the inclined separator 116 to the transfers 104, 106, 108, or conversely, the inclined separation of the moving speeds of the transfers 104, 106, 108. It may be implemented in such a way as to fit the unit 116.

A flexible substrate transfer conveyor 132 that is connected to the inclined separator 116 and transports the flexible substrate 210 from which the carrier substrate 200 has been removed is disposed at the rear of the inclined separator 116.

The carrier substrate loading unit 112 is disposed around the flexible substrate transfer conveyor 110, and the carrier substrate 200 that has been removed from the flexible substrate 210 is loaded. In addition, the carrier substrate loading unit 112 is shown as being disposed around the flexible substrate transfer conveyor 110, but is not limited thereto, and the carrier substrate gripping member 120 for gripping the carrier substrate 200 is It can be placed within a movable range.

A shuttle 128 capable of driving up and down is disposed at a front portion of the inclined separator 116, and a pickup portion 191 is disposed at a front side of the shuttle 128. The pickup unit 191 is irradiated with a laser on a carrier substrate 200 from a laser irradiation device (not shown), and substrates 200 and 210 bonded to each other are disposed, and the bonded substrates 200 and 210 are It can be moved to the inclined separation unit 116 by the shuttle 128.

The transmittance measurement unit 114 is disposed behind the carrier substrate loading unit 112 to measure the transmittance of the carrier substrate 200.

By measuring the transmittance of the carrier substrate 200, irradiating the carrier substrate 200 before separating the carrier substrate 200 and the flexible substrate 210 from the carrier substrate removal device 20 for a flat display. It can be determined whether the energy density of the laser is normal.

The transmittance measurement unit 114 may be, for example, an under vision camera or a digital sensor for color discrimination. However, it is not limited thereto.

The under-vision camera can extract a variety of colors using the HSV (hue, saturation, value) method, and extract the color of the laser through the color extraction of the separated carrier substrate 200. Investigation can be judged.

The color sensor for color discrimination may transmit a light source through the separated carrier substrate 200 to measure transmittance using an amount of light that is returned. That is, when the laser is over-irradiated to the carrier substrate 200, soot may be generated in the carrier substrate 200, which may be measured using the digital sensor for color discrimination.

When the energy density of the laser irradiated to separate the carrier substrate 200 and the flexible substrate 210 is normal, the transmittance of the carrier substrate 200 measured by the transmittance measurement unit 114 is about 82% ( 536nm) to 87% (564nm).

In addition, when the laser is over-irradiated on the carrier substrate 200, the transmittance of the carrier substrate 200 may be about 82% or less (536 nm or less).

In addition, the carrier substrate removal apparatus 20 may further include a control unit 140 for determining whether the transmittance measured by the transmittance measurement unit 114 is normal or not and outputting the result. The control unit 140 is illustrated as being disposed on one side of the transmittance measurement unit 114, but is not limited thereto.

Whether or not the measured transmittance is normal may be determined by comparing a predetermined transmittance range with the measured transmittance, and the result may be transmitted to the laser irradiation device using wired or wireless communication.

In addition, the control unit 140 may control the energy density of the laser in conjunction with the laser irradiation device (see 30 in FIG. 2).

The carrier substrate removal apparatus 20 includes the transmittance measurement unit 114 to determine whether the flexible substrate 210 is defective due to laser over-irradiation and whether the laser irradiation apparatus (see 30 in FIG. 2) is over-irradiated. Since it is possible to discriminate, if the separated flexible substrate 210 is defective, unnecessary unnecessary processes can be omitted, and the control unit 140 controls the energy density of the laser to quickly reduce the defect rate of the display device. I can do it.

7 to 10 are views showing the operation of the carrier substrate removal apparatus according to an embodiment of the present invention step by step.

Referring to FIG. 7, the flexible substrate 210 bonded to the carrier substrate 200 is transferred in an adsorbed state along the straight section 116a of the inclined conveyor 110 for separating the flexible substrate.

When the flexible substrate 210 reaches a working position for removing the carrier substrate 200, the carrier substrate gripping part 102 is operated by the transfers 104, 106, 108, and the carrier substrate gripping part ( 102) grips the carrier substrate 200 by vacuum.

Referring to FIG. 8, in a state in which the carrier substrate gripping portion 102 on which the carrier substrate 200 is gripped operates in the same horizontal direction as the inclined conveyor 110 for separating the flexible substrate, the flexible substrate 210 Is moved on the inclined conveyor 110 for separating the flexible substrate along the inclined section 116b. Therefore, the carrier substrate 200 starts to be removed from the flexible substrate 210.

9 and 10 together, the carrier substrate 200 is completely removed from the flexible substrate 210.

Next, the carrier substrate gripping part 102 is returned to its original position after loading the carrier substrate 200 into the carrier substrate loading part 112 by transfers 104, 106, and 108, and the carrier substrate 200 The removed flexible substrate 210 is transferred to a subsequent process along the flexible substrate transfer conveyor 132.

The carrier substrate 200 loaded on the carrier substrate loading unit 112 is measured by a transmittance measuring unit 114, and the carrier substrate 200 in the laser irradiation apparatus 30 (see FIG. 2) according to the transmittance measurement result. ) It can be determined whether the laser energy density irradiated onto the phase is an appropriate level. When the transmittance of the separated carrier substrate 200 is within a normal range, the energy density of the laser of the laser irradiation device is suitable, and the flexible substrate 210 from which the carrier substrate 200 has been removed may be subjected to a subsequent process.

However, when the transmittance of the separated carrier substrate 200 is abnormal, the laser of the laser irradiation device 30 (see FIG. 2) is over-irradiated on the carrier substrate 200 to remove the flexible carrier substrate 200. It can be seen that damage has occurred on the substrate 210 and soot has occurred. Therefore, unnecessary process cost and time consuming can be prevented by disposing of the flexible substrate 210 in which a defect occurs without proceeding with the subsequent process.

In addition, the control unit 140 may determine whether the transmittance measured by the transmittance measurement unit 114 is normal or not, and output the result, or transmit the result to the laser irradiation device using wired or wireless communication. In addition, the control unit 140 may control the energy density of the laser in conjunction with the laser irradiation device (see 30 in FIG. 2).

Therefore, when an inappropriate transmittance outside the normal range is measured, the laser energy density of the laser irradiation device 30 (see FIG. 2) can be controlled in real time.

11 is a block diagram showing a display device manufacturing system 1 according to an embodiment of the present invention.

Referring to FIG. 11, the display device manufacturing system 1 includes a laser irradiation device 30 and a carrier substrate removal device 20, wherein the carrier substrate removal device 20 is a carrier substrate separation unit separating a carrier substrate (22), a transmittance measuring unit 24 for measuring the transmittance of the separated carrier substrate, and comparing the measured transmittance with a predetermined transmittance to determine whether or not the laser is overexposed, and the laser irradiation device 30 It includes a control unit 26 output to.

The laser irradiation apparatus 30 is the same as the laser irradiation apparatus 30 described above with reference to FIG. 2, and the carrier substrate removal apparatus 20 is the carrier substrate removal apparatus 20 described with reference to FIGS. 4 to 6. Since it is the same as, redundant description thereof will be omitted.

In addition, the transmittance measurement unit 24 and the control unit 26 has the same configuration as the transmittance measurement unit 114 and the control unit 140 of FIG. 4, and the carrier substrate separation unit 22 is the laser irradiation device 20, 4) refers to a configuration excluding the transmittance measuring unit 114 (see FIG. 4) and the control unit 140 (see FIG. 4).

The laser irradiation device 30 is a device for facilitating separation of a flexible substrate and a carrier substrate bonded to each other, and irradiating a laser on the carrier substrate, so that the carrier substrate in the carrier substrate separation unit 22 is the It performs the function of more easily separating from the flexible substrate.

When the laser is over-irradiated on the carrier substrate in the laser irradiation apparatus 30, damage occurs on the flexible substrate and soot is generated on the separated carrier substrate, thereby changing transmittance.

Therefore, the transmittance of the separated carrier substrate can be measured by the transmittance measurement unit 24, and the control unit 26 outputs it to the laser irradiation device 30 when the measured transmittance is not within a normal range. Alternatively, the energy density of the laser may be controlled by interlocking with the laser irradiation device 30.

Whether the energy density of the laser irradiated by the laser irradiation device 30 is suitable can be determined in real time through the transmittance measurement unit 24 and the control unit 26, so unnecessary unnecessary damage to the flexible substrate caused by laser over-irradiation Subsequent processes can be prevented and process costs and process times can be improved.

12 is a flowchart illustrating a method of manufacturing a display device using a laser irradiation device and a carrier substrate removal device according to an embodiment of the present invention.

 Referring to FIGS. 11 and 12 together, a method of manufacturing a display device according to an exemplary embodiment of the present invention comprises: irradiating a laser on a carrier substrate to which a flexible substrate is bonded in a laser irradiation device 30 (S1), a carrier Separating the carrier substrate from the flexible substrate in the substrate removing apparatus 20 (S2), measuring the transmittance of the separated carrier substrate in the transmittance measuring unit 24 (S3), and according to the measurement result And controlling the energy density of the irradiated laser (S4).

The laser density irradiated from the laser irradiation device 30 can be determined whether it is suitable through measurement results of the transmittance measurement unit 24 and the control unit 26.

As described above, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1: Display manufacturing system 10: Flexible electronic device
20: carrier substrate removal device 22: carrier substrate separation unit
24: transmittance measurement unit 26: control unit
30: laser irradiation device 102: carrier substrate gripping portion
104: X-axis transfer 106: Y-axis transfer
108: Z-axis transfer 110: Conveyor
112: carrier substrate loading section 113: adsorption nozzle
114: transmittance measurement unit 116b: inclined section
116: inclined separation unit 116a: straight section
118: ionizer 120: carrier substrate gripping member
122: body portion 124: nozzle bracket
126: adsorption nozzle 128: shuttle
132: flexible substrate transfer conveyor 140: control unit
191: pickup unit 200: carrier substrate
210: flexible substrate 212: thin film transistor array
214: display layer 216: sealing layer

Claims (10)

A laser irradiation apparatus for irradiating a laser to the carrier substrate to separate the flexible substrate from the flexible substrate and the carrier substrate bonded to each other;
A carrier substrate gripping part for gripping a carrier substrate separated from the flexible substrate;
An inclined separating part separating the flexible substrate and the carrier substrate together with the carrier substrate gripping portion while transferring the flexible substrate at a predetermined angle;
A carrier substrate loading unit for loading the separated carrier substrate;
A transmittance measurement unit disposed on one side of the carrier substrate loading portion and disposed under the separated carrier substrate moving toward the transmittance measuring portion from the carrier substrate loading portion to measure transmittance of the separated carrier substrate; And
Includes a control unit for determining whether the laser is over-irradiated using the measured transmittance;
When the transmittance of the carrier substrate is lower than a predetermined transmittance range, the control unit reduces the energy density of the laser of the laser irradiation apparatus in the state where the flexible substrate and the carrier substrate are bonded to irradiate the carrier substrate. Characterized in that, the display device manufacturing system. According to claim 1,
The transmittance measurement unit,
A display manufacturing system comprising an under vision camera or a digital sensor for color discrimination. According to claim 1,
The preset transmittance range is 82% to 87%. According to claim 1,
The control unit,
To compare the transmittance measured by the transmittance measurement unit and the preset transmittance range to determine whether the carrier substrate is normal, to output the result, and to separate the carrier substrate and the flexible substrate bonded to each other, the carrier And transmitting the results to a laser irradiation device that irradiates a laser on a substrate using wired or wireless communication. According to claim 1,
The carrier substrate gripping portion,
A carrier substrate gripping member for adsorbing and gripping the carrier substrate; And
A transfer member connected to the carrier substrate gripping member and moving the carrier substrate gripping member;
Display device manufacturing system comprising a. The method of claim 5,
The transfer,
An x-axis transfer moving the carrier substrate gripping member on an x-axis;
A y-axis transfer moving the carrier substrate gripping member in a y-axis; And
A z-axis transfer moving the carrier substrate gripping member in a z-axis;
Display device manufacturing system comprising a. According to claim 1,
An ionizer which is disposed on both sides of the inclined separation unit and sprays a static electricity generation preventing fluid to both of the carrier substrate and the flexible substrate;
Display device manufacturing system further comprising a. Irradiating the laser onto the carrier substrate to which the flexible substrate is bonded in the laser irradiation apparatus;
Gripping the carrier substrate separated from the flexible substrate;
Separating the flexible substrate and the carrier substrate while transferring the flexible substrate;
Loading the separated carrier substrate on a carrier substrate loading part; And
Transmittance of the separated carrier substrate is measured through a transmittance measuring unit with the transmittance measuring unit disposed on one side of the carrier substrate loading unit and disposed under the separated carrier substrate moving toward the transmittance measuring unit from the carrier substrate loading unit. Step; includes,
When the transmittance measured by the transmittance measurement unit is lower than a preset transmittance range, the energy density of the laser irradiated on the carrier substrate is reduced by irradiating the laser in the state where the flexible substrate and the carrier substrate are bonded. Display device manufacturing method. The method of claim 8,
The predetermined transmittance range is 82% to 87% of the display device manufacturing method. The method of claim 8,
The carrier substrate includes glass,
The flexible substrate is kapton, polyethersulphone (PES), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) ), Polyacrylate (PAR), and fiber reinforced plastic (fiber reinforced plastic: FRP), the display device manufacturing method characterized in that it comprises a material selected from the group consisting of.

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